Data Sheet

62
7
BGA7024
400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier
Rev. 3 — 11 June 2014
Product data sheet
1. Product profile
1.1 General description
The BGA7024 MMIC is a one-stage amplifier, available in a low-cost surface-mount
package. It delivers 24 dBm output power at 1 dB gain compression and superior
performance up to 2700 MHz.
1.2 Features and benefits







400 MHz to 2700 MHz frequency operating range
16 dB small signal gain at 2 GHz
24 dBm output power at 1 dB gain compression
Integrated active biasing
External matching allows broad application optimization of the electrical performance
5 V single supply operation
All pins ESD protected
1.3 Applications
 Broadband CPE/MoCA
 Industrial applications
 WLAN/ISM/RFID
 E-metering
 Wireless infrastructure (base station,
 Satellite Master Antenna TV (SMATV)
repeater, point-to-point backhaul systems)
1.4 Quick reference data
Table 1.
Quick reference data
Input and output impedances matched to 50 . Typical values at VCC = 5 V; Tcase = 25 C;
unless otherwise specified.
Symbol Parameter
Conditions
supply current
ICC
[1]
Min
Typ
Max
Unit
95
110
125
mA
400
-
2700 MHz
f
frequency
Gp
power gain
f = 2140 MHz
13.5 15
PL(1dB)
output power at 1 dB gain compression
f = 2140 MHz
24.0 25.5 -
dBm
IP3O
output third-order intercept point
f = 2140 MHz
35.0 38.5 -
dBm
[1]
Operation outside this range is possible but not guaranteed.
[2]
PL = 11 dBm per tone; spacing = 1 MHz.
[2]
16.5
dB
BGA7024
NXP Semiconductors
400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier
2. Pinning information
Table 2.
Pinning
Pin
Description
Simplified outline
1
VCC(RF)
[1]
2
GND
[2]
3
RF_IN
[1]
Graphic symbol
V\P
[1]
This pin is DC-coupled and requires an external DC-blocking capacitor.
[2]
The center metal base of the SOT89 also functions as heatsink for the power amplifier.
3. Ordering information
Table 3.
Ordering information
Type number
BGA7024
Package
Name
Description
Version
-
plastic surface-mounted package; exposed die pad for good
heat transfer; 3 leads
SOT89
4. Functional diagram
BIAS
ENABLE
RF_IN
BANDGAP
V/I
CONVERTER
3
1
VCC(RF)
2
GND
014aab020
Fig 1.
BGA7024
Product data sheet
Functional diagram
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Rev. 3 — 11 June 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
2 of 23
BGA7024
NXP Semiconductors
400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier
5. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VCC(RF)
RF supply voltage
-
5.7
V
Pi(RF)
RF input power
-
25
dBm
Tcase
case temperature
40
+85
C
Tj
junction temperature
-
150
C
VESD
electrostatic discharge voltage
Human Body Model (HBM);
according to JEDEC standard 22-A114E
-
2000
V
Charged Device Model (CDM);
according to JEDEC standard 22-C101B
-
500
V
6. Thermal characteristics
Table 5.
Thermal characteristics
Symbol
Parameter
Rth(j-c)
Conditions
[1][2]
thermal resistance from junction to case
Typ
Unit
25
K/W
[1]
Case is ground solder pad.
[2]
Thermal resistance measured using infrared measurement technique, device mounted on application board
and placed in still air.
7. Static characteristics
Table 6.
Characteristics
Input and output impedances matched to 50 . Typical values at VCC = 5 V; Tcase = 25 C; unless
otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VCC
supply voltage
-
5.0
-
V
ICC
supply current
95
110
125
mA
8. Dynamic characteristics
Table 7.
Dynamic characteristics
Input and output impedances matched to 50 . Typical values at VCC = 5 V; Tcase = 25 C; see
Section 12 “Application information”; unless otherwise specified.
