Dual Bootstrapped, 12 V MOSFET Driver with Output Disable

ADP3121
Dual Bootstrapped, 12 V
MOSFET Driver with Output
Disable
The ADP3121 is a dual, high voltage MOSFET driver optimized for
driving two N−channel MOSFETs, the two switches in a non−isolated
synchronous buck power converter. Each driver is capable of driving a
3000 pF load with a 20 ns propagation delay and a 15 ns transition
time.
One of the drivers can be bootstrapped and is designed to handle the
high voltage slew rate associated with floating high−side gate drivers.
The ADP3121 includes overlapping drive protection to prevent
shoot−through current in the external MOSFETs.
The OD pin shuts off both the high−side and the low−side
MOSFETs to prevent rapid output capacitor discharge during system
shutdown.
The ADP3121 is specified over the commercial temperature range
of 0°C to 85°C and is available in 8−lead SOIC_N and 8−lead LFCSP
packages.
http://onsemi.com
MARKING
DIAGRAMS
8
8
SO−8
D SUFFIX
CASE 751−07
1
P3121
ALYW G
G
1
P3121A = Device Code
AL
= Assembly Location
Y
= Year
W
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
Features
•
•
•
•
•
•
•
•
All−In−One Synchronous Buck Driver
Bootstrapped High−Side Drive
One PWM Signal Generates Both Drives
Anticross Conduction Protection Circuitry
Overvoltage Protection
OD for Disabling the Driver Outputs
Meets CPU VR Requirement when Used with Flex−Modet
Controller
These are Pb−Free Devices
8
LFCSP8
MN SUFFIX
CASE 932AF
1
L7Q
#
Y
WW
= Device Code
= Pb−Free Package
= Year
= Work Week
PIN ASSIGNMENT
BST
Typical Applications
• Multiphase Desktop CPU Supplies
• Single Supply Synchronous Buck Converters
L7Q
#YWW
DRVH
IN
SWN
OD
PGND
VCC
DRVL
ORDERING INFORMATION
Device
Package
Shipping†
ADP3121JRZ−RL
SOIC_N
(Pb−Free)
2500/Tape & Reel
ADP3121JCPZ−RL LFCSP_VD 5000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2010
February, 2010 − Rev. 1
1
Publication Order Number:
ADP3121/D
ADP3121
12 V
4
VCC
ADP3121
D1
1
LATCH
R1
Q
R2
S
IN 2
BST
CBST2
CBST1
8
DRVH
DELAY
RBST
7
CMP
CONTROL
LOGIC
5
DELAY
OD 3
Q1
TO
INDUCTOR
SW
VCC
6
CMP
1V
RG
6
DRVL
Q2
PGND
Figure 1. Block Diagram
PIN DESCRIPTION
Pin No.
Pin Name
Description
1
BST
Upper MOSFET Floating Bootstrap Supply. A capacitor connected between the BST and SW pins holds
this bootstrapped voltage for the high−side MOSFET while it is switching.
2
IN
Logic Level PWM Input. This pin has primary control of the drive outputs. In normal operation, pulling this
pin low turns on the low−side driver; pulling it high turns on the high−side driver.
3
OD
4
VCC
Input Supply. This pin should be bypassed to PGND with an ~1 mF ceramic capacitor.
5
DRVL
Synchronous Rectifier Drive. Output drive for the lower (synchronous rectifier) MOSFET.
6
PGND
Power Ground. This pin should be closely connected to the source of the lower MOSFET.
7
SW
8
DRVH
Output Disable. When low, this pin disables normal operation, forcing DRVH and DRVL low.
Switch Node Connection. This pin is connected to the buck switching node, close to the upper MOSFET
source. It is the floating return for the upper MOSFET drive signal. It is also used to monitor the switched
voltage to prevent the lower MOSFET from turning on until the voltage is below ~1 V.
