600 V, 1 A Power Rectifier

MURHS160T3G,
SURHS8160T3G
Power Rectifier
Features and Benefits







Ultrafast 35 Nanosecond Recovery Times
175C Operating Junction Temperature
High Temperature Glass Passivated Junction
High Voltage Capability to 600 V
AEC−Q101 Qualified and PPAP Capable
SURHS8 Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements
This is a Pb−Free Device*
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ULTRAFAST RECTIFIER
1.0 AMPERES
600 VOLTS
Applications
 Power Supplies
 Inverters
 Free Wheeling Diodes
SMB
CASE 403A
PLASTIC
Mechanical Characteristics


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
Case: Epoxy, Molded
Epoxy Meets UL 94 V−0 @ 0.125 in
Weight: 95 mg (Approximately)
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
Lead Temperature for Soldering Purposes:
260C Max. for 10 Seconds
Cathode Polarity Band
MAXIMUM RATINGS
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Rating
VRRM
VRWM
VR
600
V
Average Rectified Forward Current
(Rated VR, TL = 145C)
IF(AV)
Nonrepetitive Peak Surge Current
(Surge Applied at Rated Load Conditions
Halfwave, Single Phase, 60 Hz)
IFSM
Operating Junction and Storage
Temperature Range
ESD Ratings:
Machine Model = C
Human Body Model = 3B
TJ, Tstg
A
1.0
A
15
−65 to +175
C
V
> 400
> 8000
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
2
1
MARKING DIAGRAM
ALYWW
UH16G
G
UH16 = Specific Device Code
AL
= Assembly Location
Y
= Year
WW
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Package
Shipping†
MURHS160T3G
SMB
(Pb−Free)
2,500 /
Tape & Reel
SURHS8160T3G
SMB
(Pb−Free)
2,500 /
Tape & Reel
Device
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
 Semiconductor Components Industries, LLC, 2012
January, 2012 − Rev. 3
1
Publication Order Number:
MURHS160/D
MURHS160T3G, SURHS8160T3G
THERMAL CHARACTERISTICS
Symbol
Value
Unit
Maximum Thermal Resistance, Junction−to−Lead (Note 1)
Rating
RqJL
24
C/W
Maximum Thermal Resistance, Junction−to−Ambient (Note 2)
RqJA
80
C/W
1. Mounted with minimum recommended pad size, PC Board FR4.
2. 1 inch square pad size (1 x 0.5 inch for each lead) on FR4 board.
ELECTRICAL CHARACTERISTICS
Rating
Symbol
Maximum Instantaneous Forward Voltage (Note 3)
(IF = 1.0 A, TC = 25C)
(IF = 1.0 A, TC = 125C)
VF
Maximum Instantaneous Reverse Current (Note 3)
(Rated dc Voltage, TC = 25C)
(Rated dc Voltage, TC = 125C)
IR
Maximum Reverse Recovery Time
(IF = 1.0 A, di/dt = 50 A/ms)
(IF = 0.5 A, IR = 1.0 A, IREC = 0.25 A)
trr
3. Pulse Test: Pulse Width = 300 ms, Duty Cycle  2.0%.
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2
Typ
Max
1.5
1.2
2.4
1.7
0.18
5.0
20
200
25
16
35
30
Unit
V
mA
ns
TJ = 150C
1
TJ = 125C
TJ = 25C
0.5
1
1.5
2
2.5
3
10
TJ = 150C
1
TJ = 125C
TJ = 25C
0.1
0
0.5
1
1.5
2
2.5
3
3.5
VF, INSTANTANEOUS FORWARD VOLTAGE (V)
VF, INSTANTANEOUS FORWARD VOLTAGE (V)
Figure 1. Typical Forward Voltage
Figure 2. Maximum Forward Voltage
1.0E−03
IR, REVERSE CURRENT (A)
0.1
0
IF, INSTANTANEOUS FORWARD CURRENT
(A)
10
1.0E−04
TJ = 150C
1.0E−05
1.0E−06
TJ = 125C
1.0E−07
1.0E−08
TJ = 25C
1.0E−09
1.0E−10
0
100
200
300
400
500
600
VR, REVERSE VOLTAGE (V)
Figure 3. Typical Reverse Current
IR, MAXIMUM REVERSE CURRENT (A)
IF, INSTANTANEOUS FORWARD CURRENT
(A)
MURHS160T3G, SURHS8160T3G
1.0E−03
TJ = 150C
1.0E−04
1.0E−05
TJ = 125C
1.0E−06
TJ = 25C
1.0E−07
1.0E−08
1.0E−09
1.0E−10
0
100
200
300
400
VR, REVERSE VOLTAGE (V)
500
Figure 4. Maximum Reverse Current
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3
600
4
2
dc
SQUARE WAVE
1
0
50 60 70 80 90 100 110 120 130 140 150 160 170 180
PFO, AVERAGE POWER DISSIPATION
(W)
IF, AVERAGE FORWARD CURRENT (A)
MURHS160T3G, SURHS8160T3G
10
9
8
7
6
SQUARE
5
4
DC
3
2
1
0
0
1
2
3
4
TC, CASE TEMPERATURE (C)
IO, AVERAGE FORWARD CURRENT (A)
Figure 5. Current Derating
Figure 7. Forward Power Dissipation
5
100
C, CAPACITANCE (pF)
TJ = 25C
10
1
0
20
40
60
80
100
VR, REVERSE VOLTAGE (V)
R(t), TRANSIENT THERMAL RESISTANCE
Figure 6. Capacitance
100
D = 0.6
10
D = 0.2
D = 0.1
D = 0.05
1
D = 0.01
0.1
P(pk)
SINGLE PULSE
t1
t2
0.01
0.000001
DUTY CYCLE, D = t1/t2
0.00001
0.0001
0.001
0.01
0.1
1
t1, TIME (sec)
Figure 8. Thermal Response Junction−to−Ambient
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4
10
100
1000
MURHS160T3G, SURHS8160T3G
PACKAGE DIMENSIONS
SMB
CASE 403A−03
ISSUE H
HE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P.
E
b
DIM
A
A1
b
c
D
E
HE
L
L1
D
POLARITY INDICATOR
OPTIONAL AS NEEDED
MIN
1.90
0.05
1.96
0.15
3.30
4.06
5.21
0.76
MILLIMETERS
NOM
MAX
2.20
2.28
0.10
0.19
2.03
2.20
0.23
0.31
3.56
3.95
4.32
4.60
5.44
5.60
1.02
1.60
0.51 REF
MIN
0.075
0.002
0.077
0.006
0.130
0.160
0.205
0.030
INCHES
NOM
0.087
0.004
0.080
0.009
0.140
0.170
0.214
0.040
0.020 REF
MAX
0.090
0.007
0.087
0.012
0.156
0.181
0.220
0.063
A
L
L1
A1
c
SOLDERING FOOTPRINT*
2.261
0.089
2.743
0.108
2.159
0.085
SCALE 8:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
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Phone: 81−3−5817−1050
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5
ON Semiconductor Website: www.onsemi.com
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For additional information, please contact your local
Sales Representative
MURHS160/D
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