Data Sheet

;6
21
BGU6009/N2
Low-noise amplifier MMIC for GPS, GLONASS, Galileo and
COMPASS
Rev. 3 — 15 March 2016
Product data sheet
1. Product profile
1.1 General description
The BGU6009/N2 is a Low-Noise Amplifier (LNA) for GNSS receiver applications in a
plastic leadless 6-pin, very thin small outline SOT1230 package. The BGU6009/N2
requires only one external matching inductor and one external decoupling capacitor.
1.2 Features and benefits














Covers full GNSS L1 band, from 1559 MHz to 1610 MHz
Noise figure = 0.9 dB
Gain 17 dB
High input 1 dB compression point Pi(1dB) of 4 dBm
High out of band IP3i of 7 dBm
Supply voltage 1.5 V to 3.1 V
Power-down mode current consumption < 2 A
Optimized performance at low supply current of 5.1 mA
Integrated matching for the output
Requires only one input matching inductor and one supply decoupling capacitor
Input and output DC decoupled
ESD protection on all pins (HBM > 2 kV)
Integrated temperature stabilized bias for easy design
Small 6-pin leadless package 1.1 mm  0.9 mm  0.47 mm; 0.4 mm pitch: SOT1230
1.3 Applications
LNA for GPS, GLONASS, Gallileo and COMPASS (Beidou).







Smart phones and feature phones
Tablet PCs
Personal Navigation Devices
Digital Still Cameras
Digital Video Cameras
RF front-end modules
Complete GPS chip set modules and theft protection (laptop, ATM)
BGU6009/N2
NXP Semiconductors
Low-noise amplifier MMIC for GPS, GLONASS, Galileo and COMPASS
1.4 Quick reference data
Table 1.
Quick reference data
f = 1559 MHz to 1610 MHz; VCC = 1.8 V; VI(ENABLE)  0.9 V; Pi < 40 dBm; Tamb = 25 C; input
matched to 50  using a 6.8 nH inductor; unless otherwise specified.
Symbol Parameter
VCC
supply voltage
ICC
supply current
Gp
power gain
Conditions
Min Typ Max Unit
RF input AC coupled
1.5
1.8
3.1
V
-
5.1
-
mA
-
17
-
dB
-
0.9
-
dB
VCC = 1.8 V
-
7
-
dBm
VCC = 2.85 V
-
4
-
dBm
no jammer
NF
noise figure
no jammer
Pi(1dB)
input power at 1 dB
gain compression
f = 1575 MHz
[1]
input third-order intercept point f = 1575 MHz
IP3i
VCC = 1.8 V
[2]
-
5
-
dBm
VCC = 2.85 V
[2]
-
7
-
dBm
[1]
PCB losses are subtracted.
[2]
f1 = 1713 MHz; f2 = 1851 MHz; Pi = 20 dBm at f1; Pi = 65 dBm at f2.
2. Pinning information
Table 2.
Pinning
Pin
Description
1
GND
2
VCC
3
RF_OUT
4
GND_RF
5
RF_IN
6
ENABLE
Simplified outline
Graphic symbol
DDD
transparent top view
3. Ordering information
Table 3.
Ordering information
Type number
BGU6009/N2
Package
Name
Description
Version
XSON6
plastic very thin small outline package; no leads;
6 terminals; body 1.1  0.9  0.47 mm
SOT1230
4. Marking
Table 4.
BGU6009_N2
Product data sheet
Marking codes
Type number
Marking code
BGU6009/N2
W
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 15 March 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
2 of 10
BGU6009/N2
NXP Semiconductors
Low-noise amplifier MMIC for GPS, GLONASS, Galileo and COMPASS
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
VCC
supply voltage
RF input AC coupled
Min
Max
Unit
0.5
+5.0
V
[1]
VI(ENABLE)
input voltage on pin ENABLE
VI(ENABLE) < VCC + 0.6 V
0.5
+5.0
V
VI(RF_IN)
input voltage on pin RF_IN
DC; VI(RF_IN) < VCC + 0.6 V
[1][2]
0.5
+5.0
V
DC; VI(RF_OUT) < VCC + 0.6 V
[1][2]
0.5
+5.0
V
-
10
dBm
VI(RF_OUT)
input voltage on pin RF_OUT
Pi
input power
Tsp  130 C
[3]
Ptot
total power dissipation
-
55
mW
Tstg
storage temperature
65
+150
C
Tj
junction temperature
-
150
C
VESD
electrostatic discharge voltage
Human Body Model (HBM) according to
ANSI/ESDA/JEDEC standard JS-001
-
2.5
kV
Charged Device Model (CDM) according to
JEDEC standard JESD22-C101
-
1
kV
[1]
Warning: due to internal ESD diode protection, the applied DC voltage should not exceed VCC + 0.6 V and shall not exceed 5.0 V to
avoid excess current.
