AT93C56A/66A Automotive - Mature

Features
• Medium-voltage and Standard-voltage Operation
– 2.7 (VCC = 2.7V to 5.5V)
• Automotive Temperature Range –40C to 125C
• User-selectable Internal Organization
•
•
•
•
•
•
•
– 2K: 256 x 8 or 128 x 16
– 4K: 512 x 8 or 256 x 16
Three-wire Serial Interface
Sequential Read Operation
2 MHz Clock Rate
Self-timed Write Cycle (10 ms max)
High Reliability
– Endurance: 1 Million Write Cycles
– Data Retention: 100 Years
Lead-free/Halogen-free Devices Available
8-lead JEDEC SOIC and 8-lead TSSOP Packages
Description
The AT93C56A/66A provides 2048/4096 bits of serial electrically-erasable programmable read-only memory (EEPROM). The EEPROM is organized as 128/256 words of
16 bits each when the ORG pin is connected to VCC and 256/512 words of 8 bits each
when it is tied to ground. The device is optimized for use in many automotive applications where low-power and low-voltage operations are essential. The AT93C56A/66A
is available in space-saving 8-lead JEDEC SOIC and 8-lead TSSOP packages.
The AT93C56A/66A is enabled through the Chip Select (CS) pin and accessed via a
three-wire serial interface consisting of Data Input (DI), Data Output (DO), and Shift
Clock (SK). Upon receiving a Read instruction at DI, the address is decoded and the
data is clocked out serially on the data output pin DO. The write cycle is completely
self-timed and no separate erase cycle is required before write. The write cycle is only
enabled when the part is in the Erase/Write Enable state. When CS is brought high
following the initiation of a write cycle, the DO pin outputs the Ready/Busy status of
the part.
The AT93C56A/66A is available in 2.7V to 5.5V versions.
Function
CS
Chip Select
SK
Serial Data Clock
DI
Serial Data Input
DO
Serial Data Output
GND
Ground
VCC
Power Supply
ORG
Internal Organization
DC
Don’t Connect
8-lead SOIC
CS
SK
DI
DO
1
2
3
4
8
7
6
5
2K (256 x 8 or 128 x 16)
4K (512 x 8 or 256 x 16)
AT93C56A
AT93C66A
Not Recommended
for New Design.
Replaced by
AT93C56B/66B
Automotive.
Table 1. Pin Configuration
Pin Name
Three-wire
Automotive
Temperature
Serial
EEPROMs
VCC
DC
ORG
GND
8-lead TSSOP
CS
SK
DI
DO
1
2
3
4
8
7
6
5
VCC
DC
ORG
GND
Rev. 5091E–SEEPR–4/07
1
Absolute Maximum Ratings*
Operating Temperature  55C to +125C
Storage Temperature 65C to +150C
Voltage on Any Pin
with Respect to Ground  1.0V to +7.0V
Maximum Operating Voltage .......................................... 6.25V
*NOTICE:
Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these or any
other conditions beyond those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditions for extended periods may affect
device reliability
DC Output Current........................................................ 5.0 mA
Figure 1. Block Diagram
Note:
2
When the ORG pin is connected to VCC, the “x 16” organization is selected. When it is connected to ground, the “x 8” organization is selected. If the ORG pin is left unconnected and the application does not load the input beyond the capability of the
internal 1 Meg ohm pullup, then the “x 16” organization is selected.
AT93C56A/66A
5091E–SEEPR–4/07
AT93C56A/66A
Table 1. Pin Capacitance(1)
Applicable over recommended operating range from TA = 25C, f = 1.0 MHz, VCC = +5.0V (unless otherwise noted)
Symbol
Test Conditions
COUT
CIN
Note:
Max
Units
Conditions
Output Capacitance (DO)
5
pF
VOUT = 0V
Input Capacitance (CS, SK, DI)