Buck Drive. Output drive for the upper (buck) MOSFET.
http://onsemi.com
2
ADP3121
MAXIMUM RATINGS
Rating
Value
qJA, SOIC_N
2−Layer Board
4−Layer Board
123
90
qJA, LFCSP_VD (Note 1)
4−Layer Board
64.3
Operating Ambient Temperature Range
Unit
°C/W
°C/W
0 to 85
°C
Junction Temperature Range
0 to 150
°C
Storage Temperature Range
−65 to +150
°C
Lead Temperature
Soldering (10 sec)
Vapor Phase (60 sec)
Infrared (15 sec)
300
215
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Internally limited by thermal shutdown, 150°C min. 2−layer board, 1 in2 Cu, 1 oz thickness. 60−180 seconds minimum above 237°C.
NOTE: This device is ESD sensitive. Use standard ESD precautions when handling.
ABSOLUTE MAXIMUM RATINGS (Note 2)
Pin Name
Pin Symbol
Vmax
Vmin
VCC
Main supply voltage input
15 V
−0.3 V
GND
Ground
0V
0V
BST
Bootstrap Supply Voltage Input
DC
<200 ns
BST to SW
SW
Switching Node (Bootstrap Supply Return)
DC
<200 ns
DRVH
VCC + 15
+35
+15
−0.3 V
+15
+25 V
−5 V
−10 V
High−Side Driver Output
DC
<20 ns
<200 ns
BST + 0.3 V
BST + 2.0 V
BST + 0.3 V
SW − 0.3 V
SW − 2.0 V
SW − 2.0 V
DRVL
Low−Side Driver Output
DC
<20 ns
<200 ns
VCC + 0.3 V
VCC + 2.0 V
VCC + 0.3 V
−0.3 V
−2.0 V
−2.0 V
IN
DRVH and DRVL Control Input
6.5 V
−0.3 V
6.5 V
−0.3 V
OD
Outside Disable
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
3. All voltages are with respect to PGND except where noted.
http://onsemi.com
3
ADP3121
ELECTRICAL CHARACTERISTICS (VCC = 12 V, BST = 4.0 V to 26 V, TA = 0°C to 85°C, unless otherwise noted) (Note 1)
Characteristic
Test Conditions
Symbol
Min
VCC
4.15
Typ
Max
Unit
SUPPLY
Supply Voltage Range
Supply Current
BST = 12 V, IN = 0 V
ISYS
2.0
13.2
V
5.0
mA
OD INPUTS
Input Voltage High
2.0
V
Input Voltage Low
Input Current
−1.0
Hysteresis
90
0.8
V
+1.0
mA
250
mV
PWM INPUTS
Input Voltage High
2.0
V
Input Voltage Low
0.8
Input Current
−1.0
Hysteresis
90
+1.0
250
V
mA
mV
HIGH−SIDE DRIVER
Output Resistance, Sourcing Current
BST − SW = 12 V; TA = 25°C
BST − SW = 12 V; TA = 0°C to 85°C
1.7
2.3
2.8
W
Output Resistance, Sinking Current
BST – SW = 12 V; TA = 25°C
BST − SW = 12 V; TA = 0°C to 85°C
1.7
2.3
2.8
W
Output Resistance, Unbiased
BST – SW = 0 V
10
Transition Times
BST – SW = 12 V, CLOAD = 3 nF,
see Figure 4
BST – SW = 12 V, CLOAD = 3 nF,
see Figure 4
trDRVH
20
32
tfDRVH
20
30
BST – SW = 12 V, CLOAD = 3 nF
25°C ≤ TA ≤ 85°C, see Figure 4
tpdhDRVH
30
50
ns
BST – SW = 12 V, CLOAD = 3 nF,
see Figure 4
See Figure 3
See Figure 3
tpdlDRVH
32
47
ns
tpdlOD
tpdhOD
30
20
45
40
Propagation Delay Times
SW Pull−Down Resistance
20
kW
ns
SW to PGND
10
Output Resistance, Sourcing Current
TA = 25°C
TA = 0°C to 85°C
1.8
2.4
2.8
W
Output Resistance, Sinking Current
TA = 25°C
TA = 0°C to 85°C
1.0
1.6
1.8
W
Output Resistance, Unbiased
VCC = PGND
10
Transition Times
CLOAD = 3 nF, see Figure 4
CLOAD = 3 nF, see Figure 4
trDRVL
tfDRVL
20
10
30
20
ns
Propagation Delay Times
CLOAD = 3 nF, see Figure 4
CLOAD = 3 nF, see Figure 4
See Figure 3
See Figure 3
tpdhDRVL
tpdlDRVL
tpdlOD
tpdhOD
35
32
52
ns
100
15
17
37
180
90
70
170
110
kW
LOW−SIDE DRIVER
Timeout Delay
SW = 5.0 V
SW = PGND
Overvoltage Protection Threshold
IN = OD = 0 V, SW = VCC
VSW(OVD)
1.5
VCC rising
1.5
kW
ns
3.5
V
UNDERVOLTAGE LOCKOUT
UVLO Voltage
