Features • Permanent and reversible software write protection for the first-half of the array – Software procedure to verify write protect status • Hardware write protection for the entire array • Low-voltage and standard-voltage operation • • • • • • • • • • • – 1.7 (VCC = 1.7V to 5.5V) Internally organized 256 x 8 Two-wire serial interface Schmitt trigger, filtered inputs for noise suppression Bidirectional data transfer protocol 100kHz (1.7V) and 400kHz (2.7V and 5.0V) compatibility 16-byte page write modes Partial page writes are allowed Self-timed write cycle (5ms max) High-reliability – Endurance: 1 million write cycles – Data retention: 100 years 8-lead JEDEC SOIC, 8-lead UDFN, 8-lead TSSOP, and 8-ball VFBGA packages Die sales: wafer form, tape and reel, and bumped wafers 2K (256 x 8) Description The Atmel® AT34C02C provides 2048 bits of serial electrically-erasable and programmable read only memory (EEPROM) organized as 256 words of eight bits each. The first-half of the device incorporates a permanent and a reversible software write protection feature while hardware write protection for the entire array is available via an external pin. Once the permanent software write protection is enabled, by sending a special command to the device, it cannot be reversed. However, the reversible software write protection is enabled and can be reversed by sending a special command. The hardware write protection is controlled with the WP pin and can be used to protect the entire array, whether or not the software write protection has been enabled. This allows the user to protect none, first-half, or all of the array depending on the application. The device is optimized for use in many industrial and commercial applications where low-power and low-voltage operations are essential. The AT34C02C is available in space saving 8-lead JEDEC SOIC, 8-lead UDFN, 8-lead TSSOP, and 8-ball VFBGA packages and is accessed via a Two-wire serial interface. It is available in 1.7V (1.7V to 5.5V). 8-ball dBGA2 8-lead TSSOP 1 2 3 4 A0 A1 A2 GND 8 7 6 5 8-lead SOIC A0 A1 A2 GND 1 2 3 4 Two-wire Serial Electrically-erasable and Programmable Read Only Memory with Permanent and Reversible Software Write Protect 8 7 6 5 VCC WP SCL SDA VCC WP SCL SDA 8 1 7 2 6 3 5 4 A0 A1 A2 GND Bottom View VCC WP SCL SDA Atmel AT34C02C Not Recommended for New Design Replaced by AT34C02D 8-lead UDFN VCC WP SCL SDA 8 7 6 5 1 2 3 4 A0 A1 A2 GND Bottom View 5185F–SEEPROM–102014 Table 0-1. 1. Pin Configurations Pin Name Function A0 - A2 Address inputs SDA Serial data SCL Serial clock input WP Write protect Absolute Maximum Ratings* *NOTICE: Operating temperature . . . . . . . . . . . . . . –55°C to +125°C Storage temperature . . . . . . . . . . . . . . . . –65 °C to +150°C Voltage on any pin with respect to ground . . . . . . . . . . . . . . . . .–1.0V to +7.0V Maximum operating voltage . . . . . . . . . . . . . . . . . . . . 6.25V Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. DC output current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.0mA Figure 1-1. Block Diagram VCC GND WP START STOP LOGIC SCL SDA SERIAL CONTROL LOGIC WRITE PROTECT CIRCUITRY EN H.V. PUMP/TIMING LOAD A2 A1 A0 R/W COMP LOAD DATA WORD ADDR/COUNTER DATA RECOVERY SOFTWARE WRITE PROTECTED AREA (00H - 7FH) INC X DEC DEVICE ADDRESS COMPARATOR EEPROM Y DEC DIN SERIAL MUX DOUT/ACK LOGIC DOUT 2 AT34C02C 5185F–SEEPROM–102014 AT34C02C 2. Pin Description SERIAL CLOCK (SCL): The SCL input is used to positive edge clock data into each EEPROM device and negative edge clock data out of each device. SERIAL DATA (SDA): The SDA