Symbol Parameter
BGA7024
Product data sheet
f
frequency
Gp
power gain
Conditions
Min
Typ
Max
400
-
2700 MHz
f = 940 MHz
-
22
-
dB
f = 1960 MHz
-
16
-
dB
f = 2140 MHz
13.5 15
16.5
dB
f = 2445 MHz
-
-
dB
[1]
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Rev. 3 — 11 June 2014
14
Unit
© NXP Semiconductors N.V. 2014. All rights reserved.
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BGA7024
NXP Semiconductors
400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier
Table 7.
Dynamic characteristics …continued
Input and output impedances matched to 50 . Typical values at VCC = 5 V; Tcase = 25 C; see
Section 12 “Application information”; unless otherwise specified.
Symbol Parameter
Conditions
Min
Typ
Max
Unit
PL(1dB)
f = 940 MHz
-
24
-
dBm
f = 1960 MHz
-
25.5 -
dBm
f = 2140 MHz
24.0 25.5 -
dBm
output power at 1 dB gain compression
f = 2445 MHz
IP3O
NF
output third-order intercept point
noise figure
RLin
RLout
input return loss
-
24.5 -
dBm
f = 940 MHz
[2]
-
37.5 -
dBm
f = 1960 MHz
[2]
-
38.0 -
dBm
f = 2140 MHz
[2]
35.0 38.0 -
dBm
f = 2445 MHz
[2]
-
37.5 -
dBm
f = 940 MHz
[3]
-
2.9
-
dB
f = 1960 MHz
[3]
-
3.7
-
dB
f = 2140 MHz
[3]
-
3.7
-
dB
f = 2445 MHz
[3]
-
4.0
-
dB
-
9
-
dB
f = 1960 MHz
-
10
-
dB
f = 2140 MHz
-
10
-
dB
f = 2445 MHz
-
14
-
dB
f = 940 MHz
-
29
-
dB
f = 1960 MHz
-
22
-
dB
f = 2140 MHz
-
29
-
dB
f = 2445 MHz
-
11
-
dB
f = 940 MHz
output return loss
[1]
Operation outside this range is possible but not guaranteed.
[2]
PL = 11 dBm per tone; spacing = 1 MHz.
[3]
Defined at Pi(RF) = 40 dBm; small signal conditions.
9. Scattering parameters
Table 8.
Scattering parameters at 5 V, MMIC only
f (MHz) S11
S21
S12
S22
Magnitude
(ratio)
Angle
(degree)
Magnitude
(ratio)
Angle
(degree)
Magnitude
(ratio)
Angle
(degree)
Magnitude
(ratio)
Angle
(degree)
400
0.83
178.9
14.03
112.7
0.01
35.5
0.53
166.3
500
0.85
178.7
11.69
104.4
0.01
38.77
0.56
168.9
600
0.85
176.4
9.93
98.19
0.02
41.13
0.57
172.2
700
0.86
173.8
8.67
93.04
0.02
43.1
0.58
174.8
800
0.86
171.1
7.68
88.54
0.02
44.34
0.58
177.4
900
0.86
168.3
6.9
84.36
0.02
44.96
0.59
179.7
1000
0.86
165.4
6.29
80.24
0.02
45.07
0.60
176.7
1100
0.87
162.7
5.72
76.42
0.02
45
0.60
173.3
1200
0.88
159.9
5.23
72.83
0.02
44.54
0.60
170.9
1300
0.88
157.3
4.80
69.34
0.03
44.17
0.61
168.4
BGA7024
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 11 June 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
4 of 23
BGA7024
NXP Semiconductors
400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier
Table 8.
