Comparing Toshiba TC58NVG1S3E with Macronix MX30LF2G28AB

APPLICATION NOTE
Comparing Toshiba® TC58NVG1S3E with MX30LF2G28AB
1. Introduction
This application note is a guide for migrating to the Macronix MX30LF2G28AB from the Toshiba®
TC58NVG1S3E 2Gb, 3V, NAND flash memory.
The document does not provide detailed information on the individual devices, but highlights the
major similarities and differences between them. The comparison covers the general features,
performance, command codes and other differences.
The information in this document is based on datasheets listed in Section 10. Newer versions of the
datasheets may override the contents of this document.
2. Features
Both flash device families have similar features and functions as shown in Table 2-1.
Table 2-1: Feature Comparison
Feature
Macronix MX30LF2G28AB
Vcc voltage range
2.7V ~ 3.6V
Bus Width
x8
Operating Temperature
-40°C ~ 85°C
Interface
ONFI 1.0 Standard
Block Size
128KB+7KB
Page Size
2KB+112B
ECC Requirement
8b/540B
OTP size
30 pages
Guaranteed Good blocks at
Block 0
shipping
Unique ID
ONFI standard
ID Code
C2h/DAh/90h/95h/07h
ONFI signature
4Fh/4Eh/46h/49h
Data Retention
10 Years
48-TSOP (12x20mm)
Package
63-VFBGA (9x11mm)
Toshiba TC58NVG1S3E
2.7V ~ 3.6V
x8
-40°C ~ 85°C *1
Toggle Mode NAND
128KB+4KB
2KB+64B
1b/528B
Block 0
98h/DAh/00h/11h/04h
Not Specified
48-TSOP (12x20mm)
63-VFBGA (9x11mm)
Note: 1. Operating temperature range of TC58NVG1S3ETA00 (48-TSOP) is 0°C ~ 70°C.
P/N: AN0310
1
Ver.1, Jun. 11, 2014
APPLICATION NOTE
Comparing Toshiba® TC58NVG1S3E with MX30LF2G28AB
3. Performance
Table 3-1 and Table 3-2 show MX30LF2G28AB and TC58NVG1S3E Read/Write performance.
Table 3-1: Read Function Performance (Read Latency time and Sequential Read)
Read function
Macronix MX30LF2G28AB
Toshiba TC58NVG1S3E
Read Latency time (tR)
25us (max.)
25us (max.)
Sequential Read time (tRC)
20ns (min.)
25ns (min.)
Table 3-2: Write Function Performance (Program and Erase)
Write Function
Macronix MX30LF2G28AB
Page Program time (tPROG)
300us (typ.)/600us (max.)
Block Erase time (tERASE)
1ms (typ.)/3.5ms (max.)
NOP
4 (max.)
1
Write/Erase Cycles* (Endurance)
100,000
Toshiba TC58NVG1S3E
300us (typ.)/700us (max.)
2.5ms (typ.)/10ms (max.)
4 (max.)
Not Specified
Note: 100K Endurance cycle with ECC protection.
4. DC Characteristics
Read/Write power requirements (Table 4-1) and I/O voltage limits (Table 4-2) are similar.
Table 4-1: Read / Write Current
DC Characteristic
Sequential Read Current (ICC1)
Program Current (ICC2)
Erase Current (ICC3)
Standby Current – CMOS
Macronix MX30LF2G28AB
20mA (typ.)/30mA (max.)
20mA (typ.)/30mA (max.)
15mA (typ.)/30mA (max.)
10uA (typ.)/50uA (max.)
Toshiba TC58NVG1S3E
30mA (max.)
30mA (max.)
30mA (max.)
50uA (max.)
Table 4-2: Input / Output Voltage
DC Characteristic
Macronix MX30LF2G28AB
Input Low Voltage (VIL)
-0.3V (min.) / 0.2VCC (max.)
Input High Voltage (VIH)
0.8VCC (min.) / VCC+0.3V (max.)