pin is bidirectional for serial data transfer. This pin is open-drain driven and may be wireORed with any number of other open-drain or open collector devices. DEVICE/PAGE ADDRESSES (A2, A1, A0): The A2, A1, and A0 pins are device address inputs that are hardwired (directly to GND or to Vcc) for compatibility with other Atmel AT24Cxx devices. When the pins are hardwired, as many as eight 2K devices may be addressed on a single bus system. (Device addressing is discussed in detail under “Device Addressing,” page 9.) A device is selected when a corresponding hardware and software match is true. If these pins are left floating, the A2, A1, and A0 pins will be internally pulled down to GND. However, due to capacitive coupling that may appear during customer applications, Atmel recommends always connecting the address pins to a known state. When using a pull-up resistor, Atmel recommends using 10k or less. WRITE PROTECT (WP): The write protect input, when connected to GND, allows normal write operations. When WP is connected directly to Vcc, all write operations to the memory are inhibited. If the pin is left floating, the WP pin will be internally pulled down to GND. However, due to capacitive coupling that may appear during customer applications, Atmel recommends always connecting the WP pins to a known state. When using a pull-up resistor, Atmel recommends using 10k or less. Table 2-1. AT34C02C Write Protection Modes WP pin status Permanent write protect register Reversible write protect register Part of the array write protected VCC – – Full array (2K) GND or floating Not programmed Not programmed Normal read/write GND or floating Programmed – First-half of array (1K: 00H - 7FH) GND or floating – Programmed First-half of array (1K: 00H - 7FH) Table 2-2. Pin Capacitance(1) Applicable over recommended operating range from TA = 25C, f = 100 kHz, VCC = +1.7V Symbol Test condition CI/O CIN Note: Max Units Conditions Input/output capacitance (SDA) 8 pF VI/O = 0V Input capacitance (A0, A1, A2, SCL) 6 pF VIN = 0V 1. This parameter is characterized and is not 100% tested 3 5185F–SEEPROM–102014 Table 2-3. DC Characteristics Applicable over recommended operating range from: TAI = –40°C to +85°C, VCC = +1.7V to +5.5V, (unless otherwise noted) Symbol Parameter Test Condition VCC Supply voltage ICC Supply current VCC = 5.0V READ at 100kHz ICC Supply current VCC = 5.0V ISB1 Max Units 5.5 V 0.4 1.0 mA WRITE at 100kHz 2.0 3.0 mA Standby current VCC = 1.7V VIN = VCC or VSS 0.6 3.0 µA ISB2 Standby current VCC = 3.6V VIN = VCC or VSS 1.6 4.0 µA ISB3 Standby current VCC = 5.5V VIN = VCC or VSS 8.0 18.0 µA ILI Input leakage current VIN = VCC or VSS 0.10 3.0 µA ILO Output leakage current Typ VOUT = VCC or VSS 0.05 3.0 µA –0.6 VCC x 0.3 V VCC x 0.7 VCC + 0.5 V 1.7 (1) Input low level VIL Min (1) VIH Input high level VOL2 Output low level VCC = 3.0V IOL = 2.1mA 0.4 V VOL1 Output low level VCC = 1.7V IOL = 0.15mA 0.2 V Note: 1. VIL min and VIH max are reference only and are not tested Table 2-4. AC Characteristics Applicable over recommended operating range from TAI = –40C to +85C, VCC = +1.7V to +5.5V, CL = 1 TTL Gate and 100pF (unless otherwise noted) 1.7V Symbol Parameter Min fSCL Clock frequency, SCL tLOW Clock pulse width low tHIGH Clock pulse width high 2.7V, 5.0V Max Min 100 Max Units 400 kHz 4.7 1.2 µs 4.0 0.6 µs (1) tI Noise suppression time 100 tAA Clock low to data out valid 0.1 tBUF Time the bus must be free before a new transmission can start(1) 4.7 1.2 µs tHD.STA Start hold time 4.0 0.6 µs tSU.STA Start set-up time 4.7 0.6 µs tHD.DAT Data in hold time 