Scattering parameters at 5 V, MMIC only …continued
f (MHz) S11
S21
S12
S22
Magnitude
(ratio)
Angle
(degree)
Magnitude
(ratio)
Angle
(degree)
Magnitude
(ratio)
Angle
(degree)
Magnitude
(ratio)
Angle
(degree)
1400
0.89
154.8
4.43
66.17
0.03
43.58
0.61
166.4
1500
0.89
153
4.09
63.33
0.03
43.02
0.62
164.7
1600
0.89
151.3
3.80
60.8
0.03
42.67
0.63
163.1
1700
0.90
149.9
3.54
58.3
0.03
42.36
0.64
162.1
1800
0.90
148.7
3.30
56.13
0.03
41.89
0.65
161.2
1900
0.90
147.9
3.11
54.13
0.03
41.65
0.66
160.8
2000
0.91
147.5
2.93
52.63
0.03
41.7
0.66
160.5
2100
0.90
147
2.78
50.91
0.04
41.61
0.66
160.5
2200
0.90
146.9
2.65
49.5
0.04
41.59
0.67
160.9
2300
0.90
146.6
2.54
48.13
0.04
41.44
0.66
161.6
2400
0.90
146.5
2.46
46.88
0.04
41.61
0.66
161.7
2500
0.89
146.3
2.39
45.39
0.04
41.45
0.66
162.6
2600
0.88
146
2.34
43.93
0.05
41.13
0.65
162.8
2700
0.87
145.4
2.30
42.24
0.05
40.56
0.64
163.2
10. Reliability information
Table 9.
Reliability
Life test Conditions
HTOL
Intrinsic failure rate
according to JESD85; confidence level 60 %; Tj = 55 C;
activation energy = 0.7 eV; acceleration factor according to
Arrhenius equation
4
11. Moisture sensitivity
Table 10.
BGA7024
Product data sheet
Moisture sensitivity level
Test methodology
Class
JESD-22-A113
1
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Rev. 3 — 11 June 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
5 of 23
BGA7024
NXP Semiconductors
400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier
12. Application information
12.1 920 MHz to 960 MHz
C7
R1
J3
VCC
C6
C8
L3
L2
50 Ω
MSL1
C1
C9
MSL2
MSL3
J1
RF_IN
C3
C2
MSL4
VCC(RF)
MSL5
L1
C5
MSL6
50 Ω
J2
C4
BGA7024
014aab021
See Table 11 for a list of components.
PCB specification: Rogers RO4003C; height = 0.508 mm; r = 3.38; copper thickness = 35 m.
Fig 2.
5 V application schematic; 920 MHz to 960 MHz
014aab022
30
014aab023
28
Gp
(dB)
PL(1dB)
(dBm)
26
28
24
26
(1)
(1)
(2)
(2)
24
22
(3)
(3)
20
22
20
0.92
0.93
0.94
0.95
18
0.92
0.96
0.93
(1) Tcase = 40 C.
(1) Tcase = 40 C.
(2) Tcase = 25 C.
(2) Tcase = 25 C.
(3) Tcase = 85 C.
(3) Tcase = 85 C.
Fig 3.
Output power at 1 dB gain compression as a
function of frequency
BGA7024
Product data sheet
0.94
0.95
0.96
f (GHz)
f (GHz)
Fig 4.
Power gain as a function of frequency
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Rev. 3 — 11 June 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
6 of 23
BGA7024
NXP Semiconductors
400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier
014aab024
0
014aab025
42
IP3O
(dBm)
RLin, RLout, ISL
(dB)
40
(1)
−10
(2)
(3)
38
(1)
36
−20
(2)
34
(3)
−30
0.92
0.93
0.94
0.95
32
0.92
0.96
0.93
0.94
0.95
f (GHz)
0.96
f (GHz)
Tcase = 25 C.
(1) Tcase = 40 C.
(1) RLin
(2) Tcase = 25 C.
(2) RLout
(3) Tcase = 85 C.
(3) ISL
Fig 5.
Input return loss, output return loss and
isolation as a function of frequency
Fig 6.
Output third-order intercept point as a function
of frequency
GND
GND
VCC
GND
GND
GND
J3
C8
R1
C7
J2
J1
C6
MSL1
L3
C9
MSL2
C2
C1
L1
MSL3
C3
L2
MSL5
C5
MSL6
C4
J I HGF EDCBA
MSL4
1 2 3 4 5 6 7 8 9 10 12
11 13
RF in
RF out
014aab026
See Table 11 for a list of components.
Fig 7.