Hysteresis
3.0
250
1. ALL limits at temperature extremes are guaranteed via correlation using standard statistical quality control (SQC) methods
http://onsemi.com
4
V
mV
ADP3121
Theory of Operation
SW pin to fall from VIN to 1 V. Once the voltage on the SW
pin falls to 1.0 V, Q2 begins turn−on. If the SW pin has not
gone high first, the Q2 turn−on is delayed by a fixed 150 ns.
By waiting for the voltage on the SW pin to reach 1.0 V or
for the fixed delay time, the overlap protection circuit
ensures that Q1 is off before Q2 turns on, regardless of
variations in temperature, supply voltage, input pulse width,
gate charge, and drive current. If SW does not go below
1.0 V after 190 ns, DRVL turns on. This can occur if the
current flowing in the output inductor is negative and flows
through the high−side MOSFET body diode.
The ADP3121 is optimized for driving two N−channel
MOSFETs in a synchronous buck converter topology. A
single PWM input signal is all that is required to properly
drive the high side and the low−side MOSFETs. Each driver
is capable of driving a 3 nF load at speeds up to 500 kHz. A
functional block diagram of ADP3121 is shown in Figure 1.
Low−Side Driver
The low−side driver is designed to drive a ground
referenced N−channel MOSFET. The bias to the low−side
driver is internally connected to the VCC supply and PGND.
When the driver is enabled, the driver output is 180° out
of phase with the PWM input. When the ADP3121 is
disabled, the low−side gate is held low.
Overvoltage Protection
The ADP3121 includes an overvoltage protection (OVP)
feature to protect the CPU from high voltages even before
the main controller has enough VCC to operate. The
ADP3121 looks at the SW node during startup. If the voltage
on SW is greater than the OVP threshold, DRVL is latched
on and DRVH latched off. An OVP on the SW node will
cause DRVL to go high and remain high.
To prevent false triggering of OVP, an input logic
detection latch is set on the first occurrence of either IN or
OD going high. If this second latch is set, then OVP is
enabled. To clear the OVP or the input detected latch, VCC
must fall below UVLO.
High−Side Driver
The high−side driver is designed to drive a floating
N−channel MOSFET. The bias voltage for the high−side
driver is developed by an external bootstrap supply circuit
that is connected between the BST and SW pins.
The bootstrap circuit comprises Diode D1 and Bootstrap
Capacitor CBST1. CBST2 and RBST are included to reduce the
high−side gate drive voltage and to limit the switch node
slew rate (called a Boot−Snap circuit). When the ADP3121
starts up, the SW pin is at ground, so the bootstrap capacitor
charges up to VCC through D1. When the PWM input goes
high, the high−side driver begins to turn on the high−side
MOSFET, Q1, by pulling charge out of CBST1 and CBST2. As
Q1 turns on, the SW pin rises up to VIN and forces the BST
pin to VIN + VC (BST). This holds Q1 on because enough
gate−to−source voltage is provided. To complete the cycle,
Q1 is switched off by pulling the gate down to the voltage at
the SW pin. When the low−side MOSFET, Q2, turns on, the
SW pin is pulled to ground. This allows the bootstrap
capacitor to charge up to VCC again.