0 0 µs tSU.DAT Data In set-up time 200 100 ns (1) Inputs rise time tR (1) 4.5 0.1 50 ns 0.9 µs 1.0 0.3 µs 300 300 ns tF Inputs fall time tSU.STO Stop set-up time 4.7 0.6 µs tDH Data out hold time 100 50 ns tWR Write cycle time Endurance(1) 25C, page mode Note: 4 5 1M 5 1M ms Write cycles 1. This parameter is characterized and is not 100% tested. AT34C02C 5185F–SEEPROM–102014 AT34C02C 3. Memory Organization Atmel AT34C02C, 2K Serial EEPROM: The 2K is internally organized with 16 pages of 16 bytes each. Random word addressing requires a 8-bit data word address. 4. Device Operation CLOCK and DATA TRANSITIONS: The SDA pin is normally pulled high with an external device. Data on the SDA pin may change only during SCL low time periods (see Figure 4-3 on page 6). Data changes during SCL high periods will indicate a start or stop condition as defined below. START CONDITION: A high-to-low transition of SDA with SCL high is a start condition which must precede any other command (see Figure 4-4 on page 6). STOP CONDITION: A low-to-high transition of SDA with SCL high is a stop condition. After a read sequence, the stop command will place the EEPROM in a standby power mode (see Figure 4-4 on page 6). ACKNOWLEDGE: All addresses and data words are serially transmitted to and from the EEPROM in 8-bit words. The EEPROM sends a zero to acknowledge that it has received each word. This happens during the ninth clock cycle. STANDBY MODE: The Atmel AT34C02C features a low-power standby mode which is enabled: • Upon power-up or • After the receipt of the STOP bit and the completion of any internal operations MEMORY RESET: After an interruption in protocol, power loss or system reset, any Two-wire part can be reset by following these steps: • Clock up to nine cycles, • Look for SDA high in each cycle while SCL is high, and then • Create a Start condition. Figure 4-1. Bus Timing SCL: Serial Clock SDA: Serial Data I/O tHIGH tF tR tLOW SCL tSU.STA tHD.STA tHD.DAT tSU.DAT tSU.STO SDA In tAA tDH tBUF SDA Out 5 5185F–SEEPROM–102014 Figure 4-2. Write cycle Timing SCL: Serial Clock SDA: Serial Data I/O SCL 8th bit SDA AC WORDn twr(1) Start Condition Stop Condition Note: 1. The write cycle time tWR is the time from a valid stop condition of a write sequence to the end of the internal clear/write cycle. Figure 4-3. Data Validity SDA SCL Data Stable Data Stable Data Change Figure 4-4. Start and Stop Condition SDA SCL Start 6 Stop AT34C02C 5185F–SEEPROM–102014 AT34C02C Figure 4-5. Output Acknowledge 1 SCL 8 9 Data In Data Out Start 5. Acknowledge Device Addressing The 2K EEPROM device requires an 8-bit device address word following a start condition to enable the chip for a read or write operation (see Figure 8-1 on page 12). The device address word consists of a mandatory one-zero sequence for the first four most-significant bits (1010) for normal read and write operations and 0110 for writing to the write protect register. The next three bits are the A2, A1, and A0 device address bits for the Atmel AT34C02C EEPROM. These three bits must compare to their corresponding hard-wired input pins. The eighth bit of the device address is the read/write operation select bit. A read operation is initiated if this bit is high and a write operation is initiated if this bit is low. Upon a compare of the device address, the EEPROM will output a zero. If a compare is not made, the chip will return to a standby state. The device will not acknowledge if the write protect register has been programmed and the control code is 0110. 