P6 4 HT QF SOT855-4 plastic thermal enhanced thin quad flat package; 64 leads; exposed die pad 8 February 2016 Package information 1. Package summary Terminal position code Q (quad) Package type descriptive code HTQFP64 Package type industry code HTQFP64 Package style descriptive code HTQFP (thermal enhanced thin quad flat package) Package style suffix code NA (not applicable) Package body material type P (plastic) JEDEC package outline code MS-026 Mounting method type S (surface mount) Issue date 12-4-2011 Table 1. Package summary Symbol Parameter Min Typ Nom Max Unit D package length 9.9 - 10 10.1 mm E package width 9.9 - 10 10.1 mm A seated height 1 - 1.1 1.2 mm A2 package height 0.95 - 1 1.05 mm e nominal pitch - - 0.5 - mm n2 actual quantity of termination - - 64 - SOT855-4 NXP Semiconductors plastic thermal enhanced thin quad flat package; 64 leads; exposed die pad 2. Package outline HTQFP64: plastic thermal enhanced thin quad flat package; 64 leads; body 10 x 10 x 1 mm; exposed die pad SOT855-4 c y exposed die pad X Dh A 48 33 49 ZE 32 e Eh E HE (A3) A A2 w θ bp A1 Lp pin 1 index 64 17 1 16 w bp e ZD D 0 A v B 5 10 mm scale Dimensions mm v B HD D(1) Dh E(1) Eh max 1.20 0.15 1.05 0.27 0.18 10.1 nom 1.10 0.10 1.00 0.25 0.22 0.15 10.0 min 1.00 0.05 0.95 0.17 0.12 9.9 4.6 4.1 3.6 10.1 10.0 9.9 5.0 4.5 4.0 Unit L detail X A A1 A2 A3 bp c e HD 12.15 0.5 12.00 11.85 HE L Lp v w y ZD(1) ZE(1) θ 12.15 12.00 11.85 1 0.75 0.60 0.45 0.2 0.08 0.1 1.45 1.45 1.25 1.25 1.05 1.05 7° Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. Outline version SOT855-4 References IEC JEDEC JEITA 0° sot855-4_po European projection Issue date 11-04-05 11-04-12 MS-026 Fig. 1. Package outline HTQFP64 (SOT855-4) SOT855-4 Package information All information provided in this document is subject to legal disclaimers. 8 February 2016 © NXP Semiconductors N.V. 2016. All rights reserved 2/5 SOT855-4 NXP Semiconductors plastic thermal enhanced thin quad flat package; 64 leads; exposed die pad 3. Soldering Footprint information for reflow soldering of HTQFP64 package SOT855-4 Hx Gx P2 (0.125) P1 SPx nSPx Hy SLy Gy SPy tot SPy By Ay nSPy SPx tot SLx C D2 (8×) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste occupied area nSPx nSPy 4 4 Dimensions in mm P1 P2 Ax Ay Bx By C D1 D2 Gx Gy Hx Hy SLx SLy SPx tot SPy tot 4.800 4.800 0.500 0.500 13.300 13.300 10.300 10.300 1.500 0.280 0.400 10.500 10.500 13.550 13.550 4.600 5.000 Issue date 11-06-28 11-11-24 SPx SPy 0.800 0.800 sot855-4_fr Fig. 2. Reflow soldering footprint for HTQFP64 (SOT855-4) SOT855-4 Package information All information provided in this document is subject to legal disclaimers. 8 February 2016 © NXP Semiconductors N.V. 2016. All rights reserved 3/5 SOT855-4 NXP Semiconductors plastic thermal enhanced thin quad flat package; 64 leads; exposed die pad 4. Legal information Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. SOT855-4 Package information All information provided in this document is subject to legal disclaimers. 8 February 2016 © NXP Semiconductors N.V. 2016. All rights reserved 4/5 SOT855-4 NXP Semiconductors plastic thermal enhanced thin quad flat package; 64 leads; exposed die pad 5. Contents 1. Package summary........................................................ 1 2. Package outline............................................................ 2 3. Soldering....................................................................... 3 4. Legal information......................................................... 4 © NXP Semiconductors N.V. 2016. All rights reserved For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 8 February 2016 SOT855-4 Package information All information provided in this document is subject to legal disclaimers. 8 February 2016 © NXP Semiconductors N.V. 2016. All rights reserved 5/5