5 V application reference board; 920 MHz to 960 MHz
BGA7024
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 11 June 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
7 of 23
BGA7024
NXP Semiconductors
400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier
Table 11. 5 V application list of components; 920 MHz to 960 MHz
See Figure 2 and Figure 7 for component layout. PCB: Rogers RO4003C stack; height = 0.508 mm; copper plating
thickness = 35 m.
Component
Description
Value
Function
Remarks
C1, C5
capacitor
68 pF
DC blocking
Murata GRM1885C1H680JA01D
C2
capacitor
3.9 pF
input match
Murata GRM1885C1H3R9CZ01D
C3
capacitor
3.9 pF
input match
Murata GRM1885C1H3R9CZ01D
C4
capacitor
3.9 pF
output match
Murata GRM1885C1H3R9CZ01D
C6
capacitor
68 pF
RF decoupling
Murata GRM1885C1H680JA01D
C7
capacitor
100 nF
DC decoupling
AVX 0603YC104KAT2A
C8
capacitor
10 F
DC decoupling
AVX 1206ZG106ZAT2A
C9
capacitor
68 nF
IMD
suppression
Murata GRM1888R71H683KA93D
J1, J2
RF connector
SMA
-
Emerson Network Power
142-0701-841
J3
DC connector
6-pins
-
MOLEX
L1
inductor
4.7 nH
output match
Tyco Electronics 36501J4N7JTDG
L2
inductor
22 nH
DC feed
Tyco Electronics 36501J022JTDG
L3
inductor
33 nH
IMD
suppression
Tyco Electronics 36501J033JTDG
MSL1[1]
micro stripline
1.14 mm  0.8 mm  10.95 mm
input match
-
MSL2[1]
micro stripline
1.14 mm  0.8 mm  5.65 mm
input match
-
MSL3[1]
micro stripline
1.14 mm  0.8 mm  6.1 mm
input match
-
MSL4[1]
micro stripline
1.14 mm  0.8 mm  1.6 mm
output match
-
MSL5[1]
micro stripline
1.14 mm  0.8 mm  8.4 mm
output match
-
MSL6[1]
micro stripline
1.14 mm  0.8 mm  10.95 mm
output match
-
R1
resistor
0
-
Multicomp MC 0.063W 0603 0R
PCB
-
RO4003C
-
-
[1]
MSL1 to MSL6 dimensions specified as width  spacing  length.
12.2 1930 MHz to 1990 MHz
C6
R1
J3
VCC
C5
C7
L1
50 Ω
MSL1
C1
MSL2
MSL3
RF_IN
VCC(RF)
J1
C2
MSL4
BGA7024
MSL5
MSL6
C4
MSL7
50 Ω
J2
C3
014aab027
See Table 12 for a list of components.
PCB specification: Rogers RO4003C; height = 0.508 mm; r = 3.38; copper thickness = 35 m.
Fig 8.
5 V application schematic; 1930 MHz to 1990 MHz
BGA7024
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 11 June 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
8 of 23
BGA7024
NXP Semiconductors
400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier
014aab028
30
014aab029
20
PL(1dB)
(dBm)
Gp
(dB)
28
18
(1)
(2)
(1)
26
16
(2)
(3)
(3)
24
14
22
12
20
1.93
1.95
1.97
1.99
10
1.93
1.95
1.97
f (GHz)
(1) Tcase = 40 C.
(1) Tcase = 40 C.
(2) Tcase = 25 C.
(2) Tcase = 25 C.
(3) Tcase = 85 C.
(3) Tcase = 85 C.
Fig 9.
Output power at 1 dB gain compression as a
function of frequency
014aab030
0
1.99
f (GHz)
Fig 10. Power gain as a function of frequency
014aab031
42
IP3O
(dBm)
RLin, RLout, ISL
(dB)
40
(1)
(1)
(2)
−10
38
(3)
36
−20
(2)
(3)
−30
1.93
34
1.95
1.97
1.99
32
1.93
1.95
f (GHz)
1.97
1.99
f (GHz)
Tcase = 25 C.
(1) Tcase = 40 C.
(1) RLin
(2) Tcase = 25 C.
(2) RLout
(3) Tcase = 85 C.