6. Write Operations BYTE WRITE: A write operation requires an 8-bit data word address following the device address word and acknowledgment. Upon receipt of this address, the EEPROM will again respond with a zero and then clock in the first 8-bit data word. Following receipt of the 8-bit data word, the EEPROM will output a zero and the addressing device, such as a microcontroller, must terminate the write sequence with a stop condition. At this time the EEPROM enters an internallytimed write cycle, tWR, to the nonvolatile memory. All inputs are disabled during this write cycle and the EEPROM will not respond until the write is complete (see Figure 8-2 on page 12). The device will acknowledge a write command, but not write the data, if the software or hardware write protection has been enabled. The write cycle time must be observed even when the write protection is enabled. PAGE WRITE: The 2K device is capable of 16-byte page write. A page write is initiated the same as a byte write, but the microcontroller does not send a stop condition after the first data word is clocked in. Instead, after the EEPROM acknowledges receipt of the first data word, the microcontroller can transmit up to fifteen more data words. The EEPROM will respond with a zero after each data word received. The microcontroller must terminate the page write sequence with a stop condition (see Figure 8-3 on page 12). 7 5185F–SEEPROM–102014 The data word address lower four bits are internally incremented following the receipt of each data word. The higher data word address bits are not incremented, retaining the memory page row location. When the word address, internally generated, reaches the page boundary, the following byte is placed at the beginning of the same page. If more than sixteen data words are transmitted to the EEPROM, the data word address will “roll over” and previous data will be overwritten. The address “roll over” during write is from the last byte of the current page to the first byte of the same page. The device will acknowledge a write command, but not write the data, if the software or hardware write protection has been enabled. The write cycle time must be observed even when the write protection is enabled. ACKNOWLEDGE POLLING: Once the internally-timed write cycle has started and the EEPROM inputs are disabled, acknowledge polling can be initiated. This involves sending a start condition followed by the device address word. The read/write bit is representative of the operation desired. Only if the internal write cycle has completed will the EEPROM respond with a zero allowing the read or write sequence to continue. 7. Write Protection The software write protection, once enabled, write protects only the first-half of the array (00H - 7FH) while the hardware write protection, via the WP pin, is used to protect the entire array. PERMANENT SOFTWARE WRITE PROTECTION: The software write protection is enabled by sending a command, similar to a normal write command, to the device which programs the permanent write protect register. This must be done with the WP pin low. The write protect register is programmed by sending a write command with the device address of 0110 instead of 1010 with the address and data bit being don’t cares (see Figure 7-1 on page 8). Once the software write protection has been enabled, the device will no longer acknowledge the 0110 control byte. The software write protection cannot be reversed even if the device is powered down. The write cycle time must be observed. REVERSIBLE SOFTWARE WRITE PROTECTION: The reversible software write protection is enabled by sending a command, similar to a normal