3-Input AND Gate

NLX1G11
3-Input AND Gate
The NLX1G11 is an advanced high−speed 3−input CMOS AND
gate in ultra−small footprint.
The NLX1G11 input structures provide protection when voltages up
to 7.0 V are applied, regardless of the supply voltage.
Features
A
1
6
MARKING
DIAGRAMS
UDFN6
1.0 x 1.0
CASE 517BX
E
•
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High Speed: tPD = 2.4 ns (Typ) @ VCC = 5.0 V
Designed for 1.65 V to 5.5 V VCC Operation
Low Power Dissipation: ICC = 1 mA (Max) at TA = 25°C
24 mA Balanced Output Source and Sink Capability
Balanced Propagation Delays
Overvoltage Tolerant (OVT) Input Pins
Ultra−Small Packages
NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
These are Pb−Free Devices
UDFN6
1.2 x 1.0
CASE 517AA
XM
M
1
1
UDFN6
1.45 x 1.0
CASE 517AQ
C
P
•
•
•
•
•
•
•
•
M
1
GND
2
5
X
M
G
VCC
A
B
B
3
4
Y
&
= Device Marking
= Date Code
= Pb−Free Package
Y
C
ORDERING INFORMATION
Figure 2. Logic Symbol
Figure 1. Pinout (Top View)
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
PIN ASSIGNMENT
Pin
Function
1
A
2
GND
3
B
4
Y
5
VCC
6
C
FUNCTION TABLE
Output
Input
A
B
C
Y
L
X
X
H
X
L
X
H
X
X
L
H
L
L
L
H
H − HIGH Logic Level
L − LOW Logic Level
X = Either LOW or HIGH Logic Level
© Semiconductor Components Industries, LLC, 2016
June, 2016 − Rev. 5
1
Publication Order Number:
NLX1G11/D
NLX1G11
MAXIMUM RATINGS
Symbol
Value
Unit
VCC
DC Supply Voltage
−0.5 to +7.0
V
VIN
DC Input Voltage
−0.5 to +7.0
V
DC Output Voltage
−0.5 to +7.0
V
VIN < GND
−50
mA
VOUT < GND
−50
mA
VOUT
Parameter
IIK
DC Input Diode Current
IOK
DC Output Diode Current
IO
DC Output Source/Sink Current
±50
mA
ICC
DC Supply Current per Supply Pin
±100
mA
IGND
DC Ground Current per Ground Pin
±100
mA
TSTG
Storage Temperature Range
−65 to +150
°C
TL
Lead Temperature, 1 mm from Case for 10 Seconds
260
°C
TJ
Junction Temperature Under Bias
150
°C
qJA
Thermal Resistance (Note 1)
496
°C/W
PD
Power Dissipation in Still Air @ 85°C
252
mW
MSL
FR
VESD
ILATCHUP
Moisture Sensitivity
Level 1
Flammability Rating Oxygen
Index: 28 to 34
ESD Withstand Voltage
UL 94 V−0 @ 0.125 in
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
Latchup Performance Above VCC and Below GND at 125 °C (Note 5)
>2000
>200
N/A
V
±500
mA
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA / JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
VCC
Positive DC Supply Voltage
VIN
Digital Input Voltage (Note 6)
