as a PDF

NLX2GU04
Dual Unbuffered Inverter
The NLX2GU04 MiniGatet is an advanced high−speed CMOS
dual unbuffered inverter in ultra−small footprint.
This device is well suited for use in oscillator, pulse−shaping and
high input impedance amplifier applications. For digital applications,
the NLX2G04 is recommended.
The NLX2GU04 input and output structures provide protection
when voltages up to 7.0 V are applied, regardless of the supply
voltage.
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MARKING
DIAGRAMS
Features
1
6
OUT Y2
GND
2
5
VCC
1
ULLGA6
1.2 x 1.0
CASE 613AE
1
1
M
M
ULLGA6
1.45 x 1.0
CASE 613AF
L
IN A1
ULLGA6
1.0 x 1.0
CASE 613AD
L
Designed for 1.65 V to 5.5 V VCC Operation
Unbuffered for Crystal Oscillator and Analog Applications
16 mA Balanced Output Source and Sink Capability
Balanced Propagation Delays
Overvoltage Tolerant (OVT) Input and Output Pins
Ultra−Small Packages
These are Pb−Free Devices
L
•
•
•
•
•
•
•
UDFN6
1.0 x 1.0
CASE 517BX
XM
UDFN6
1.2 x 1.0
CASE 517AA
XM
UDFN6
1.45 x 1.0
CASE 517AQ
XM
M
1
3
IN A2
4
OUT Y1
1
Figure 1. Pinout (Top View)
IN A1
1
OUT Y2
IN A2
1
OUT Y2
1
L
M
= Device Marking
= Date Code
Figure 2. Logic Symbol
ORDERING INFORMATION
PIN ASSIGNMENT
FUNCTION TABLE
1
IN A1
2
GND
3
IN A2
A
Y
4
OUT Y2
L
H
H
L
5
VCC
6
OUT Y1
© Semiconductor Components Industries, LLC, 2012
January, 2012 − Rev. 1
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
1
Publication Order Number:
NLX2GU04/D
NLX2GU04
MAXIMUM RATINGS
Symbol
Value
Unit
VCC
DC Supply Voltage
−0.5 to +7.0
V
VIN
DC Input Voltage
−0.5 to +7.0
V
DC Output Voltage
−0.5 to +7.0
V
VIN < GND
−50
mA
VOUT < GND
−50
mA
VOUT
Parameter
IIK
DC Input Diode Current
IOK
DC Output Diode Current
IO
DC Output Source/Sink Current
±50
mA
ICC
DC Supply Current Per Supply Pin
±100
mA
IGND
DC Ground Current per Ground Pin
±100
mA
TSTG
Storage Temperature Range
−65 to +150
°C
TL
Lead Temperature, 1 mm from Case for 10 Seconds
260
°C
TJ
Junction Temperature Under Bias
150
°C
MSL
FR
ILATCHUP
Moisture Sensitivity
Level 1
Flammability Rating Oxygen
Index: 28 to 34
UL 94 V−0 @ 0.125 in
Latchup Performance Above VCC and Below GND at 125 °C (Note 5)
mA
±500
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/UESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA / JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
1.65
5.5
V
VCC
Positive DC Supply Voltage
VIN
Digital Input Voltage
0
5.5
V
Output Voltage
0
5.5
V
−55
+125