write command, to the device which programs the reversible write protect register. This must be done with the WP pin low. The write protect register is programmed by sending a write command 01100010 with pins A2 and A1 tied to ground or don't connect and pin A0 connected to VHV (see Figure 7-2). The reversible write protection can be reversed by sending a command 01100110 with pin A2 tied to ground or no connect, pin A1 tied to VCC and pin A0 tied to VHV (see Figure 7-3). HARDWARE WRITE PROTECTION: The WP pin can be connected to VCC, GND, or left floating. Connecting the WP pin to VCC will write protect the entire array, regardless of whether or not the software write protection has been enabled. The software write protection register cannot be programmed when the WP pin is connected to VCC. If the WP pin is connected to GND or left floating, the write protection mode is determined by the status of the software write protect register. Figure 7-1. Setting Permanent Write Protect Register (PSWP) S T A R T SDA LINE CONTROL BYTE WORD ADDRESS S T O P DATA 0 1 1 0 A2 A1 A0 0 A C K A C K A C K = Don't Care 8 AT34C02C 5185F–SEEPROM–102014 AT34C02C Figure 7-2. Setting Reversible Write Protect Register (RSWP) S T A R T SDA LINE CONTROL BYTE WORD ADDRESS S T O P DATA 0 1 1 0 0 0 1 0 A C K A C K A C K = Don't Care Figure 7-3. Clearing Reversible Write Protect Register (RSWP) S T A R T SDA LINE CONTROL BYTE WORD ADDRESS S T O P DATA 0 1 1 0 0 1 1 0 A C K A C K A C K = Don't Care Table 7-1. Write Protection Pin Preamble RW Command A2 A1 A0 B7 B6 B5 B4 B3 B2 B1 B0 Set PSWP A2 A1 A0 0 1 1 0 A2 A1 A0 0 Set RSWP 0 0 VHV 0 1 1 0 0 0 1 0 Clear RSWP 0 1 VHV 0 1 1 0 0 1 1 0 Table 7-2. VHV VHV Note: Min Max Units 7 10 V VHV - VCC > 4.8V 9 5185F–SEEPROM–102014 Table 7-3. WP Connected to GND or Floating WP Connected to GND or Floating 10 Command R/W bit Permanent write protect register PSWP Reversible write protect register RSWP Acknowledgment from device 1010 R X X ACK 1010 W Programmed X ACK Can write to second Half (80H - FFH) only 1010 W X Programmed ACK Can write to second Half (80H - FFH) only 1010 W Not programmed Not programmed ACK Can write to full array Read PSWP R Programmed X No ACK Read PSWP R Not programmed X ACK Set PSWP W Programmed X No ACK Set PSWP W Not programmed X ACK Read RSWP R X Programmed No ACK Read RSWP R X Not programmed ACK Set RSWP W X Programmed No ACK Set RSWP W X Not programmed ACK Program reversible write protect register (reversible) Clear RSWP W Programmed X No ACK STOP - Indicates permanent write protect register is programmed Clear RSWP W Not programmed X ACK Clear (unprogram) reversible write protect register (reversible) Action from device STOP - Indicates permanent write protect register is programmed Read out data don't care. Indicates PSWP register is not programmed STOP - Indicates permanent write protect register is programmed Program permanent write protect register (irreversible) STOP - Indicates reversible write protect register is programmed Read out data don't care. Indicates RSWP register is not programmed STOP - Indicates reversible write protect register is programmed AT34C02C 5185F–SEEPROM–102014 AT34C02C Table 7-4. WP connected to Vcc WP Connected to Vcc Command R/W bit Permanent write protect register PSWP 1010 R X X ACK Read array 1010 W X X ACK Device write protect Read PSWP R Programmed X No ACK Read PSWP R Not programmed X ACK Set PSWP W Programmed X No ACK Set PSWP W Not programmed X ACK Read RSWP R X Programmed No ACK Read RSWP R X Not programmed ACK Set RSWP W X Programmed No ACK Set RSWP W X Not programmed