Comparing Spansion S29AL008J with Macronix MX29LV800C

APPLICATION NOTE
Comparing Spansion® S29AL008J with Macronix MX29LV800C
1. Introduction
Macronix MX29LV800C and Spansion® S29AL008J 8Mb 3.0V parallel flash have similar
features, performance, and command codes. This application note explains how to simply
and easily compare the Spansion® device with the equivalent Macronix MX29LV800C flash.
The information in this document is based on datasheets listed in Section 10.
Newer versions of the datasheets may override the contents of this document.
2. General Features
Both flash devices have similar features and functions as shown in Table 2-1.
Table 2-1: Features
Type / Function
VCC Voltage Range
Access Time
Bus Width
Boot Block
Sector Architecture
OTP Security Region
CFI Compliant
Sector Protect/Unprotect
Temp Sector Protect/Unprotect
Erase Suspend/Resume
Hardware Reset# Pin
WP# Pin
Manufacture ID
Device ID Top/Bottom
Notes:
MX29LV800C
2.7V ~ 3.6V
55ns*1/70ns
X8 / x16
Top/Bottom
S29AL008J
2.7V ~ 3.6V
55ns*1/70ns
X8 / x16
Top/Bottom
16KB+ 2*8KB+32KB
+ 15*64KB sectors.
16KB+ 2*8KB+32KB
+ 15*64KB sectors.
Yes
Yes
Yes
Yes
Yes
C2h
256Byte
Yes
Yes
Yes
Yes
Yes
Yes
01h
22DAh/225Bh
22DAh/225Bh
1. Restricted Vcc Voltage Range, Vcc = 3.0V ~ 3.6V.
P/N: AN0222
1
Ver:1 Mar. 21, 2013
APPLICATION NOTE
Comparing Spansion® S29AL008J with Macronix MX29LV800C
3. Package and Pinout
Current package offerings are shown in Table 3-1.
Table 3-1: Package Options
Package
MX29LV800C
Yes
Yes
Yes
Yes*1
Yes*1
Yes
Yes
44-SOP
48-TSOP (12x20mm) Normal
48-CSP TFBGA(6x8x1.2mm) 0.3mm ball
48-TFBGA (6x8x1.2mm) 0.4mm ball
48-LFBGA (6x8x1.3mm) 0.4mm ball
48-XFLGA (4 x 6 x 0.5mm) 0.3mm ball
48-WFBGA (4 x 6 x 0.75mm) 0.3mm ball
S29AL008J
Yes
Yes*1
Yes*1
-
Notes: 1. Spansion Package body thickness = 0.75mm while Macronix TFBGA= 1.2mm and LFBGA=1.3mm.
The Macronix and Spansion® flash have virtually identical footprints and pinouts. The 48-TSOP
and 48-LFBGA packages are shown below for comparison. The only significant difference being
the Spansion devices have a hardware WP# input (pin #14 of the 48-TSOP package and pin B3 of
the 48-BGA package) to protect the boot sector. These same pins are NC on the Macronix devices.
This difference will be transparent if the WP# pin is left unconnected or pulled high.