°C
0
0
100
20
ns/V
VOUT
TA
Operating Free−Air Temperature
Dt/DV
Input Transition Rise or Fall Rate
VCC = 3.3 V ± 0.3 V
VCC = 5.0 V ± 0.5 V
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2
NLX2GU04
DC ELECTRICAL CHARACTERISTICS
TA = +855C
TA = 25 5C
Symbol
Parameter
VIH
Low−Level
Input
Voltage
VIL
VOH
VOL
IIN
Conditions
Low−Level
Output
Voltage
Min
1.65
0.85 x
VCC
0.80 x
VCC
2.3 to 5.5
Low−Level
Input
Voltage
High−
Level
Output
Voltage
VCC (V)
Typ
Max
Min
Max
0.85 x
VCC
0.80 x
VCC
1.65
0.15 x
VCC
0.20 x
VCC
2.3 to 5.5
TA = −555C to
+1255C
Min
0.85 x
VCC
0.80 x
VCC
0.15 x
VCC
0.20 x
VCC
1.65 to
5.5
VCC −
0.1
VCC
VCC −
0.1
VCC −
0.1
VIN = VIH or VIL
IOH = −3 mA
IOH = −4 mA
IOH = −6 mA
IOH = −8 mA
IOH = −12 mA
IOH = −16 mA
1.65
2.3
2.7
3.0
3.0
4.5
1.29
1.9
2.2
2.4
2.3
3.8
1.52
2.1
2.3
2.6
2.5
4.0
1.29
1.9
2.2
2.4
2.3
3.8
1.29
1.9
2.2
2.4
2.3
3.8
VIN = VIH or VIL
IOL = 50 mA
1.65 to
5.5
VIN = VIH or VIL
IOH = 3 mA
IOH = 4 mA
IOH = 6 mA
IOH = 8 mA
IOH = 12 mA
IOH = 16 mA
1.65
2.3
2.7
3.0
3.0
4.5
0 v VIN v 5.5 V
IOFF
Power−Off
Output
Leakage
Current
VOUT = 5.5 V
ICC
Quiescent
Supply
Current
0 v VIN v VCC
Unit
V
0.15 x
VCC
0.20 x
VCC
VIN = VIH or VIL
IOH = −100 mA
Input
Leakage
Current
Max
V
V
V
0.1
0.1
0.1
0.24
0.3
0.4
0.4
0.55
0.55
0.24
0.3
0.4
0.4
0.55
0.55
0.24
0.3
0.4
0.4
0.55
0.55
0 to 5.5
±0.1
±1.0
±1.0
mA
0
1.0
10
10
mA
5.5
1.0
10
10
mA
0.08
0.12
0.2
0.24
0.36
0.31
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3
NLX2GU04
AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns)
Symbol
tPLH,
tPHL
Parameter
Propagation Delay,
Input A to Output Y
VCC
(V)
Test
Condition
1.65 to 1.95
Min
Typ
Max
Min
Max
Unit
RL = 1 MW,
CL = 15 pF
1.5
1.8
5.5
1.5
11
ns
2.3 to 2.7
RL = 1 MW,
CL = 15 pF
1.2
3.3
5.7
1.2
6.3
3.0 to 3.6
RL = 1 MW,
CL = 15 pF
0.8
2.7
4.1
0.8
4.5
RL = 500 W,
CL = 50 pF
1.2
4.0
6.4
1.2
7.0
RL = 1 MW,
CL = 15 pF
0.5
2.2
3.3
0.5
3.6
RL = 500 W,
CL = 50 pF
0.8
3.4
5.6
0.8
6.2
4.5 to 5.5
CIN
TA = −555C
to +1255C
TA = 25 5C
Input Capacitance
5.5
VIN = 0 V or
VCC
7
pF
COUT
Output Capacitance
5.5
VIN = 0 V or
VCC
8
pF
CPD
Power Dissipation Capacitance
(Note 6)
5.5
10 MHz
VIN = 0 V or
VCC
25
pF
6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the dynamic operating current consumption without
load. Average operating current can be obtained by the equation ICC(OPR) = CPD • VCC • fin + ICC. CPD is used to determine the no−load
dynamic power consumption: PD = CPD • VCC2 • fin + ICC • VCC.