ACK Clear RSWP W Programmed X No ACK Clear RSWP W Not programmed X ACK 8. Reversible write protect register RSWP Acknowledgment from device Action from device STOP - Indicates permanent write protect register is programmed Read out data don't care. Indicates PSWP register is not programmed STOP - Indicates permanent write protect register is programmed Cannot program write protect registers STOP - Indicates reversible write protect register is programmed Read out data don't care. Indicates RSWP register is not programmed STOP - Indicates reversible write protect register is programmed Cannot program write protect registers STOP - Indicates permanent write protect register is programmed Cannot write to write protect registers Read Operations Read operations are initiated the same way as write operations with the exception that the read/write select bit in the device address word is set to one. There are three read operations: • Current address read • Random address read • Sequential read. CURRENT ADDRESS READ: The internal data word address counter maintains the last address accessed during the last read or write operation, incremented by one. This address stays valid between operations as long as the chip power is maintained. The address “roll over” during read is from the last byte of the last memory page to the first byte of the first page. Once the device address with the read/write select bit set to one is clocked in and acknowledged by the EEPROM, the current address data word is serially clocked out. To end the command, the microcontroller does not respond with an input zero but does generate a following stop condition (see Figure 8-4 on page 13). RANDOM READ: A random read requires a “dummy” byte write sequence to load in the data word address. Once the device address word and data word address are clocked in and acknowledged by the EEPROM, the microcontroller must generate another start condition. The microcontroller now initiates a current address read by sending a device address with the read/write select bit high. The EEPROM acknowledges the device address and serially clocks out the data word. To end the command, the microcontroller does not respond with a zero but does generate a following stop condition (see Figure 8-5 on page 13). 11 5185F–SEEPROM–102014 SEQUENTIAL READ: Sequential reads are initiated by either a current address read or a random address read. After the microcontroller receives a data word, it responds with an acknowledge. As long as the EEPROM receives an acknowledge, it will continue to increment the data word address and serially clock out sequential data words. When the memory address limit is reached, the data word address will “roll over” and the sequential read will continue. The sequential read operation is terminated when the microcontroller does not respond with a zero but does generate a following stop condition (see Figure 8-6 on page 13). PERMANENT WRITE PROTECT REGISTER (PSWP) STATUS: To find out if the register has been programmed, the same procedure is used as to program the register except that the R/W bit is set to one. If the device sends an acknowledge, then the permanent write protect register has not been programmed. Otherwise, it has been programmed and the device is permanently write protected at the first half of the array. Table 8-1. PSWP Status Pin Preamble RW Command A2 A1 A0 B7 B6 B5 B4 B3 B2 B1 B0 Read PSWP A2 A1 A0 0 1 1 0 A2 A1 A0 1 REVERSIBLE WRITE PROTECT REGISTER(RSWP) STATUS: To find out if the register has been programmed, the same procedure is used as to program the register except that the R/W bit is set to one. If the sends an device acknowledge, then the reversible write protect register has not been programmed. Otherwise, it has been programmed and the device is write protected (reversible) at the first half of the array. 