Figure 3-1: 48-TSOP (12x20mm) Package Pin-out Comparison
A15
A14
A13
A12
A11
A10
A9
A8
NC
NC
WE#
RESET#
NC
NC
RY/BY#
A18
A17
A7
A6
A5
A4
A3
A2
A1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
MX29LV800
48
47
46
45
44
43
43
42
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
A16
BYTE#
GND
Q15/A-1
Q7
Q14
Q6
Q13
Q5
Q12
Q4
VCC
Q11
Q3
Q10
Q2
Q9
Q1
Q8
Q0
OE#
GND
CE#
A0
A15
A14
A13
A12
A11
A10
A9
A8
NC
NC
WE#
RESET#
NC
WP#
RY/BY#
A18
A17
A7
A6
A5
A4
A3
A2
A1
Note: Pin 14= NC
P/N: AN0222
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
S29AL008
48
47
46
45
44
43
43
42
42
41
40
39
38
37
36
35
34
33
32
31
30
29
27
28
26
25
A16
BYTE#
VSS
DQ15/A-1
DQ7
DQ14
DQ6
DQ13
DQ5
DQ12
DQ4
VCC
DQ11
DQ3
DQ10
DQ2
DQ9
DQ1
DQ8
DQ0
OE#
VSS
CE#
A0
Note: Spansion pin 14= WP#
2
Ver:1 Mar. 21, 2013
APPLICATION NOTE
Comparing Spansion® S29AL008J with Macronix MX29LV800C
Figure 3-2: 48-LFBGA (6x8mm) Package Pin-out Comparison
MX29LV800
S29AL008
6
A13
A12
A14
A15
A16
BYTE
#
Q15/
A-1
GND
6
A13
A12
A14
A15
A16
BYTE
#
DQ15
/A-1
VSS
5
A9
A8
A10
A11
Q7
Q14
Q13
Q6
5
A9
A8
A10
A11
DQ7
DQ14
DQ13
DQ6
4
WE#
RESET#
NC
NC
Q5
Q12
VCC
Q4
4
WE#
RESET#
NC
NC
DQ5
DQ12
VCC
DQ4
3
RY/
BY#
NC
A18
NC
Q2
Q10
Q11
Q3
3
RY/
BY#
WP#
A18
NC
DQ2
DQ10
DQ11
DQ3
2
A7
A17
A6
A5
Q0
Q8
Q9
Q1
2
A7
A17
A6
A5
DQ0
DQ8
DQ9
DQ1
1
A3
A4
A2
A1
A0
CE#
OE#
GND
1
A3
A4
A2
A1
A0
CE#
OE#
VSS
A
B
C
D
Note: Macronix pin B3= NC
E
F
G
H
A
B
C
D
Note: Spansion pin B3= WP#
E
F
G
H
P/N: AN0222
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Ver:1 Mar. 21, 2013
APPLICATION NOTE
Comparing Spansion® S29AL008J with Macronix MX29LV800C
4. Command Set and Firmware
Basic commands and write status checking methods are the same. The Read operation and Write
command could be used directly without any modification. Table 4-1 shows the command set in
Word mode.
Table 4-1: Basic Commands (Word Mode)
Command
st
1 Bus
Cycle
Read
Reset
Program
Chip
Erase
Sector
Erase
Program/Erase
Suspend
Program/Erase
Resume
Addr
Addr
XXX
555h
555h
555h
XXX
XXX
Data
Data
F0h
AAh
AAh
AAh
B0h
30h
2 Bus
Cycle
Addr
2AAh
2AAh
2AAh
Data
55h
55h
55h
3rd Bus
Cycle
Addr
555h
555h
555h
Data
A0h
80h
80h
Addr
Addr
555h
555h
Data
Data
AAh
AAh
Addr
2AAh
2AAh
Data
55h
55h
Addr
555h
SA
10h
30h
nd
th
4 Bus
Cycle
th
5 Bus
Cycle
th
6 Bus
Cycle
Data
Note: SA: Sector Address
P/N: AN0222
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Ver:1 Mar. 21, 2013
APPLICATION NOTE
Comparing Spansion® S29AL008J with Macronix MX29LV800C
5. Electrical Characteristics
Both device families have similar power requirements during Program and Erase.
Table 5-1: Read / Write Current
DC Characteristic
Condition
typ @ 5MHz
Read Current
max @ 5MHz
typ
Standby Current
max
typ
Write Current
max
MX29LV800C
7mA
12mA
0.2uA
5uA
15mA
30mA
S29AL008J
7mA
12mA
0.2uA
5uA
20mA
30mA
Table 5-2 shows that both flash devices have similar input and output characteristics.