The output of the high−side driver is in phase with the
PWM input. When the driver is disabled, the high−side gate
is held low.
Supply Capacitor Selection
For the supply input (VCC) of the ADP3121, a local
bypass capacitor is recommended to reduce the noise and to
supply some of the peak currents that are drawn. Use a
4.7 mF, low ESR capacitor. Multi−layer ceramic chip
(MLCC) capacitors provide the best combination of low
ESR and small size. Keep the ceramic capacitor as close as
possible to the ADP3121.
Bootstrap Circuit
The bootstrap circuit uses a charge storage capacitor
(CBST) and a diode, as shown in Figure 1. These components
can be selected after the high−side MOSFET is chosen. The
bootstrap capacitor must have a voltage rating that can
handle twice the maximum supply voltage. A minimum
50 V rating is recommended. The capacitor values are
determined by
Overlap Protection Circuit
The overlap protection circuit prevents both of the main
power switches, Q1 and Q2, from being on at the same time.
This is done to prevent shoot−through currents from flowing
through both power switches and the associated losses that
can occur during their on/off transitions. The overlap
protection circuit accomplishes this by adaptively
controlling the delay from the Q1 turn−off to the Q2 turn−on,
and by internally setting the delay from the Q2 turn−off to
the Q1 turn−on.
To prevent the overlap of the gate drives during the Q1
turn−off and the Q2 turn−on, the overlap circuit monitors the
voltage at the SW pin. When the PWM input signal goes low,
Q1 begins to turn off (after propagation delay). Before Q2
can turn on, the overlap protection circuit makes sure that
SW has first gone high and then waits for the voltage at the
C BST1 ) C BST2 + 10
Q GATE
V GATE
C BST1
V GATE
+
V CC * V D
C BST1 ) C BST2
(eq. 1)
(eq. 2)
where:
QGATE is the total gate charge of the high−side MOSFET at
VGATE.
VGATE is the desired gate drive voltage (usually in the range
of 5.0 V to 10 V, 7.0 V being typical).
VD is the voltage drop across D1.
http://onsemi.com
5
ADP3121
However, because of potentially large currents flowing in
the MOSFETs at the on and off times (this current is usually
larger at turn−off due to ramping up of the output current in
the output inductor), the source lead inductance generates a
significant voltage when the high−side MOSFETs switch
off. This creates a significant drain−source voltage spike
across the internal die of the MOSFETs and can lead to a
catastrophic avalanche. The mechanisms involved in this
avalanche condition are referenced in literature from the
MOSFET suppliers.
The MOSFET vendor should provide a rating for the
maximum voltage slew rate at drain current around which this
can be designed. Once this specification is obtained,
determine the maximum current expected in the MOSFET
by:
Re−arranging Equation 1 and Equation 2 to solve for
CBST1 yields:
Q GATE
V CC * V D
C BST1 + 10
CBST2 can then be found by rearranging Equation 1.
C BST2 + 10
Q GATE
* C BST1
V GATE
For example, an NTD60N02 has a total gate charge of
about 12 nC at VGATE = 7.0 V. Using VCC = 12 V and
VD = 0.1 V, then CBST1 = 12 nF and CBST2 = 6.8 nF. Good
quality ceramic capacitors should be used.
RBST is used to limit slew rate and minimize ringing at the
switch node. It also provides peak current limiting through
D1. An RBST value of 1.5 W to 2.2 W is a good choice. The
resistor needs to handle at least 250 mW due to the peak
currents that flow through it.