A or B
VCC
50%
GND
tPLH
Y
tPHL
50% VCC
Figure 3. Switching Waveforms
VCC
PULSE
GENERATOR
DUT
RT
CL
RT = ZOUT of pulse generator (typically 50 W)
Figure 4. Test Circuit
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4
RL
NLX2GU04
ORDERING INFORMATION
Package
Shipping†
NLX2GU04AMX1TCG
ULLGA6, 1.45 x 1.0, 0.5P
(Pb−Free)
3000 / Tape & Reel
NLX2GU04BMX1TCG
ULLGA6, 1.2 x 1.0, 0.4P
(Pb−Free)
3000 / Tape & Reel
NLX2GU04CMX1TCG
ULLGA6, 1.0 x 1.0, 0.35P
(Pb−Free)
3000 / Tape & Reel
NLX2GU04MUTCG
UDFN6, 1.2 x 1.0, 0.4P
(Pb−Free)
3000 / Tape & Reel
NLX2GU04AMUTCG
UDFN6, 1.45 x 1.0, 0.5P
(Pb−Free)
3000 / Tape & Reel
NLX2GU04AMUTCG
UDFN6, 1.0 x 1.0, 0.35P
(Pb−Free)
3000 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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5
NLX2GU04
PACKAGE DIMENSIONS
UDFN6 1.2x1.0, 0.4P
CASE 517AA
ISSUE O
EDGE OF PACKAGE
PIN ONE
REFERENCE
2X
0.10 C
ÉÉ
ÉÉ
ÉÉ
L1
E
DETAIL A
Bottom View
(Optional)
TOP VIEW
2X
EXPOSED Cu
0.10 C
(A3)
0.10 C
A1
A
10X
0.08 C
ÉÉÉ
ÉÉÉ
5X
A3
DETAIL B
Side View
(Optional)
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.127 REF
0.15
0.25
1.20 BSC
1.00 BSC
0.40 BSC
0.30
0.40
0.00
0.15
0.40
0.50
MOUNTING FOOTPRINT*
6X
C
A1
DIM
A
A1
A3
b
D
E
e
L
L1
L2
MOLD CMPD
SEATING
PLANE
SIDE VIEW
1
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND
0.30 mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A
B
D
6X
0.42
0.22
L
3
L2
6X
b
0.10 C A B
0.05 C
6
0.40
PITCH
4
e
NOTE 3
1.07
DIMENSIONS: MILLIMETERS
BOTTOM VIEW
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
6
NLX2GU04
PACKAGE DIMENSIONS
UDFN6 1.45x1.0, 0.5P
CASE 517AQ
ISSUE O
A
B
D
PIN ONE
REFERENCE
0.10 C
L1
ÉÉÉ
ÉÉÉ
DETAIL A
E
OPTIONAL
CONSTRUCTIONS
DETAIL B
A1
SIDE VIEW
MOLD CMPD
OPTIONAL
CONSTRUCTIONS
A
0.05 C
DIM
A
A1
A2
b
D
E
e
L
L1
DETAIL B
0.05 C
6X
A2
6X
C
6X
SEATING
PLANE
0.30
PACKAGE
OUTLINE
L
1.24
3
1
DETAIL A
6X
0.53
4
BOTTOM VIEW
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.07 REF
0.20
0.30
1.45 BSC
1.00 BSC
0.50 BSC
0.30
0.40
−−−
0.15
MOUNTING FOOTPRINT
e
6
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
ÉÉ
ÉÉ
EXPOSED Cu
TOP VIEW
0.10 C
L
L
6X
0.50
PITCH
DIMENSIONS: MILLIMETERS
b
0.10 C A B
0.05 C
1
NOTE 3
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
7
NLX2GU04
PACKAGE DIMENSIONS
UDFN6 1.0x1.0, 0.35P
CASE 517BX
ISSUE O
PIN ONE
REFERENCE
2X
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. PACKAGE DIMENSIONS EXCLUSIVE OF
BURRS AND MOLD FLASH.