5
pF
VIN = 0V
1. This parameter is characterized and is not 100% tested.
Table 2. DC Characteristics
Applicable over recommended operating range from: TA = 40C to +125C, VCC = +2.7V to +5.5V (unless otherwise noted)
Symbol
Parameter
VCC1
Supply Voltage
VCC2
Supply Voltage
ICC
Supply Current
ISB1
Standby Current
ISB2
Test Condition
Min
Typ
Max
Unit
2.7
5.5
V
4.5
5.5
V
READ at 1.0 MHz
0.5
2.0
mA
WRITE at 1.0 MHz
0.5
2.0
mA
VCC = 2.7V
CS = 0V
3.0
10.0
µA
Standby Current
VCC = 5.0V
CS = 0V
10.0
15.0
µA
IIL
Input Leakage
VIN = 0V to VCC
0.1
3.0
µA
IOL
Output Leakage
VIN = 0V to VCC
0.1
3.0
µA
0.6
0.8
V
2.0
VCC + 1
VIL1(1)
VIH1
(1)
Input Low Voltage
Input High Voltage
VOL1
Output Low Voltage
VOH1
Output High Voltage
Note:
VCC = 5.0V
2.7V  VCC  5.5V
2.7V  VCC  5.5V
IOL = 2.1 mA
IOH = 0.4 mA
0.4
2.4
V
V
1. VIL min and VIH max are reference only and are not tested.
3
5091E–SEEPR–4/07
Table 3. AC Characteristics
Applicable over recommended operating range from TA = 40°C to + 125°C, VCC = As Specified, CL = 1 TTL Gate and
100 pF (unless otherwise noted)
Symbol
Parameter
Test Condition
Min
fSK
SK Clock Frequency
4.5V  VCC  5.5V
2.7V  VCC  5.5V
0
0
tSKH
SK High Time
4.5V  VCC  5.5V
2.7V  VCC  5.5V
250
250
ns
tSKL
SK Low Time
4.5V  VCC  5.5V
2.7V  VCC  5.5V
250
250
ns
tCS
Minimum CS
Low Time
4.5V  VCC  5.5V
2.7V  VCC  5.5V
250
250
ns
tCSS
CS Setup Time
Relative to SK
4.5V  VCC  5.5V
2.7V  VCC  5.5V
50
50
ns
tDIS
DI Setup Time
Relative to SK
4.5V  VCC  5.5V
2.7V  VCC  5.5V
100
100
ns
tCSH
CS Hold Time
Relative to SK
0
ns
tDIH
DI Hold Time
Relative to SK
4.5V  VCC  5.5V
2.7V  VCC  5.5V
100
100
ns
tPD1
Output Delay to “1”
AC Test
4.5V  VCC  5.5V
2.7V  VCC  5.5V
250
500
ns
tPD0
Output Delay to “0”
AC Test
4.5V  VCC  5.5V
2.7V  VCC  5.5V
250
500
ns
tSV
CS to Status Valid
AC Test
4.5V  VCC  5.5V
2.7V  VCC  5.5V
250
250
ns
tDF
CS to DO in High
Impedance
AC Test
CS = VIL
4.5V  VCC  5.5V
2.7V  VCC  5.5V
100
150
ns
10
ms
Write Cycle Time
tWP
(1)
Endurance
Note:
4
2.7V  VCC  5.5V
5.0V, 25°C
0.1
1M
Typ
3
Max
Units
2
1
MHz
Write Cycles
1. This parameter is characterized and is not 100% tested.
AT93C56A/66A
5091E–SEEPR–4/07
AT93C56A/66A
Functional Description
The AT93C56A/66A is accessed via a simple and versatile three-wire serial communication interface. Device operation is controlled by seven instructions issued by the host
processor. A valid instruction starts with a rising edge of CS and consists of a start bit
(logic “1”) followed by the appropriate op code and the desired memory address
location.
Table 4. Instruction Set for the AT93C56A and AT93C66A
Address
Data
SB
Op
Code
x8
x 16
READ
1
10
A8 – A0
A7  A0
EWEN
1
00
11XXXXXXX
11XXXXXX
Write enable must precede all
programming modes
ERASE
1
11
A8  A0
A7  A0
Erase memory location An  A0
WRITE
1
01
A8  A0
A7  A0
ERAL
1
00
10XXXXXXX
10XXXXXX
WRAL
1
00
01XXXXXXX
01XXXXXX
EWDS
1
00
00XXXXXXX
00XXXXXX
Instruction
Note:
x8
x 16
Comments
Reads data stored in memory, at
specified address
D7 D0
D15 D0
Writes memory location An A0
Erases all memory locations. Valid
only at VCC = 4.5V to 5.5V
D7  D0
D15  D0
Writes all memory locations. Valid
only at VCC = 5.0V ±10% and Disable
Register cleared
Disables all programming instructions
The X’s in the address field represent don’t care values and must be clocked.