12 Figure 8-1. Device Address Figure 8-2. Byte Write Figure 8-3. Page Write AT34C02C 5185F–SEEPROM–102014 AT34C02C Figure 8-4. Current Address Read Figure 8-5. Random Read Figure 8-6. Sequential Read 13 5185F–SEEPROM–102014 9. Atmel AT34C02C Ordering Information Atmel Ordering Code Lead Finish Package Voltage Operation Range 1.7V to 5.5V Industrial Temperature (-40C to 85C) (1) AT34C02CN-SH-B 8S1 AT34C02CN-SH-T(2) AT34C02C-TH-B(1) NiPdAu (Lead-free/Halogen-free) AT34C02C-TH-T(2) AT34C02CY6-YH-T(2) 8MA2 AT34C02CY6-YH-E(3) AT34C02CU3-UU-T(2) Notes: 8X — 8U3-1 1. -B = Bulk SOIC and TSSOP = 100 units per tube. 2. -T = Tape and Reel, Standard Quantity Option: SOIC = 4,000 per reel. TSSOP, UDFN, and VFBGA = 5,000 per reel. 3. -E = Tape and Reel, Expanded Quantity Option: UDFN = 15,000 units per reel. Package type 8S1 14 8-lead, 0.150" wide, Plastic Gull Wing Small Outline (JEDEC SOIC) 8X 8-lead, 4.40mm body, Plastic Thin Shrink Small Outline Package (TSSOP) 8MA2 8-pad, 2.00mm x 3.00mm body, 0.50mm Pitch, Ultra Thin Dual Flat No Lead (UDFN) 8U3-1 8-ball, 1.50mm x 2.00mm body, 0.5mm pitch, Very thin Fine Ball Grid Array (VFBGA) AT34C02C 5185F–SEEPROM–102014 AT34C02C 10. Part Markings 8 lead TSSOP 2 Rows/Top & Bottom 4/5 Top-7/7 Bottom Characters 8 lead SOIC 3 Rows of 8 Characters HYWW 34C 1 Top ATMLHYWW 34C1 AAAAAAAA LOA AAAAAAA Bottom 8 lead UDFN - 2.0x3.0mm 3 Rows of 3 Characters 8-ball VFBGA - 1.5x2.0mm 34C H1@ YXX 2 Rows of 4 Characters 34CU YMXX PIN 1 PIN 1 Catalog Truncation: 34C Catalog Number: AT34C02C Date Codes Y = Year 0: 2010 1: 2011 2: 2012 3: 2013 4: 5: 6: 7: Voltages 2014 2015 2016 2017 M = Month A: January B: February “ ” “ L: December WW 02: 04: ” 52: = Work Week of Assembly Week 2 Week 4 “ ” Week 52 Trace Code XX = Trace Code (ATMEL Lot Numbers to Correspond to Code) (e.g. XX: AA, AB...YZ, ZZ) 1: 1.7v min Grade/Lead Finish Material U: Industrial/Matt Tin H: Industrial/NiPdAu Lot Number AAAAAAA = ATMEL Wafer Lot Number Location of Assembly @ = Location of Assembly ATMEL Truncation AT: ATMEL ATM: ATMEL ATML: ATMEL 3/17/11 Package Drawing Contact: firstname.lastname@example.org TITLE 34C02CSM, AT34C02C Standard Marking Information for Package Offering DRAWING NO. 34C02CSM REV. A 15 5185F–SEEPROM–102014 11. Packaging Information 8S1 — 8-lead JEDEC SOIC C 1 E E1 L N Ø TOP VIEW END VIEW e b COMMON DIMENSIONS (Unit of Measure = mm) A A1 D SIDE VIEW Notes: This drawing is for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper dimensions, tolerances, datums, etc. SYMBOL MIN A 1.35 NOM MAX – 1.75 A1 0.10 – 0.25 b 0.31 – 0.51 C 0.17 – 0.25 D 4.80 – 5.05 E1 3.81 – 3.99 E 5.79 – 6.20 e NOTE 1.27 BSC L 0.40 – 1.27 Ø 0° – 8° 6/22/11 Package Drawing Contact: email@example.com 16 TITLE 8S1, 8-lead (0.150” Wide Body), Plastic Gull Wing Small Outline (JEDEC SOIC) GPC SWB DRAWING NO. REV. 8S1 G AT34C02C 5185F–SEEPROM–102014 AT34C02C 8X — 8-lead TSSOP C 1 Pin 1 indicator this corner E1 E L1 N L Top View End View A b A1 e D SYMBOL Side View Notes: COMMON DIMENSIONS (Unit of Measure = mm) A2 1. This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions, tolerances, datums, etc. 2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed 0.15mm (0.006in) per side. 3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25mm (0.010in) per side. 4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08mm