VOUT
Operating
Data Retention Only
Output Voltage
TA
Operating Free−Air Temperature
Dt/DV
Input Transition Rise or Fall Rate
VCC = 1.8 V ± 0.15 V
VCC = 2.5 V ± 0.2 V
VCC = 3.3 V ± 0.3 V
VCC = 5.0 V ± 0.5 V
Min
Max
Unit
1.65
1.5
5.5
5.5
V
0
5.5
V
0
5.5
V
−55
+125
°C
0
0
0
0
20
20
10
5
ns/V
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
6. Unused inputs may not be left open. All inputs must be tied to a high or low−logic input voltage level.
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2
NLX1G11
DC ELECTRICAL CHARACTERISTICS
Symbol
Parameter
VIH
Low−Level
Input
Voltage
VIL
VOH
VOL
High−
Level
Output
Voltage
Low−Level
Output
Voltage
VIN = VIH or VIL
IOH = −100 mA
1.65
0.75 x VCC
0.75 x VCC
2.3 to 5.5
0.70 x VCC
0.70 x VCC
Typ
Max
Min
Max
0.25 x VCC
0.25 x VCC
2.3 − 5.5
0.30 x VCC
0.30 x VCC
1.65 − 5.5
VCC−0.1
VCC
VCC−0.1
1.65
2.3
2.7
3.0
3.0
4.5
1.29
1.9
2.2
2.4
2.3
3.8
1.52
2.15
2.4
2.8
2.68
4.2
1.29
1.9
2.2
2.4
2.3
3.8
1.65 − 5.5
Unit
V
1.65
VIN = VIH or VIL
IOH = −4 mA
IOH = −8 mA
IOH = −12 mA
IOH = −16 mA
IOH = −24 mA
IOH = −32 mA
VIN = VIH or VIL
IOL = 100 mA
TA = −555C to +1255C
Min
Conditions
Low−Level
Input
Voltage
TA = 25 5C
VCC
(V)
V
V
0.1
0.1
0.24
0.3
0.4
0.4
0.55
0.55
0.24
0.3
0.4
0.4
0.55
0.55
V
VIN = VIH or VIL
IOH = 4 mA
IOH = 8 mA
IOH = 12 mA
IOH = 16 mA
IOH = 24 mA
IOH = 32 mA
1.65
2.3
2.7
3.0
3.0
4.5
Input
Leakage
Current
0 v VIN v 5.5V
0 to 5.5
±0.1
±1.0
mA
IOFF
Power−Off
Output
Leakage
Current
VIN or VOUT =
5.5 V
0
1.0
10
mA
ICC
Quiescent
Supply
Current
0 v VIN v VCC
5.5
1.0
10
mA
IIN
0.08
0.1
0.12
0.15
0.22
0.22
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 2.5 nS)
Symbol
tPLH,
tPHL
Parameter
Propagation Delay,
Input to Output
TA = −555C to
+1255C
TA = 25 5C
VCC
(V)
Test
Condition
Min
Typ
Max
Min
Max
Unit
1.65−1.95
RL = 1 MW, CL = 15 pF
2.0
5.5
18.5
2.0
19
ns
2.3−2.7
RL = 1 MW, CL = 15 pF
0.8
3.0
11
0.8
11.5
3.0−3.6
RL = 1 MW, CL = 15 pF
0.5
2.6
7.5
0.5
8.0
RL = 500 W, CL = 50 pF
1.5
3.0
8.5
1.5
9.0
RL = 1 MW, CL = 15 pF
0.5
2.2
5.5
0.5
6.0
RL = 500 W, CL = 50 pF
0.8
2.4
7.0
0.8
7.5
4.5−5.5
CIN
Input Capacitance
5.5
VIN = 0 V or VCC
4.0
pF
CPD
Power Dissipation
Capacitance (Note 7)
3.3
5.5
10 MHz
VIN = 0 V or VCC
20
26
pF
7. CPD is defined as the value of the internal equivalent capacitance which is calculated from the dynamic operating current consumption without
load. Average operating current can be obtained by the equation ICC(OPR) = CPD • VCC • fin + ICC. CPD is used to determine the no−load
dynamic power consumption: PD = CPD • VCC2 • fin + ICC • VCC.
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3
NLX1G11
VCC
A and B
INPUT
50%
OUTPUT
GND
tPLH
Y
RL
tPHL
50% VCC
CL
A 1 MHz square input wave is recommended
for propagation delay tests
tR = tF = 2.5 ns, 10% to 90%, f = 1 MHz, tW = 500 ns
Figure 3. Switching Waveforms
Figure 4. Test Circuit
ORDERING INFORMATION
Package
Shipping†
NLX1G11MUTCG
(In Development)
UDFN6, 1.2 x 1.0, 0.4P
(Pb−Free)
3000 / Tape & Reel
NLX1G11AMUTCG
UDFN6, 1.45 x 1.0, 0.5P
(Pb−Free)
3000 / Tape & Reel
NLVX1G11AMUTCG*
UDFN6, 1.45 x 1.0, 0.5P
(Pb−Free)
3000 / Tape & Reel
NLX1G11CMUTCG
UDFN6, 1.0 x 1.0, 0.35P
(Pb−Free)
3000 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP
Capable.