READ (READ): The Read (READ) instruction contains the address code for the memory location to be read. After the instruction and address are decoded, data from the
selected memory location is available at the serial output pin DO. Output data changes
are synchronized with the rising edges of serial clock SK. It should be noted that a
dummy bit (logic “0”) precedes the 8- or 16-bit data output string. The AT93C56A/66A
supports sequential read operations. The device will automatically increment the internal address pointer and clock out the next memory location as long as Chip Select (CS)
is held high. In this case, the dummy bit (logic “0”) will not be clocked out between memory locations, thus allowing for a continuous stream of data to be read.
ERASE/WRITE ENABLE (EWEN): To assure data integrity, the part automatically goes
into the Erase/Write Disable (EWDS) state when power is first applied. An Erase/Write
Enable (EWEN) instruction must be executed first before any programming instructions
can be carried out. Please note that once in the EWEN state, programming remains
enabled until an EWDS instruction is executed or VCC power is removed from the part.
ERASE (ERASE): The Erase (ERASE) instruction programs all bits in the specified
memory location to the logical “1” state. The self-timed erase cycle starts once the
Erase instruction and address are decoded. The DO pin outputs the Ready/Busy status
of the part if CS is brought high after being kept low for a minimum of 250 ns (tCS). A
logic “1” at pin DO indicates that the selected memory location has been erased, and the
part is ready for another instruction.
5
5091E–SEEPR–4/07
WRITE (WRITE): The Write (WRITE) instruction contains the 8 or 16 bits of data to be
written into the specified memory location. The self-timed programming cycle, tWP, starts
after the last bit of data is received at serial data input pin DI. The DO pin outputs the
Ready/Busy status of the part if CS is brought high after being kept low for a minimum of
250 ns (tCS). A logic “0” at DO indicates that programming is still in progress. A logic “1”
indicates that the memory location at the specified address has been written with the
data pattern contained in the instruction and the part is ready for further instructions. A
Ready/Busy status cannot be obtained if the CS is brought high after the end of the selftimed programming cycle, tWP.
ERASE ALL (ERAL): The Erase All (ERAL) instruction programs every bit in the memory array to the logic “1” state and is primarily used for testing purposes. The DO pin
outputs the ready/busy status of the part if CS is brought high after being kept low for a
minimum of 250 ns (tCS). The ERAL instruction is valid only at VCC = 5.0V 10%.
WRITE ALL (WRAL): The Write All (WRAL) instruction programs all memory locations
with the data patterns specified in the instruction. The DO pin outputs the Ready/Busy
status of the part if CS is brought high after being kept low for a minimum of 250 ns (tCS).
The WRAL instruction is valid only at VCC = 5.0V ±10%.
ERASE/WRITE DISABLE (EWDS): To protect against accidental data disturb, the
Erase/Write Disable (EWDS) instruction disables all programming modes and should be
executed after all programming operations. The operation of the Read instruction is
independent of both the EWEN and EWDS instructions and can be executed at any
time.
Timing Diagrams
Figure 1. Synchronous Data Timing
Note:
This is the minimum SK period.
Table 5. Organization Key for Timing Diagrams
AT93C56A (2K)
Notes:
6
AT93C66A (4K)
I/O
x8
x 16
x8
x 16
AN
A8(1)
A7(2)
A8
A7
DN
D7
D15
D7
D15
1. A8 is a don’t care value, but the extra clock is required.
2. A7 is a don’t care value, but the extra clock is required.
AT93C56A/66A
5091E–SEEPR–4/07
AT93C56A/66A
Figure 2. READ Timing
tCS
High Impedance
Figure 3. EWEN Timing
tCS
CS
SK
DI
1
0
0
1
...
1
Figure 4. EWDS Timing
tCS
CS
SK
DI
1
0
0
0
...
0
Figure 5. WRITE Timing
tCS
CS
SK
DI
DO
1
0
1
AN
...
A0
DN
...
D0
HIGH IMPEDANCE
BUS
READ
tWP
7
5091E–SEEPR–4/07
Figure 6. WRAL Timing
tCS
CS
SK
DI
DO
1
0
0
0
1
...
DN
...