total in excess of the b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between protrusion and adjacent lead is 0.07mm. 5. Dimension D and E1 to be determined at Datum Plane H. MIN NOM MAX A - - 1.20 A1 0.05 - 0.15 NOTE A2 0.80 1.00 1.05 D 2.90 3.00 3.10 2, 5 E 6.40 BSC E1 4.30 4.40 4.50 3, 5 b 0.19 0.25 0.30 4 e L 0.65 BSC 0.45 L1 C 0.60 0.75 1.00 REF 0.09 - 0.20 2/27/14 TITLE Package Drawing Contact: firstname.lastname@example.org 8X, 8-lead 4.4mm Body, Plastic Thin Shrink Small Outline Package (TSSOP) GPC TNR DRAWING NO. 8X REV. E 17 5185F–SEEPROM–102014 8MA2 — 8-pad UDFN E 1 8 Pin 1 ID 2 7 3 6 4 5 D C TOP VIEW A2 SIDE VIEW A A1 E2 b (8x) 8 1 7 D2 6 3 5 4 e (6x) K L (8x) BOTTOM VIEW Notes: COMMON DIMENSIONS (Unit of Measure = mm) 2 Pin#1 ID 1. This drawing is for general information only. Refer to Drawing MO-229, for proper dimensions, tolerances, datums, etc. 2. The Pin #1 ID is a laser-marked feature on Top View. 3. Dimensions b applies to metallized terminal and is measured between 0.15 mm and 0.30 mm from the terminal tip. If the terminal has the optional radius on the other end of the terminal, the dimension should not be measured in that radius area. 4. The Pin #1 ID on the Bottom View is an orientation feature on the thermal pad. SYMBOL MIN NOM MAX A 0.50 0.55 0.60 A1 0.0 0.02 0.05 A2 - - 0.55 D 1.90 2.00 2.10 D2 1.20 - 1.60 E 2.90 3.00 3.10 E2 1.20 - 1.60 b 0.18 0.25 0.30 C L 3 1.52 REF 0.30 e K NOTE 0.35 0.40 0.50 BSC 0.20 - - 6/6/14 Package Drawing Contact: email@example.com 18 TITLE 8MA2, 8-pad 2 x 3 x 0.6mm Body, Thermally Enhanced Plastic Ultra Thin Dual Flat No-Lead Package (UDFN) GPC DRAWING NO. REV. YNZ 8MA2 F AT34C02C 5185F–SEEPROM–102014 AT34C02C 8U3-1 — 8-ball VFBGA E D 2. b PIN 1 BALL PAD CORNER A1 A2 TOP VIEW A SIDE VIEW PIN 1 BALL PAD CORNER 3 1 2 4 d (d1) 8 7 6 5 COMMON DIMENSIONS (Unit of Measure - mm) e (e1) SYMBOL MIN NOM MAX BOTTOM VIEW A 0.73 0.79 0.85 8 SOLDER BALLS A1 0.09 0.14 0.19 A2 0.40 0.45 0.50 Notes: b 0.20 0.25 0.30 1. This drawing is for general information only. D 2. Dimension ‘b’ is measured at maximum solder ball diameter. 3. Solder ball composition shall be 95.5Sn-4.0Ag-.5Cu. NOTE 2 1.50 BSC E 2.0 BSC e 0.50 BSC e1 0.25 REF d 1.00 BSC d1 0.25 REF 6/11/13 Package Drawing Contact: firstname.lastname@example.org TITLE GPC DRAWING NO. 8U3-1, 8-ball, 1.50mm x 2.00mm body, 0.50mm pitch, Very Thin, Fine-Pitch Ball Grid Array Package (VFBGA) GXU 8U3-1 REV. F 19 5185F–SEEPROM–102014 12. 20 Revision history Doc. Rev. Date Comments 5185F 10/2014 Updated package drawings to newer versions: 8A2 to 8X, 8Y6 to 8MA2-UDFN, and 8U3-1 dBGA2 to VFBGA. Updated the Atmel logos and disclaimer page. 5185E 09/2013 Not recommended for new design. Replaced by AT34C02D. 5185E 03/2011 Replaced part markings to single page part markings Updated template 5185D 01/2008 Removed ‘preliminary’ status 5185C 08/2007 Updated to new template Added package marking tables 5185B 03/2007 Implemented revision history AT34C02C 5185F–SEEPROM–102014 XXXXXX Atmel Corporation 1600 Technology Drive, San Jose, CA 95110 USA T: (+1)(408) 441.0311 F: (+1)(408) 436.4200 | www.atmel.com © 2014 Atmel Corporation. / Rev.: Atmel-8827E-SEEPROM-AT34C04-Datasheet_102014. Atmel®, Atmel logo and combinations thereof, Enabling Unlimited Possibilities®, and others are registered trademarks or trademarks of Atmel Corporation in U.S. and other countries. Other terms and product names may be trademarks of others. DISCLAIMER: The information in this document is provided in connection with Atmel products. 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