A B
D
ÉÉÉ
ÉÉÉ
ÉÉÉ
E
0.10 C
2X
0.10 C
DIM
A
A1
A3
b
D
E
e
L
L1
TOP VIEW
A3
0.05 C
A
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.13 REF
0.12
0.22
1.00 BSC
1.00 BSC
0.35 BSC
0.25
0.35
0.30
0.40
0.05 C
SIDE VIEW
A1
C
RECOMMENDED
SOLDERING FOOTPRINT*
SEATING
PLANE
5X
e
5X
0.48
L
6X
0.22
3
1
L1
1.18
6
4
BOTTOM VIEW
6X
b
0.10
M
C A B
0.05
M
C
0.53
1
PKG
OUTLINE
NOTE 3
0.35
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
8
NLX2GU04
PACKAGE DIMENSIONS
ULLGA6 1.0x1.0, 0.35P
CASE 613AD
ISSUE A
PIN ONE
REFERENCE
0.10 C
ÉÉ
ÉÉ
ÉÉ
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
4. A MAXIMUM OF 0.05 PULL BACK OF THE
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
A
B
D
E
DIM
A
A1
b
D
E
e
L
L1
TOP VIEW
0.05 C
A
6X
0.05 C
SEATING
PLANE
SIDE VIEW
MOUNTING FOOTPRINT
SOLDERMASK DEFINED*
C
A1
MILLIMETERS
MIN
MAX
−−−
0.40
0.00
0.05
0.12
0.22
1.00 BSC
1.00 BSC
0.35 BSC
0.25
0.35
0.30
0.40
5X
0.48
e
5X
L
NOTE 4
3
1
1.18
L1
0.53
6
4
6X
1
PKG
OUTLINE
b
0.05 C
0.35
PITCH
DIMENSIONS: MILLIMETERS
0.10 C A B
BOTTOM VIEW
6X
0.22
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
NOTE 3
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9
NLX2GU04
PACKAGE DIMENSIONS
ULLGA6 1.2x1.0, 0.4P
CASE 613AE
ISSUE A
PIN ONE
REFERENCE
0.10 C
ÉÉ
ÉÉ
ÉÉ
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
4. A MAXIMUM OF 0.05 PULL BACK OF THE
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
A
B
D
E
DIM
A
A1
b
D
E
e
L
L1
TOP VIEW
0.05 C
A
6X
0.05 C
SEATING
PLANE
SIDE VIEW
MOUNTING FOOTPRINT
SOLDERMASK DEFINED*
C
A1
MILLIMETERS
MIN
MAX
−−−
0.40
0.00
0.05
0.15
0.25
1.20 BSC
1.00 BSC
0.40 BSC
0.25
0.35
0.35
0.45
5X
0.49
e
5X
L
NOTE 4
3
1
1.24
L1
0.53
6
4
6X
b
0.05 C
NOTE 3
1
PKG
OUTLINE
0.40
PITCH
DIMENSIONS: MILLIMETERS
0.10 C A B
BOTTOM VIEW
6X
0.26
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
10
NLX2GU04
PACKAGE DIMENSIONS
ULLGA6 1.45x1.0, 0.5P
CASE 613AF
ISSUE A
PIN ONE
REFERENCE
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
4. A MAXIMUM OF 0.05 PULL BACK OF THE
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
A
B
D
ÉÉÉ
ÉÉÉ
ÉÉÉ
E
DIM
A
A1
b
D
E
e
L
L1
TOP VIEW
0.10 C
0.05 C
MILLIMETERS
MIN
MAX
−−−
0.40
0.00
0.05
0.15
0.25
1.45 BSC
1.00 BSC
0.50 BSC
0.25
0.35
0.30
0.40
A
6X
0.05 C
MOUNTING FOOTPRINT
SOLDERMASK DEFINED*
SEATING
PLANE
SIDE VIEW
5X
C
A1
e
5X
L
0.49
NOTE 4
3
1
1.24
L1
0.53
6
4
BOTTOM VIEW
6X
0.30
6X
b
0.10 C A B
0.05 C
NOTE 3
1
PKG
OUTLINE
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
MiniGate is a trademark of Semiconductor Components Industries, LLC (SCILLC).
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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11
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For additional information, please contact your local
Sales Representative
NLX2GU04/D