D0
BUS
HIGH IMPEDANCE
READ
tWP
Note:
Valid only at VCC = 4.5V to 5.5V
Figure 7. ERASE Timing
tCS
CS
STANDB
CHECK
STATUS
SK
DI
1
1
1
AN
AN-1
AN-2
...
A0
tDF
tSV
DO
HIGH IMPEDANCE
HIGH IMPEDANCE
BUS
READ
tWP
Figure 8. ERAL Timing
tCS
CS
CHECK
STATUS
STANDB
tSV
tDF
SK
DI
DO
1
0
0
1
0
BUS
HIGH IMPEDANCE
HIGH IMPEDANCE
READ
tWP
Note:
8
Valid only at VCC = 4.5V to 5.5V
AT93C56A/66A
5091E–SEEPR–4/07
AT93C56A/66A
AT93C56A Ordering Information
Ordering Code
Package
Operation Range
8S1
8A2
Lead-free/Halogen-free/Automotive
Temperature
(40C to 125C)
AT93C56A-10SQ-2.7
AT93C56A-10TQ-2.7
Package Type
8S1
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8A2
8-lead, 0.170" Wide, Thin Shrink Small Outline Package (TSSOP)
Options
2.7
Low Voltage (2.7V to 5.5V)
9
5091E–SEEPR–4/07
AT93C66A Ordering Information
Ordering Code
Package
Operation Range
8S1
8A2
Lead-free/Halogen-free/Automotive
Temperature
(40C to 125C)
AT93C66A-10SQ-2.7
AT93C66A-10TQ-2.7
Package Type
8S1
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8A2
8-lead, 0.170" Wide, Thin Shrink Small Outline Package (TSSOP)
Options
2.7
10
Low Voltage (2.7V to 5.5V)
AT93C56A/66A
5091E–SEEPR–4/07
AT93C56A/66A
8S1 - JEDEC SOIC
C
1
E
E1
L
N
∅
Top View
End View
e
B
COMMON DIMENSIONS
(Unit of Measure = mm)
A
SYMBOL
A1
D
Side View
MIN
NOM
MAX
A
1.35
–
1.75
A1
0.10
–
0.25
b
0.31
–
0.51
C
0.17
–
0.25
D
4.80
–
5.00
E1
3.81
–
3.99
E
5.79
–
6.20
e
NOTE
1.27 BSC
L
0.40
–
1.27
∅
0°
–
8°
Note: These drawings are for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper dimensions, tolerances, datums, etc.
10/7/03
R
1150 E. Cheyenne Mtn. Blvd.
Colorado Springs, CO 80906
TITLE
8S1, 8-lead (0.150" Wide Body), Plastic Gull Wing
Small Outline (JEDEC SOIC)
DRAWING NO.
8S1
REV.
B
11
5091E–SEEPR–4/07
8A2 TSSOP
3
2 1
Pin 1 indicator
this corner
E1
E
L1
N
L
Top View
End View
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
A
b
D
MIN
NOM
MAX
NOTE
2.90
3.00
3.10
2, 5
4.50
3, 5
E
E1
e
A2
D
6.40 BSC
4.30
A
–
–
1.20
A2
0.80
1.00
1.05
b
0.19
–
0.30
e
Side View
L
0.60
0.75
1.00 REF
1. This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions, tolerances,
datums, etc.
2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed
0.15 mm (0.006 in) per side.
3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25 mm
(0.010 in) per side.
4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of the
b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between
protrusion and adjacent lead is 0.07 mm.
5. Dimension D and E1 to be determined at Datum Plane H.
5/30/02
R
12
4
0.65 BSC
0.45
L1
Notes:
4.40
2325 Orchard Parkway
San Jose, CA 95131
TITLE
8A2, 8-lead, 4.4 mm Body, Plastic
Thin Shrink Small Outline Package (TSSOP)
DRAWING NO.
8A2
REV.
B
AT93C56A/66A
5091E–SEEPR–4/07
AT93C56A/66A
Revision History
Doc. Rev.
Date
Comments
5091E
8/2012
Not Recommended for New Design.
Replaced by AT93C56B/66B Automotive.
5091E
4/2007
Changed ISB values on page 3
5091D
2/2007
Implemented revision history
Removed PDIP package offering
Removed Pb’d part numbers
13
5091E–SEEPR–4/07
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