plastic thermal enhanced low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm; exposed die pad

HL
QF
P1
44
SOT612-3
plastic thermal enhanced low profile quad flat package; 144
leads; body 20 x 20 x 1.4 mm; exposed die pad
8 February 2016
Package information
1. Package summary
Terminal position code
Q (quad)
Package type descriptive code
HLQFP144
Package type industry code
HLQFP144
Package style descriptive code
HLQFP (thermal enhanced low profile quad flat
package)
Package style suffix code
NA (not applicable)
Package body material type
P (plastic)
JEDEC package outline code
MS-026
Mounting method type
S (surface mount)
Issue date
5-7-2004
Table 1. Package summary
Symbol
Parameter
Min
Typ
Nom
Max
Unit
D
package length
19.9
-
20
20.1
mm
E
package width
19.9
-
20
20.1
mm
A
seated height
1.4
-
1.5
1.6
mm
A2
package height
1.35
-
1.4
1.45
mm
e
nominal pitch
-
-
0.5
-
mm
n2
actual quantity of termination
-
-
144
-
SOT612-3
NXP Semiconductors
plastic thermal enhanced low profile quad flat
package; 144 leads; body 20 x 20 x 1.4 mm;
exposed die pad
2. Package outline
HLQFP144: plastic thermal enhanced low profile quad flat package; 144 leads;
body 20 x 20 x 1.4 mm; exposed die pad
SOT612-3
c
y
exposed die pad
X
A
Dh
73
72
108
109
ZE
e
Eh
E HE
A A2
(A 3 )
A1
wM
bp
L
pin 1 index
144
θ
Lp
detail X
37
1
36
v M A
ZD
wM
bp
e
D
B
HD
v M B
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D(1)
Dh
E(1)
Eh
e
mm
1.6
0.12
0.05
1.45
1.35
0.25
0.27
0.17
0.20
0.09
20.1
19.9
5.7
5.5
20.1
19.9
5.7
5.5
0.5
HD
HE
22.15 22.15
21.85 21.85
L
Lp
v
w
y
1
0.75
0.45
0.2
0.08
0.08
ZD(1) ZE(1)
1.4
1.1
1.4
1.1
θ
o
7
o
0
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT612-3
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
02-07-12
04-07-05
MS-026
Fig. 1. Package outline HLQFP144 (SOT612-3)
SOT612-3
Package information
All information provided in this document is subject to legal disclaimers.
8 February 2016
©
NXP Semiconductors N.V. 2016. All rights reserved
2/5
SOT612-3
NXP Semiconductors
plastic thermal enhanced low profile quad flat
package; 144 leads; body 20 x 20 x 1.4 mm;
exposed die pad
3. Soldering
Footprint information for reflow soldering of HLQFP144 package
SOT612-3
Hx
Gx
P2
(0.125)
P1
SPx
nSPx
Hy
SLy
Gy
SPy tot
SPy
By
Ay
nSPy
SPx tot
SLx
C
D2 (8×)
D1
Bx
Ax
Generic footprint pattern
Refer to the package outline drawing for actual layout
solder land
solder paste
SPx
SPy
nSPx
nSPy
1.000
1.000
4
4
SLx
SLy
5.900
5.900
occupied area
Dimensions in mm
P1
P2
0.500
0.560
Issue date
Ax
Ay
Bx
By
23.300 23.300 20.300 20.300
C
D1
1.500
0.280
D2
0.400
Gx
Gy
Hx
Hy
20.500 20.500 23.550 23.550
09-12-29
09-12-29
SPx tot SPy tot
5.800
5.800
sot612-3_fr
Fig. 2. Reflow soldering footprint for HLQFP144 (SOT612-3)
SOT612-3
Package information
All information provided in this document is subject to legal disclaimers.
8 February 2016
©
NXP Semiconductors N.V. 2016. All rights reserved
3/5
SOT612-3
NXP Semiconductors
plastic thermal enhanced low profile quad flat
package; 144 leads; body 20 x 20 x 1.4 mm;
exposed die pad
4. Legal information
Disclaimers
Limited warranty and liability — Information in this document is believed
to be accurate and reliable. However, NXP Semiconductors does not give
any representations or warranties, expressed or implied, as to the accuracy
or completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal
or replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to
make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
SOT612-3
Package information
All information provided in this document is subject to legal disclaimers.
8 February 2016
©
NXP Semiconductors N.V. 2016. All rights reserved
4/5
SOT612-3
NXP Semiconductors
plastic thermal enhanced low profile quad flat
package; 144 leads; body 20 x 20 x 1.4 mm;
exposed die pad
5. Contents
1. Package summary........................................................ 1
2. Package outline............................................................ 2
3. Soldering....................................................................... 3
4. Legal information......................................................... 4
©
NXP Semiconductors N.V. 2016. All rights reserved
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 8 February 2016
SOT612-3
Package information
All information provided in this document is subject to legal disclaimers.
8 February 2016
©
NXP Semiconductors N.V. 2016. All rights reserved
5/5
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