[2]
The RF input and RF output are AC coupled through internal DC blocking capacitor.
[3]
Tsp is the temperature at the soldering point of GND_RF (pin 4).
6. Thermal characteristics
Table 6.
Thermal characteristics
Symbol
Parameter
Rth(j-sp)
thermal resistance from junction to solder point
Conditions
Typ
Unit
225
K/W
7. Characteristics
Table 7.
Characteristics at VCC = 1.8 V
f = 1559 MHz to 1610 MHz; VCC = 1.8 V; VI(ENABLE)  0.9 V; Pi < 40 dBm; Tamb = 25 C; input matched to 50  using a
6.8 nH inductor; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max Unit
VCC
supply voltage
RF input AC coupled
-
1.8
-
V
ICC
supply current
VI(ENABLE)  0.9 V
-
5.1
-
mA
VI(ENABLE)  0.3 V
-
-
2
A
no jammer
-
17
-
dB
Gp
power gain
RLin
input return loss
-
12
-
dB
RLout
output return loss
-
11
-
dB
ISL
isolation
-
25
-
dB
-
0.9
-
dB
-
7
-
dBm
-
5
-
dBm
NF
noise figure
no jammer
Pi(1dB)
input power at 1 dB
gain compression
f = 1575 MHz
IP3i
input third-order intercept point
f = 1575 MHz
BGU6009_N2
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 15 March 2016
[1]
[2]
© NXP Semiconductors N.V. 2016. All rights reserved.
3 of 10
BGU6009/N2
NXP Semiconductors
Low-noise amplifier MMIC for GPS, GLONASS, Galileo and COMPASS
Table 7.
Characteristics at VCC = 1.8 V …continued
f = 1559 MHz to 1610 MHz; VCC = 1.8 V; VI(ENABLE)  0.9 V; Pi < 40 dBm; Tamb = 25 C; input matched to 50  using a
6.8 nH inductor; unless otherwise specified.
Symbol
Parameter
Conditions
turn-on time
[3]
toff
turn-off time
[3]
K
Rollett stability factor
ton
[1]
Min
Typ
Max Unit
-
-
2
s
-
-
1
s
1
-
-
-
PCB losses are subtracted.
[2]
f1 = 1713 MHz; f2 = 1851 MHz; Pi = 20 dBm at f1; Pi = 65 dBm at f2.
[3]
Within 10 % of the final gain.
Table 8.
Characteristics at VCC = 2.85 V
f = 1559 MHz to 1610 MHz; VCC = 2.85 V; VI(ENABLE)  0.9 V; Pi < 40 dBm; Tamb = 25 C; input matched to 50  using a
6.8 nH inductor; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max Unit
VCC
supply voltage
RF input AC coupled
-
2.85 -
V
ICC
supply current
VI(ENABLE)  0.9 V
-
5.5
-
mA
VI(ENABLE)  0.3 V
-
-
2
A
no jammer
-
17.5 -
dB
Gp
power gain
RLin
input return loss
-
13
-
dB
RLout
output return loss
-
11
-
dB
ISL
isolation
-
25
-
dB
-
0.95 -
dB
-
4
-
dBm
[2]
-
7
-
dBm
turn-on time
[3]
-
-
2
s
toff
turn-off time
[3]
K
Rollett stability factor
NF
noise figure
no jammer
Pi(1dB)
input power at 1 dB
gain compression
f = 1575 MHz
IP3i
input third-order intercept point
f = 1575 MHz
ton
[1]
[1]
-
-
1
s
1
-
-
-
PCB losses are subtracted.