(3) ISL
Fig 11. Input return loss, output return loss and
isolation as a function of frequency
BGA7024
Product data sheet
Fig 12. Output third-order intercept point as a function
of frequency
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Rev. 3 — 11 June 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
9 of 23
BGA7024
NXP Semiconductors
400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier
GND
GND
VCC
GND
GND
GND
J3
C7
R1
C6
J1
J2
MSL4
MSL3
C5 MSL5
L1
MSL1
C1
MSL6
MSL2
C2
J I HGF EDCBA
C4
MSL7
C3
1 2 3 4 5 6 7 8 9 10 12
11 13
RF in
RF out
014aab032
See Table 12 for a list of components.
Fig 13. 5 V application reference board; 1930 MHz to 1990 MHz
BGA7024
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 11 June 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
10 of 23
BGA7024
NXP Semiconductors
400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier
Table 12. 5 V application list of components; 1930 MHz to 1990 MHz
See Figure 8 and Figure 13 for component layout. PCB: Rogers RO4003C stack; height = 0.508 mm; copper plating
thickness = 35 m.
Component Description
Value
Function
Remarks
C1, C4
capacitor
15 pF
DC blocking
Murata GRM1885C1H150JA01D
C2
capacitor
2.4 pF
input match
Murata GRM1885C1H2R4CZ01D
C3
capacitor
1.5 pF
output match
Murata GRM1885C1H1R5CZ01D
C5
capacitor
15 pF
RF decoupling
Murata GRM1885C1H150JA01D
C6
capacitor
100 nF
DC decoupling AVX 0603YC104KAT2A
C7
capacitor
10 F
DC decoupling AVX 1206ZG106ZAT2A
J1, J2
RF connector
SMA
-
Emerson Network Power 142-0701-841
J3
DC connector
6-pins
-
MOLEX
L1
inductor
22 nH
DC feed
Tyco Electronics 36501J022JTDG
MSL1[1]
micro stripline
1.14 mm  0.8 mm  10.95 mm
input match
-
MSL2[1]
micro stripline
1.14 mm  0.8 mm  10.6 mm
input match
-
MSL3[1]
micro stripline
1.14 mm  0.8 mm  1.0 mm
input match
-
MSL4[1]
micro stripline
1.14 mm  0.8 mm  2.7 mm
output match
-
MSL5[1]
micro stripline
1.14 mm  0.8 mm  3.2 mm
output match
-
MSL6[1]
output match
-
micro stripline
1.14 mm  0.8 mm  5.5 mm
MSL7[1]
micro stripline
1.14 mm  0.8 mm  10.95 mm
output match
-
R1
resistor
0
-
Multicomp MC 0.063W 0603 0R
PCB
-
RO4003C
-
-
[1]
MSL1 to MSL7 dimensions specified as width  spacing  length.
12.3 2110 MHz to 2170 MHz
C6
R1
J3
VCC
C5
C7
L1
50 Ω
MSL1
C1
MSL2
MSL3
RF_IN
VCC(RF)
J1
C2
MSL4
BGA7024
MSL5
MSL6
C4
MSL7
50 Ω
J2
C3
014aab033
See Table 13 for a list of components.
PCB specification: Rogers RO4003C; height = 0.508 mm; r = 3.38; copper thickness = 35 m.
Fig 14. 5 V application schematic; 2110 MHz to 2170 MHz
BGA7024
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 11 June 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
11 of 23
BGA7024
NXP Semiconductors
400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier
014aab034
30
014aab035
20
PL(1dB)
(dBm)
Gp
(dB)
28
18
(1)
(2)
(1)
26
16
(2)
(3)
(3)
24
14
22
12
20
2.11
2.13
2.15
2.17
10
2.11
2.13
2.15
f (GHz)
(1) Tcase = 40 C.
(1) Tcase = 40 C.
(2) Tcase = 25 C.
(2) Tcase = 25 C.
(3) Tcase = 85 C.
(3) Tcase = 85 C.