Table 5-2: Input / Output Voltage
DC Characteristic
Condition
MX29LV800C
S29AL008J
min
-0.5V
-0.1V
max
0.8V
0.8V
min
0.7VCC
0.7VCC
max
VCC+0.3V
VCC+0.3V
Output Low Voltage
max
0.45V
0.45V
Output High Voltage
min
0.85VCC
0.85VCC
11.5V ~ 12.5V
8.5V ~ 12.5V
Input Low Voltage
Input High Voltage
VHV Temporary Sector Unprotect Range
P/N: AN0222
5
Ver:1 Mar. 21, 2013
APPLICATION NOTE
Comparing Spansion® S29AL008J with Macronix MX29LV800C
6. Erase and Programming Performance
Table 6-1 and 6-2 show MX29LV800C and S29AL008J have similar Read/Write performance.
Table 6-1: AC Characteristics
Symbol
Taa
Tce
Tcp
Description
Random Read
Access Time
VCC =3.0-3.6V
VCC= 2.7-3.6V
MX29LV800C
55ns
70ns
Valid data
output after
CE# low
VCC =3.0-3.6V
55ns
-
VCC= 2.7-3.6V
70ns
70ns
VCC =2.7-3.6V
35ns
35ns
Chip Enable Pulse
Width
S29AL008J
70ns
Note: Values provided in Table 6-1 are “maximum” values.
Table 6-2: Write Function Performance (Program and Erase)
Write Function
MX29LV800C
Byte Program Time
9us
Word Program Time
11us
Accelerated Byte/Word Programming Time
Chip Program Time Byte Mode
Chip Program Time Word Mode
Sector Erase time
Chip Erase time
S29AL008J
6us
6us
7us
-
9s
5.8s
0.7s
8s
6.3s
3.2s
0.5s
10s
Note: Values provided in Table 6-2 are “typical” values.
P/N: AN0222
6
Ver:1 Mar. 21, 2013
APPLICATION NOTE
Comparing Spansion® S29AL008J with Macronix MX29LV800C
7. Memory Organization
The memory and sector architecture of the MX29LV800C is identical to the S29AL008J, as seen in
Features Table 2-1.
8. Manufacturer ID & Device ID Command
Manufacturer IDs are different and permits software to identify the device manufacturer, but Device
IDs are the same. The same command set is used to read the different Manufacturer IDs.
Table 8-1: Manufacturer and Device ID Command Definitions (Word Mode)
Manufacturer ID
Flash Vender
st
1 Bus Cycle
(command)
2nd Bus Cycle
(command)
3rd Bus Cycle
(command)
4th Bus Cycle
(ID output)
Address
Data
Address
Data
Address
Data
Address
Data
Device ID
MX29LV800C
S29AL008J
MX29LV800C
S29AL008J
555h
AAh
2AAh
55h
555h
90h
X00h
C2h
555h
AAh
2AAh
55h
555h
90h
X00h
01h
555h
AAh
2AAh
55h
555h
90h
X01h
22DAh/225Bh
555h
AAh
2AAh
55h
555h
90h
X01h
22DAh/225Bh
Note.
(1) Device ID can be read out after Manufacturer ID with proper address and does not need another command
sequence.
(2) Use Reset command (F0h) to return to normal read mode.
P/N: AN0222
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Ver:1 Mar. 21, 2013
APPLICATION NOTE
Comparing Spansion® S29AL008J with Macronix MX29LV800C
9. Part Number Cross-Reference
Cross Reference Table 9-1 shows basic part number and package information for the Macronix
MX29LV800C and Spansion products.