A small signal diode can be used for the bootstrap diode
due to the ample gate drive voltage supplied by VCC. The
bootstrap diode must have a minimum 15 V rating to
withstand the maximum supply voltage. The average
forward current can be estimated by:
I F(AVG) + Q GATE
f MAX
I MAX + I DC(per phase) ) (V CC * V OUT)
(eq. 5)
where:
DMAX is determined for the VR controller being used with
the driver. This current is divided roughly equally between
MOSFETs if more than one is used (assume a worst−case
mismatch of 30% for design margin).
LOUT is the output inductor value.
When producing the design, there is no exact method for
calculating the dV/dt due to the parasitic effects in the
external MOSFETs as well as the PCB. However, it can be
measured to determine if it is safe. If it appears that the dV/dt
is too fast, an optional gate resistor can be added between
DRVH and the high−side MOSFETs. This resistor slows
down the dV/dt, but it increases the switching losses in the
high−side MOSFETs. The ADP3121 is optimally designed
with an internal drive impedance that works with most
MOSFETs to switch them efficiently, yet minimizes dV/dt.
However, some high speed MOSFETs can require this
external gate resistor depending on the currents being
switched in the MOSFET.
(eq. 3)
where fMAX is the maximum switching frequency of the
controller.
The peak surge current rating should be calculated by:
I F(PEAK) +
V CC * V D
R BST
D MAX
f MAX L OUT
(eq. 4)
MOSFET Selection
When interfacing the ADP3121 to external MOSFETs,
the designer should consider ways to make a robust design
that minimizes stresses on both the driver and the
MOSFETs. These stresses include exceeding the short time
duration voltage ratings on the driver pins as well as the
external MOSFET.
It is also highly recommended to use the Boot−Snap
circuit to improve the interaction of the driver with the
characteristics of the MOSFETs. If a simple bootstrap
arrangement is used, make sure to include a proper snubber
network on the SW node.
Low−Side (Synchronous) MOSFETs
The low−side MOSFETs are usually selected to have a
low on resistance to minimize conduction losses. This
usually implies a large input gate capacitance and gate
charge. The first concern is to make sure the power delivery
from the ADP3121 DRVL does not exceed the thermal
rating of the driver (see the ADP3186, ADP3188, or
ADP3189 data sheets for Flex−Mode controller details).
The next concern for the low−side MOSFETs is to prevent
them from being inadvertently switched on when the
high−side MOSFET turns on. This occurs due to the
drain−gate (Miller capacitance, also specified as Crss
capacitance) of the MOSFET. When the drain of the
low−side MOSFET is switched to VCC by the high−side
turning on (at a dV/dt rate), the internal gate of the low−side
MOSFET is pulled up by an amount roughly equal to VCC
× (Crss/Ciss). It is important to make sure this does not put the
MOSFET into conduction.
High−Side (Control) MOSFETs
A high−side, high speed MOSFET is usually selected to
minimize switching losses (see the ADP3186 or ADP3188
data sheet for Flex−Mode controller details). This typically
implies a low gate resistance and low input
capacitance/charge device. Yet, a significant source lead
inductance can also exist that depends mainly on the
MOSFET package; it is best to contact the MOSFET vendor
for this information.
The ADP3121 DRVH output impedance and the input
resistance of the MOSFETs determine the rate of charge
delivery to the internal capacitance of the gate. This
determines the speed at which the MOSFETs turn on and off.
http://onsemi.com
6
ADP3121
Another consideration is the nonoverlap circuitry of the
ADP3121 that attempts to minimize the nonoverlap period.
During the state of the high−side turning off to low−side
turning on, the SW pin is monitored (as well as the
conditions of SW prior to switching) to adequately prevent
overlap.
However, during the low−side turn−off to high−side
turn−on, the SW pin does not contain information for
determining the proper switching time, so the state of the
DRVL pin is monitored to go below one sixth of VCC; then,
a delay is added. Due to the Miller capacitance and internal
delays of the low−side MOSFET gate, ensure that the
Miller−to−input capacitance ratio is low enough, and that the
low−side MOSFET internal delays are not so large as to
allow accidental turn−on of the low−side when the high−side
turns on. Contact ON Semiconductor for an updated list of
recommended low−side MOSFETs.