Fig 15. Output power at 1 dB gain compression as a
function of frequency
014aab036
0
2.17
f (GHz)
Fig 16. Power gain as a function of frequency
014aab037
42
IP3O
(dBm)
RLin, RLout, ISL
(dB)
40
(1)
−10
38
(1)
(2)
(3)
36
−20
(2)
(3)
34
−30
2.11
2.13
2.15
2.17
32
2.11
2.13
f (GHz)
2.15
2.17
f (GHz)
Tcase = 25 C.
(1) Tcase = 40 C.
(1) RLin
(2) Tcase = 25 C.
(2) RLout
(3) Tcase = 85 C.
(3) ISL
Fig 17. Input return loss, output return loss and
isolation as a function of frequency
BGA7024
Product data sheet
Fig 18. Output third-order intercept point as a function
of frequency
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 11 June 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
12 of 23
BGA7024
NXP Semiconductors
400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier
GND
GND
VCC
GND
GND
GND
J3
C7
R1
C6
J1
J2
MSL4
MSL3
C5 MSL5
L1
MSL1
C1
MSL6
MSL2
C2
J I HGF EDCBA
C4
MSL7
C3
1 2 3 4 5 6 7 8 9 10 12
11 13
RF in
RF out
014aab038
See Table 13 for a list of components.
Fig 19. 5 V application reference board; 2110 MHz to 2170 MHz
BGA7024
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 11 June 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
13 of 23
BGA7024
NXP Semiconductors
400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier
Table 13. 5 V application list of components; 2110 MHz to 2170 MHz
See Figure 14 and Figure 19 for component layout. PCB: Rogers RO4003C stack; height = 0.508 mm; copper plating
thickness = 35 m.
Component Description
Value
Function
Remarks
C1, C4
capacitor
15 pF
DC blocking
Murata GRM1885C1H150JA01D
C2
capacitor
2.2 pF
input match
Murata GRM1885C1H2R2CZ01D
C3
capacitor
1.5 pF
output match
Murata GRM1885C1H1R5CZ01D
C5
capacitor
15 pF
RF decoupling
Murata GRM1885C1H150JA01D
C6
capacitor
100 nF
DC decoupling AVX 0603YC104KAT2A
C7
capacitor
10 F
DC decoupling AVX 1206ZG106ZAT2A
J1, J2
RF connector
SMA
-
Emerson Network Power
142-0701-841
J3
DC connector
6-pins
-
MOLEX
L1
inductor
22 nH
DC feed
Tyco Electronics 36501J022JTDG
MSL1[1]
micro stripline
1.14 mm  0.8 mm  10.95 mm input match
-
MSL2[1]
micro stripline
1.14 mm  0.8 mm  10.6 mm
input match
-
MSL3[1]
micro stripline
1.14 mm  0.8 mm  1.0 mm
input match
-
MSL4[1]
micro stripline
1.14 mm  0.8 mm  2.7 mm
output match
-
MSL5[1]
micro stripline
1.14 mm  0.8 mm  3.2 mm
output match
-
MSL6[1]
micro stripline
1.14 mm  0.8 mm  5.5 mm
output match
-
MSL7[1]
micro stripline
1.14 mm  0.8 mm  10.95 mm output match
-
R1
resistor
0
-
Multicomp MC 0.063W 0603 0R
PCB
-
RO4003C
-
-
[1]
MSL1 to MSL7 dimensions specified as width  spacing  length.
12.4 2405 MHz to 2485 MHz
VCC
C6
R1
J3
C5
C7
L2
50 Ω
MSL1
C1
MSL2
MSL3
J1
L1
C2
RF_IN
VCC(RF)
MSL4
BGA7024
MSL5
MSL6
C4
MSL7
50 Ω
J2
C3
014aab039
See Table 14 for a list of components.
PCB specification: Rogers RO4003C; height = 0.508 mm; r = 3.38; copper thickness = 35 m.