Table 9-1: Part Number Cross Reference
Density
Macronix Part*1
Spansion® Part
*1
8Mb
MX29LV800CTXGI-70G
MX29LV800CBXGI-70G*1
MX29LV800CTXGI-70G*1
MX29LV800CBXGI-70G*1
MX29LV800CTXGI-55Q*1
MX29LV800CBXGI-55Q*1
MX29LV800CTXEI-70G*1
MX29LV800CBXEI-70G*1
MX29LV800CTXEI-70G*1
MX29LV800CBXEI-70G*1
MX29LV800CTXEI-55Q*1
MX29LV800CBXEI-55Q*1
MX29LV800CTTI-70G
MX29LV800CBTI-70G
MX29LV800CTTI-70G
MX29LV800CBTI-70G
MX29LV800CTTI-55Q
MX29LV800CBTI-55Q
S29AL008J70BFI01
S29AL008J70BFI02
S29AL008J70BFI03
S29AL008J70BFI04
S29AL008J55BFIR1
S29AL008J55BFIR2
S29AL008J70BFI01
S29AL008J70BFI02
S29AL008J70BFI03
S29AL008J70BFI04
S29AL008J55BFIR1
S29AL008J55BFIR2
S29AL008J70TFI01
S29AL008J70TFI02
S29AL008J70TFI03
S29AL008J70TFI04
S29AL008J55TFIR1
S29AL008J55TFIR2
Package
Dimension
48-TFBGA*1
6x8x1.2mm
0.4mm ball
48-LFBGA*1
6x8x1.3mm
0.4mm ball
48-TSOP
12x20mm
Notes: 1. Spansion Package body thickness = 0.75mm while Macronix TFBGA= 1.2mm and LFBGA=1.3mm.
10. Reference Documents
Table 10-1 shows the datasheet versions used for comparison in this application note. For the
most current, detailed Macronix specification, please refer to the Macronix Website at
http://www.macronix.com
Table 10-1: Datasheet Version
Data sheet
Location
Date Issue
Revision
MX29LV800C
S29AL008J_00
Website
Website
Dec. 22, 2011
Apr. 12, 2012
Rev. 2.6
Rev. 11
P/N: AN0222
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Ver:1 Mar. 21, 2013
APPLICATION NOTE
Comparing Spansion® S29AL008J with Macronix MX29LV800C
11. Summary
Macronix MX29LV800C and Spansion S29AL008J 8Mb parallel Flash occupy the same PCB
footprint and have similar commands, functions, and features. Macronix does not support the WP#
pin function and does not contain a Secured Silicon Sector.
12. Revision History
Table 12-1: Revision History
Revision No.
REV. 1
P/N: AN0222
Description
Page
Initial Release
ALL
9
Date
Jan. 15, 2013
Ver:1 Mar. 21, 2013
APPLICATION NOTE
Comparing Spansion® S29AL008J with Macronix MX29LV800C
Except for customized products which have been expressly identified in the applicable agreement,
Macronix's products are designed, developed, and/or manufactured for ordinary business, industrial,
personal, and/or household applications only, and not for use in any applications which may, directly
or indirectly, cause death, personal injury, or severe property damages. In the event Macronix
products are used in contradicted to their target usage above, the buyer shall take any and all actions
to ensure said Macronix's product qualified for its actual use in accordance with the applicable laws
and regulations; and Macronix as well as it’s suppliers and/or distributors shall be released from any
and all liability arisen therefrom.
Copyright© Macronix International Co., Ltd. 2013. All rights reserved, including the trademarks and
tradename thereof, such as Macronix, MXIC, MXIC Logo, MX Logo, Integrated Solutions Provider,
NBit, Nbit, NBiit, Macronix NBit, eLiteFlash, HybridNVM, HybridFlash, XtraROM, Phines, KH Logo,
BE-SONOS, KSMC, Kingtech, MXSMIO, Macronix vEE, Macronix MAP, Rich Au-dio, Rich Book, Rich
TV, and FitCAM. The names and brands of third party referred thereto (if any) are for identification
purposes only
For the contact and order information, please visit Macronix’s Web site at: http://www.macronix.com
P/N: AN0222
10
Ver:1 Mar. 21, 2013
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