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4
NLX1G11
PACKAGE DIMENSIONS
UDFN6 1.2x1.0, 0.4P
CASE 517AA
ISSUE D
EDGE OF PACKAGE
PIN ONE
REFERENCE
2X
0.10 C
L1
ÉÉÉ
ÉÉÉ
E
DETAIL A
Bottom View
(Optional)
TOP VIEW
2X
EXPOSED Cu
0.10 C
(A3)
0.10 C
A1
A
10X
0.08 C
ÉÉÉ
ÉÉÉ
A3
DETAIL B
Side View
(Optional)
5X
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.127 REF
0.15
0.25
1.20 BSC
1.00 BSC
0.40 BSC
0.30
0.40
0.00
0.15
0.40
0.50
MOUNTING FOOTPRINT*
6X
6X
0.42
C
A1
DIM
A
A1
A3
b
D
E
e
L
L1
L2
MOLD CMPD
SEATING
PLANE
SIDE VIEW
1
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND
0.30 mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A
B
D
0.22
L
3
L2
6X
b
0.10 C A B
0.05 C
6
0.40
PITCH
4
e
NOTE 3
1.07
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
BOTTOM VIEW
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5
NLX1G11
PACKAGE DIMENSIONS
UDFN6 1.45x1.0, 0.5P
CASE 517AQ
ISSUE O
A
B
D
L
L
L1
PIN ONE
REFERENCE
0.10 C
ÉÉÉ
ÉÉÉ
DETAIL A
E
OPTIONAL
CONSTRUCTIONS
DETAIL B
MOLD CMPD
DETAIL B
0.05 C
6X
DIM
A
A1
A2
b
D
E
e
L
L1
ÉÉ
ÉÉ
EXPOSED Cu
TOP VIEW
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
OPTIONAL
CONSTRUCTIONS
A
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.07 REF
0.20
0.30
1.45 BSC
1.00 BSC
0.50 BSC
0.30
0.40
−−−
0.15
MOUNTING FOOTPRINT
0.05 C
A1
A2
SIDE VIEW
e
6X
C
6X
SEATING
PLANE
L
1.24
3
1
DETAIL A
6X
0.53
6
0.30
PACKAGE
OUTLINE
4
BOTTOM VIEW
6X
0.50
PITCH
DIMENSIONS: MILLIMETERS
b
0.10 C A B
0.05 C
1
NOTE 3
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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6
NLX1G11
PACKAGE DIMENSIONS
UDFN6 1.0x1.0, 0.35P
CASE 517BX
ISSUE O
PIN ONE
REFERENCE
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. PACKAGE DIMENSIONS EXCLUSIVE OF
BURRS AND MOLD FLASH.
A B
D
ÉÉÉ
ÉÉÉ
ÉÉÉ
E
0.10 C
2X
2X
0.10 C
DIM
A
A1
A3
b
D
E
e
L
L1
TOP VIEW
A3
0.05 C
A
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.13 REF
0.12
0.22
1.00 BSC
1.00 BSC
0.35 BSC
0.25
0.35
0.30
0.40
0.05 C
SIDE VIEW
A1
C
RECOMMENDED
SOLDERING FOOTPRINT*
SEATING
PLANE
5X
e
5X
0.48
L
6X
0.22
3
1
L1
1.18
6
4
6X
BOTTOM VIEW
b
0.10
M
C A B
0.05
M
C
0.53
1
PKG
OUTLINE
NOTE 3
0.35
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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NLX1G11/D
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