Fig 20. 5 V application schematic; 2405 MHz to 2485 MHz
BGA7024
Product data sheet
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Rev. 3 — 11 June 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
14 of 23
BGA7024
NXP Semiconductors
400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier
014aab040
30
014aab041
20
PL(1dB)
(dBm)
Gp
(dB)
28
18
26
16
(1)
(1)
24
14
(2)
(2)
(3)
22
(3)
12
20
2.405
2.425
2.445
2.465
2.485
f (GHz)
10
2.405
2.425
(1) Tcase = 40 C.
(1) Tcase = 40 C.
(2) Tcase = 25 C.
(2) Tcase = 25 C.
(3) Tcase = 85 C.
(3) Tcase = 85 C.
Fig 21. Output power at 1 dB gain compression as a
function of frequency
014aab042
0
2.445
2.465
2.485
f (GHz)
Fig 22. Power gain as a function of frequency
014aab043
42
IP3O
(dBm)
RLin, RLout, ISL
(dB)
40
−10
(2)
(2)
(3)
38
(1)
(1)
36
−20
(3)
34
−30
2.405
2.425
2.445
2.465
2.485
f (GHz)
Tcase = 25 C.
32
2.405
2.425
2.445
2.465
2.485
f (GHz)
(1) Tcase = 40 C.
(1) RLin
(2) Tcase = 25 C.
(2) RLout
(3) Tcase = 85 C.
(3) ISL
Fig 23. Input return loss, output return loss and
isolation as a function of frequency
BGA7024
Product data sheet
Fig 24. Output third-order intercept point as a function
of frequency
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 11 June 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
15 of 23
BGA7024
NXP Semiconductors
400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier
GND
GND
VCC
GND
GND
GND
J3
C7
R1
C6
J1
J2
MSL4
MSL3
C5 MSL5
L2
MSL1
C1
MSL6
MSL2
C2
L1
J I HGF EDCBA
C4
MSL7
C3
1 2 3 4 5 6 7 8 9 10 12
11 13
RF in
RF out
014aab044
See Table 14 for a list of components.
Fig 25. 5 V application reference board; 2405 MHz to 2485 MHz
BGA7024
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 11 June 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
16 of 23
BGA7024
NXP Semiconductors
400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier
Table 14. 5 V application list of components; 2405 MHz to 2485 MHz
See Figure 20 and Figure 25 for component layout. PCB: Rogers RO4003C stack; height = 0.508 mm; copper plating
thickness = 35 m.
Component
Description
Value
Function
Remarks
C1, C4
capacitor
15 pF
DC blocking
Murata GRM1885C1H150JA01D
C2
capacitor
1.5 pF
input match
Murata GRM1885C1H1R5CZ01D
C3
capacitor
1.8 pF
output match
Murata GRM1885C1H1R8CZ01D
C5
capacitor
15 pF
RF decoupling
Murata GRM1885C1H150JA01D
C6
capacitor
100 nF
DC decoupling
AVX 0603YC104KAT2A
C7
capacitor
10 F
DC decoupling
AVX 1206ZG106ZAT2A
J1, J2
RF connector
SMA
-
Emerson Network Power
142-0701-841
J3
DC connector
6-pins
-
MOLEX
L1
inductor
3.3 nH
input match
Tyco Electronics 36501J3N3JTDG
L2
inductor
22 nH
DC feed
Tyco Electronics 36501J022JTDG
MSL1[1]
micro stripline
1.14 mm  0.8 mm  10.95 mm
input match
-
MSL2[1]
micro stripline
1.14 mm  0.8 mm  9.8 mm
input match
-
MSL3[1]
micro stripline
1.14 mm  0.8 mm  1.9 mm
output match
-
MSL4[1]
micro stripline
1.14 mm  0.8 mm  2.5 mm
output match
-
MSL5[1]
micro stripline
1.14 mm  0.8 mm  1.6 mm
output match
-
MSL6[1]
micro stripline
1.14 mm  0.8 mm  7.3 mm
output match
-
MSL7[1]
micro stripline
1.14 mm  0.8 mm  10.95 mm
output match
-
R1
resistor
0
-
Multicomp MC 0.063W 0603 0R
PCB
-
RO4003C
-
-
[1]
MSL1 to MSL7 dimensions specified as width  spacing  length.