Figure 2 shows an example of the typical land patterns
based on the guidelines given previously. For more detailed
layout guidelines for a complete CPU voltage regulator
subsystem, refer to the PC Board Layout Considerations
section of the ADP3188 data sheet.
CBST1
CBST2
RBST
PC Board Layout Considerations
Use these general guidelines when designing printed
circuit boards:
• Trace out the high current paths and use short, wide
(>20 mil) traces to make these connections.
• Minimize trace inductance between DRVH and DRVL
outputs and MOSFET gates.
• Connect the PGND pin of the ADP3121 as closely as
possible to the source of the lower MOSFET.
• Locate the VCC bypass capacitor as close as possible to
the VCC and PGND pins.
• Use vias to other layers, when possible, to maximize
thermal conduction away from the IC.
CVCC
Figure 2. External Component
Placement Example
http://onsemi.com
7
ADP3121
OD
tpdlOD
DRVH
OR
DRVL
tpdhOD
90%
10%
Figure 3. Output Disable Timing Diagram
IN
tpdlDRVL
tfDRVL
trDRVL
tpdlDRVH
DRVL
tpdhDRVH
tfDRVH
trDRVH
VTH
VTH
DRVH−SW
tpdhDRVL
1V
SW
Figure 4. Timing Diagram
http://onsemi.com
8
ADP3121
PACKAGE DIMENSIONS
SOIC−8 NB
CASE 751−07
ISSUE AJ
−X−
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
A
8
5
S
B
0.25 (0.010)
M
Y
M
1
4
−Y−
K
G
C
N
DIM
A
B
C
D
G
H
J
K
M
N
S
X 45 _
SEATING
PLANE
−Z−
0.10 (0.004)
H
D
0.25 (0.010)
M
Z Y
S
X
M
J
S
SOLDERING FOOTPRINT*
1.52
0.060
7.0
0.275
4.0
0.155
0.6
0.024
1.270
0.050
SCALE 6:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
9
MILLIMETERS
MIN
MAX
4.80
5.00
3.80
4.00
1.35
1.75
0.33
0.51
1.27 BSC
0.10
0.25
0.19
0.25
0.40
1.27
0_
8_
0.25
0.50
5.80
6.20
INCHES
MIN
MAX
0.189
0.197
0.150
0.157
0.053
0.069
0.013
0.020
0.050 BSC
0.004
0.010
0.007
0.010
0.016
0.050
0 _
8 _
0.010
0.020
0.228
0.244
ADP3121
PACKAGE DIMENSIONS
LFCSP8 3x3, 0.5P
CASE 932AF−01
ISSUE O
D
D1
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSIONS: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30mm FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A B
PIN ONE
REFERENCE
E1
E
0.25 C
DIM
A
A1
A3
b
D
D1
D2
E
E1
E2
e
H
K
L
M
0.25 C
TOP VIEW
H
0.10 C
(A3)
A
NOTE 4
0.08 C
4X
A1
SIDE VIEW
M
K
1
L
4X
D2
SEATING
PLANE
M
SOLDERING FOOTPRINT*
E2
PIN 1
INDICATOR
8X
C
8
MILLIMETERS
MIN
MAX
0.80
0.90
0.00
0.05
0.20 REF
0.18
0.30
3.00 BSC
2.75 BSC
1.59
1.89
3.00 BSC
2.75 BSC
1.30
1.60
0.50 BSC
−−−
12 °
0.20
−−−
0.30
0.50
−−−
0.60
8X
0.63
1.90
8X
b
e
0.10 C A B
BOTTOM VIEW
0.05 C
NOTE 3
1.61
PACKAGE
OUTLINE
3.30
1
0.50
PITCH
0.30
8X
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
FlexMode is a trademark of Analog Devices, Inc.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
http://onsemi.com
10
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
ADP3121/D
Similar pages