[2]
f1 = 1713 MHz; f2 = 1851 MHz; Pi = 20 dBm at f1; Pi = 65 dBm at f2.
[3]
Within 10 % of the final gain.
Table 9.
ENABLE (pin 6)
40 C  Tamb  +85 C; 1.5 V  VCC  3.1 V.
VI(ENABLE) (V)
State
 0.3
OFF
 0.9
ON
BGU6009_N2
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 15 March 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
4 of 10
BGU6009/N2
NXP Semiconductors
Low-noise amplifier MMIC for GPS, GLONASS, Galileo and COMPASS
8. Application information
8.1 GNSS LNA
9HQ 9FF
5)LQ
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/
,&
5)RXW
DDD
For a list of components, see Table 10.
Fig 1.
Schematics GNSS LNA evaluation board
Table 10. List of components
For schematics, see Figure 1.
BGU6009_N2
Product data sheet
Component
Description
Value
C1
decoupling capacitor
1 nF
IC1
BGU6009/N2
-
L1
high-quality matching inductor 6.8 nH
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 15 March 2016
Remarks
NXP Semiconductors
Murata LQW15A
© NXP Semiconductors N.V. 2016. All rights reserved.
5 of 10
BGU6009/N2
NXP Semiconductors
Low-noise amplifier MMIC for GPS, GLONASS, Galileo and COMPASS
9. Package outline
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Package outline SOT1230 (XSON6)
BGU6009_N2
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 15 March 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
6 of 10
BGU6009/N2
NXP Semiconductors
Low-noise amplifier MMIC for GPS, GLONASS, Galileo and COMPASS
10. Handling information
CAUTION
This device is sensitive to ElectroStatic Discharge (ESD). Observe precautions for handling
electrostatic sensitive devices.
Such precautions are described in the ANSI/ESD S20.20, IEC/ST 61340-5, JESD625-A or
equivalent standards.
11. Abbreviations
Table 11.
Abbreviations
Acronym
Description
ATM
Automated Teller Machine (cash dispenser)
ESD
ElectroStatic Discharge
GLONASS
GLObal NAvigation Satellite System
GNSS
Global Navigation Satellite System
GPS
Global Positioning System
HBM
Human Body Model
LNA
Low-Noise Amplifier
MMIC
Monolithic Microwave Integrated Circuit
PCB
Printed-Circuit Board
12. Revision history
Table 12.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
BGU6009_N2 v.3
20160315
Product data sheet
-
BGU6009_N2 v.2
-
BGU6009_N2 v.1
Modifications:
BGU6009_N2 v.2
Modifications:
BGU6009_N2 v.1
BGU6009_N2
Product data sheet
•
Marking code F changed into W
20141106
•
Product data sheet
Table 1 on page 2: The value of the inductor has been corrected.
20141001
Product data sheet
-
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 15 March 2016
-
© NXP Semiconductors N.V. 2016. All rights reserved.
7 of 10
BGU6009/N2
NXP Semiconductors
Low-noise amplifier MMIC for GPS, GLONASS, Galileo and COMPASS
13. Legal information
13.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
13.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
BGU6009_N2
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 15 March 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
8 of 10
BGU6009/N2
NXP Semiconductors
Low-noise amplifier MMIC for GPS, GLONASS, Galileo and COMPASS
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
BGU6009_N2
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 15 March 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
9 of 10
BGU6009/N2
NXP Semiconductors
Low-noise amplifier MMIC for GPS, GLONASS, Galileo and COMPASS
15. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
8.1
9
10
11
12
13
13.1
13.2
13.3
13.4
14
15
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal characteristics . . . . . . . . . . . . . . . . . . 3
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Application information. . . . . . . . . . . . . . . . . . . 5
GNSS LNA . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6
Handling information. . . . . . . . . . . . . . . . . . . . . 7
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 7
Legal information. . . . . . . . . . . . . . . . . . . . . . . . 8
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 8
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Contact information. . . . . . . . . . . . . . . . . . . . . . 9
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2016.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 15 March 2016
Document identifier: BGU6009_N2