Output Low Voltage (VOL)
0.2V (max.)
Output High Voltage (VOH)
VCC-0.2V (min.)
P/N: AN0310
2
Toshiba TC58NVG1S3E
-0.3V (min.) / 0.2Vcc (max.)
0.8Vcc (min.) / Vcc+0.3V (max.)
0.2V (max.)
Vcc-0.2V (min.)
Ver. 1, Jun. 11, 2014
APPLICATION NOTE
Comparing Toshiba® TC58NVG1S3E with MX30LF2G28AB
5. Package Pin/Ball Definition
Package physical dimensions are similar to each other. For detailed information, please refer to the
individual datasheets. Tables 5-1 and 5-2 show differences in pin assignments between the
Macronix and Toshiba® devices. TC58NVG1S3E can be compared by the MX30LF2G28AB without
pin conflicts. Only 48-TSOP pin #38 (ball G5 on VFBGA) may need special attention because the
pin is designated “DNU” (Do Not Use) on the MX30LF2G28AB-TI. A DNU pin should not be
connected to any signal or power trace on the board.
Figure 5-1: 48-TSOP (12x20mm) Package and Pin Layout Comparison
NC
NC
NC
NC
NC
NC
R/B#
RE#
CE#
NC
NC
VCC
VSS
NC
NC
CLE
ALE
WE#
WP#
NC
NC
NC
NC
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
MX30LF2G28AB
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
VSS*1
NC
NC
NC
IO7
IO6
IO5
IO4
NC
VCC*1
DNU
VCC
VSS
NC
VCC*1
NC
IO3
IO2
IO1
IO0
NC
NC
NC
VSS*1
NC
NC
NC
NC
NC
NC
R/B#
RE#
CE#
NC
NC
VCC
VSS
NC
NC
CLE
ALE
WE#
WP#
NC
NC
NC
NC
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
TC58NVG1S3E
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
Pin38: DNU (Do Not Use)
Note:
1. These pins might not be connected internally. However it is
recommended to connect these pins to power(or ground) as designated
for ONFI compatibility.
Table 5-1: 48-TSOP Package Pin Definition
Brand
Macronix
Toshiba
MX30LF2
MX30LF2G28AB
8AB-TI
TC58NVG1S3ETAI0
pin #25
VSS*
NC
pin #34
#34
VCC*
#38
pin #3
8
DNU*
#39
pin #3
9
VCC*
#48
pin #4
8
VSS*
Part Name
1
1
NC
2
NC
1
NC
1
NC
Notes:
1.
May not be connect internally (designated for ONFI compatibility).
2.
DNU (Do Not Use) pin should be kept floating
(DNU pin should not be connected to any signal or power trace on the board).
P/N: AN0310
3
Ver. 1, Jun. 11, 2014
NC
NC
NC
NC
I/O7
I/O6
I/O5
I/O4
NC
NC
NC
VCC
VSS
NC
NC
NC
I/O3
I/O2
I/O1
IO0
NC
NC
NC
NC
APPLICATION NOTE
Comparing Toshiba® TC58NVG1S3E with MX30LF2G28AB
Figure 5-2: 63-VFBGA (9x11mm) Package and Pin Layout Comparison
MX30LF2G28AB
1
2
3
A
NC
NC
B
NC
4
5
6
7
TC58NVG1S3E
8
9
10
NC
NC
NC
NC
1
2
A
NC
NC
B
NC
3
4
5
6
7
8
C
WP#
ALE
VSS
CE#
WE#
R/B#
C
WP#
ALE
VSS
CE#
WE#
R/B#
D
VCC*
1
RE#
CLE
NC
NC
NC
D
NC
RE#
CLE
NC
NC
NC
E
NC
NC
NC
NC
NC
NC
E
NC
NC
NC
NC
NC
NC
NC
F
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
VSS*
1
G
DNU
VCC*
1
DNU
NC
NC
NC
G
NC
NC
NC
NC
NC
NC
H
NC
IO0
NC
NC
NC
VCC
H
NC
I/O0
NC
NC
NC
Vcc
J
NC
IO1
NC
VCC
IO5
IO7
J
NC
I/O1
NC
Vcc
I/O5
I/O7
K
VSS
IO2
IO3
IO4
IO6
VSS
K
Vss
I/O2
I/O3
I/O4
I/O6
Vss
F
9
10
NC
NC
NC
NC
L
NC
NC
NC
NC
L
NC
NC
NC
NC
M
NC
NC
NC
NC
M
NC
NC
NC
NC
G5: DNU
Note:
1. These pins should be connected to power supply or ground (as designated)
following the ONFI specification, however they might not be bonded internally
Table 5-2: 63-VFBGA Package Ball Definition
Brand
Macronix
Toshiba
MX30LF2
MX30LF2G28ABG28AB-XKI
XKI
TC58NVG1S3EBAI4
ball D3
VCC*
1
NC
ball F7
VSS*
1
NC
ball G4
VCC*
ball G5
DNU*
Part Name
1
2
NC
NC
Notes:
1. May not be connect internally (designated for ONFI compatibility).
2. DNU (Do Not Use) pin should be kept floating
(DNU pin should not be connected to any signal or power trace on the board).
P/N: AN0310
4
Ver. 1, Jun. 11, 2014
APPLICATION NOTE
Comparing Toshiba® TC58NVG1S3E with MX30LF2G28AB
6. Command Set
Basic command sets, status checking methods, and Read and Write operation commands are
similar, but the devices have different command sequences when accessing the Cache Read
function and Two Plane Block Erase.
Table 6-1: Command Table
Macronix MX30LF2G28AB
Command
Random Data Input
Serial Data Input
Random Data Output
Read Mode
Copy Back Read
Cache Read Begin
Cache Read End
Read ID
Reset
Page Program
Cache Program
Copy Back Cache Program
Copy Back Cache Program End
Block Erase
Read Status
Read Status for 2 Plane ERS/PGM
Read Parameter Page (ONFI)
Unique ID Read (ONFI)
Set Feature (ONFI)
Get Feature (ONFI)
Status Enhance Read (ONFI)
1st Cycle
85h
2nd Cycle
-
-
-
05h
00h
00h
3Fh
90h
FFh
80h
80h
60h
70h
ECh
EDh
EFh
EEh
78h
E0h
30h
31h
10h
15h
D0h
-
Toshiba
TC58NVG1S3E
1st Cycle
2nd Cycle
85h
80h
05h
00h
00h
31h
3Fh
90h
FFh
80h
80h
8Ch
8Ch
60h
70h
71h
-
E0h
30h
3Ah
10h
15h
15h
10h
D0h
-
Table 6-2: Two-Plane Command Table
Command
2 Plane Program
2 Plane Cache Program
2 Plane Copy Back Prgm
2 Plane Block Erase
P/N: AN0310
Macronix MX30LF2G28AB
1st
2nd
3rd
4th
Cycle
Cycle
Cycle
Cycle
80h
11h
80h
10h
80h
11h
80h
15h
60h
D1h
60h
D0h
5
1st
Cycle
80h
80h
85h
60h
Toshiba TC58NVG1S3E
2nd
3rd
4th
Cycle
Cycle
Cycle
11h
81h
10h
11h
81h
15h
11h
80h
10h
60h
D0h
-
Ver. 1, Jun. 11, 2014
APPLICATION NOTE
Comparing Toshiba® TC58NVG1S3E with MX30LF2G28AB
6-1 Status Register
When a flash Read/Program/Erase operation is in progress, either the “Ready/Busy# Pin Checking”
or “Status Output Checking” method may be used to monitor the operation. Both are standard
NAND flash algorithms and can be used for both device families. Table 6-2 shows that Status output
content provided by the Read Status command (70h) is compatible. Table 6-3 shows that Two Plane
Operation Status output provided by the Enhance Read Status command (78h/71h) shows different
content for Two-Plane operations.