BGA7024
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 11 June 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
17 of 23
BGA7024
NXP Semiconductors
400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier
12.5 PCB stack
through via
35 μm (1 oz.) copper + 0.3 μm
gold plating
RF & analog routing
RO4003C, 0.51 mm (20 mil)
35 μm (1 oz.) copper
RF & analog ground
(1) 0.2 mm (8 mil)
35 μm (1 oz.) copper
analog routing
FR4, 0.15 mm (6 mil)
35 μm (1 oz.) copper
RF & analog ground
014aab045
(1) Pre-impregnated.
RO4003C dielectric constant r = 3.38.
Fig 26. PCB stack
BGA7024
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 11 June 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
18 of 23
BGA7024
NXP Semiconductors
400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier
13. Package outline
3ODVWLFVXUIDFHPRXQWHGSDFNDJHH[SRVHGGLHSDGIRUJRRGKHDWWUDQVIHUOHDGV
627
%
'
$
ES
(
+(
/S
F
ES
Z 0 %
ES
H
H
PP
VFDOH
',0(16,216PPDUHWKHRULJLQDOGLPHQVLRQV
81,7
$
ES
ES
ES
F
'
(
PP
287/,1(
9(56,21
H
H
+(
/S
Z
5()(5(1&(6
,(&
627
-('(&
-(,7$
72
6&
(8523($1
352-(&7,21
,668('$7(
Fig 27. Package outline SOT89
BGA7024
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 11 June 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
19 of 23
BGA7024
NXP Semiconductors
400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier
14. Abbreviations
Table 15.
Abbreviations
Acronym
Description
CPE
Customer-Premises Equipment
ESD
ElectroStatic Discharge
HTOL
High Temperature Operating Life
IR
InfraRed
ISM
Industrial, Scientific and Medical
MMIC
Monolithic Microwave Integrated Circuit
MoCA
Multimedia over Coax Alliance
PCB
Printed-Circuit Board
RFID
Radio Frequency IDentification
TX
Transmit
WLAN
Wireless Local Area Network
15. Revision history
Table 16.
Revision history
Document ID Release date
Data sheet status
Change notice
Supersedes
BGA7024 v.3
Product data sheet
-
BGA7024 v.2
Modifications:
20140611
•
Table 5 on page 3: Thermal simulation results have been replaced by IR measurements results.
BGA7024 v.2
20100830
Product data sheet
-
BGA7024 v.1
BGA7024
20100528
Product data sheet
-
-
BGA7024
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 11 June 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
20 of 23
BGA7024
NXP Semiconductors
400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier
16. Legal information
16.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
16.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
BGA7024
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 11 June 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
21 of 23
BGA7024
NXP Semiconductors
400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
17. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
BGA7024
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 11 June 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
22 of 23
BGA7024
NXP Semiconductors
400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier
18. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
9
10
11
12
12.1
12.2
12.3
12.4
12.5
13
14
15
16
16.1
16.2
16.3
16.4
17
18
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal characteristics . . . . . . . . . . . . . . . . . . 3
Static characteristics. . . . . . . . . . . . . . . . . . . . . 3
Dynamic characteristics . . . . . . . . . . . . . . . . . . 3
Scattering parameters . . . . . . . . . . . . . . . . . . . . 4
Reliability information . . . . . . . . . . . . . . . . . . . . 5
Moisture sensitivity . . . . . . . . . . . . . . . . . . . . . . 5
Application information. . . . . . . . . . . . . . . . . . . 6
920 MHz to 960 MHz . . . . . . . . . . . . . . . . . . . . 6
1930 MHz to 1990 MHz . . . . . . . . . . . . . . . . . . 8
2110 MHz to 2170 MHz . . . . . . . . . . . . . . . . . 11
2405 MHz to 2485 MHz . . . . . . . . . . . . . . . . . 14
PCB stack . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 19
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 20
Legal information. . . . . . . . . . . . . . . . . . . . . . . 21
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 21
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Contact information. . . . . . . . . . . . . . . . . . . . . 22
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2014.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 11 June 2014
Document identifier: BGA7024
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