Table 6-2: Status Output
Status Output
Macronix MX30LF2G28AB
SR[0]
SR[1]
SR[2]
SR[3]
SR[4]
SR[5]
SR[6]
SR[7]
Chip PGM/ERS/READ status: Pass/Fail
Cache Program status: Pass/Fail
Reserved
Reserved
Reserved
PGM/ERS/Read internal controller:
Ready/Busy
PGM/ERS/Read status: Ready/Busy
Write Protect
Table 6-3: Two Plane Operation Status Output
Status Output
Macronix MX30LF2G28AB
SR[0]
SR[1]
SR[2]
SR[3]
SR[4]
SR[5]
SR[6]
SR[7]
P/N: AN0310
Selected Plane PGM/ERS/READ status:
Pass/Fail
Cache Program status: Pass/Fail
Reserved
Reserved
Reserved
PGM/ERS/Read internal controller:
Ready/Busy
PGM/ERS/Read status: Ready/Busy
Write Protect
6
Toshiba TC58NVG1S3E
Chip PGM/ERS status: Pass/Fail
Cache Program status: Pass/Fail
Reserved
Reserved
Reserved
PGM/ERS/Read internal controller:
Ready/Busy
PGM/ERS/Read status: Ready/Busy
Write Protect
Toshiba TC58NVG1S3E
Chip PGM/ERS status: Pass/Fail
Plane 0 status 1: Pass/Fail
Plane 1 status 1: Pass/Fail
Plane 0 status 2: Pass/Fail
Plane 1 status 2: Pass/Fail
PGM/ERS/Read internal controller:
Ready/Busy
PGM/ERS/Read status: Ready/Busy
Write Protect
Ver. 1, Jun. 11, 2014
APPLICATION NOTE
Comparing Toshiba® TC58NVG1S3E with MX30LF2G28AB
7. Device Identification
The ID of the Macronix MX30LF2G28AB begins with a one-byte Manufacturer Code followed by a
four-byte Device ID. While the same command set is used to read the Manufacturer ID, Device ID,
and flash structure, the IDs are different, allowing software to identify the device manufacturer and
device type (Table 7-1).
Table 7-1: Manufacturer and Device IDs
ID code
Value
1st Byte
2nd Byte
bit 1- 0
bit 3 - 2
3rd
Byte
bit 5 - 4
bit 6
4th
Byte
th
5
Byte
bit 7
bit 1- 0
bit 2
bit 7, 3
bit 5 - 4
bit 6
bit 1- 0
bit 3 - 2
bit 6 - 4
bit 7
P/N: AN0310
Macronix MX30LF2G28AB
Toshiba TC58NVG1S3E
C2h/DAh/90h/95h/07h
98h/DAh/00h/11h/04h
Manufacturer Code
Device Identifier
Number of Die per Chip Enable
Cell Structure
Number of Simultaneously
Programmed Pages
Interleaved Programming
Between Multiple Chips
Cache Program
Page Size (exclude Spare Area)
Size of Spare Area (Byte per 512Byte)
Sequential Read Cycle Time (tRC)
Block Size (exclude Spare Area)
Organization
Manufacturer Code
Device Identifier
Number of Die per Chip Enable
Cell Structure
Reserved
Reserved
ECC Level Requirement
Reserved
Page Size (exclude Spare Area)
Reserved
Reserved
Block Size (exclude Spare Area)
Reserved
Reserved
Number of Plane per CE
Plane Size
Reserved
Number of Plane per CE
Reserved
Reserved
7
Ver. 1, Jun. 11, 2014
APPLICATION NOTE
Comparing Toshiba® TC58NVG1S3E with MX30LF2G28AB
8. Power-Up Timing
Macronix and Toshiba® power-up sequences are similar, but the timing is slightly different. Although
both devices use 2.7V (VCC min.) as the start point, measurement items are different. Check the
system timing to determine if adjustments are needed.
Table 8-1: Power-Up Timing
H/W Timing Characteristic
Vcc (min.) to WE# low
Vcc (min.) to R/B# high
Vcc (min.) to R/B# low
Macronix MX30LF2G28AB
1ms (max.)
N/A
10us (max.)
Toshiba TC58NVG1S3E
N/A
1ms (max.)
100us (max.)
Vcc(min.)
VCC
WE#
R/B#
Figure 8-1: Power-Up Timing
P/N: AN0310
8
Ver. 1, Jun. 11, 2014
APPLICATION NOTE
Comparing Toshiba® TC58NVG1S3E with MX30LF2G28AB
9. Summary
Macronix MX30LF2G28AB and Toshiba® TC58NVG1S3E NAND have similar features and pinouts.
While basic Read/Program/Erase commands are similar, more advanced features such as cache
access are implemented slightly differently. The TC58NVG1S3E only requires 1-bit ECC and the
MX30LF2G28AB requires 8-bit ECC. The firmware will need to be modified from 1-bit ECC to 8-bit
ECC as required by the MX30LF2G28AB. Otherwise, device migration may require minimal or no
additional firmware modifications other than ECC support.
10. Reference
Table 10-1 shows the datasheet versions used for comparison in this application note.
For the most current, detailed Macronix specification, please refer to the Macronix
Website at http://www.macronix.com
Table 10-1: Datasheet Version
Datasheet
Location
Date Issue
Revision
Website
Website
Website
Website
Jun. 3, 2014
Sep. 1, 2012
Sep. 1, 2012
Sep. 1, 2012
Rev. 1.1
Rev. 1.09
Rev. 1.09
Rev. 1.1
MX30LF2G28AB
TC58NVG1S3ETAI0
TC58NVG1S3ETA00
TC58NVG1S3EBAI4
Note: Macronix data sheet is subject to change without notice.
11. Appendix
Cross Reference Table 11-1 shows basic part number and package information for the Macronix
MX30LF4G28AB and Toshiba® TC58NVG1S3E product families.
Table 11-1: Part Number Cross Reference
Density Macronix Part No.
Toshiba Part No.
MX30LF2G28AB-TI
TC58NVG1S3ETAI0
2Gb
MX30LF2G28AB-TI
TC58NVG1S3ETA00
MX30LF2G28AB-XKI
TC58NVG1S3EBAI4
Package
48-TSOP
48-TSOP
63-VFBGA
Dimension
12x20mm
12x20mm
9x11x1.0mm
12. Revision History
Revision
1.0
P/N: AN0310
Description
Initial Release
9
Date
Jun. 11, 2014
Ver. 1, Jun. 11, 2014
APPLICATION NOTE
Comparing Toshiba® TC58NVG1S3E with MX30LF2G28AB
Except for customized products which have been expressly identified in the applicable agreement,
Macronix's products are designed, developed, and/or manufactured for ordinary business, industrial,
personal, and/or household applications only, and not for use in any applications which may, directly or
indirectly, cause death, personal injury, or severe property damages. In the event Macronix products are
used in contradicted to their target usage above, the buyer shall take any and all actions to ensure said
Macronix's product qualified for its actual use in accordance with the applicable laws and regulations; and
Macronix as well as it’s suppliers and/or distributors shall be released from any and all liability arisen
therefrom.
Copyright© Macronix International Co., Ltd. 2014. All rights reserved, including the trademarks and
tradename thereof, such as Macronix, MXIC, MXIC Logo, MX Logo, Integrated Solutions Provider, NBit, Nbit,
NBiit, Macronix NBit, eLiteFlash, HybridNVM, HybridFlash, XtraROM, Phines, KH Logo, BE-SONOS, KSMC,
Kingtech, MXSMIO, Macronix vEE, Macronix MAP, Rich Au-dio, Rich Book, Rich TV, and FitCAM. The
names and brands of third party referred thereto (if any) are for identification purposes only.
For the contact and order information, please visit Macronix’s Web site at: http://www.macronix.com
P/N: AN0310
10
Ver. 1, Jun. 11, 2014
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