Data Sheet

SA612A
Double-balanced mixer and oscillator
Rev. 3 — 4 June 2014
Product data sheet
1. General description
The SA612A is a low-power VHF monolithic double-balanced mixer with on-board
oscillator and voltage regulator. It is intended for low cost, low-power communication
systems with signal frequencies to 500 MHz and local oscillator frequencies as high as
200 MHz. The mixer is a ‘Gilbert cell’ multiplier configuration that provides gain of 14 dB or
more at 45 MHz.
The oscillator can be configured for a crystal, a tuned tank operation, or as a buffer for an
external LO. Noise figure at 45 MHz is typically below 6 dB and makes the device
well-suited for high-performance cordless phone/cellular radio. The low power
consumption makes the SA612A excellent for battery-operated equipment. Networking
and other communications products can benefit from very low radiated energy levels
within systems. The SA612A is available in an 8-lead SO (surface-mounted miniature
package).
2. Features and benefits






Low current consumption
Low cost
Operation to 500 MHz
Low radiated energy
Low external parts count; suitable for crystal/ceramic filter
Excellent sensitivity, gain, and noise figure
3. Applications









Cordless telephone
Portable radio
VHF transceivers
RF data links
Sonobuoys
Communications receivers
Broadband LANs
HF and VHF frequency conversion
Cellular radio mixer/oscillator
SA612A
NXP Semiconductors
Double-balanced mixer and oscillator
4. Ordering information
Table 1.
Ordering information
Type number
SA612AD/01
Topside
marking
Package
Name
Description
Version
SA612A
SO8
plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
4.1 Ordering options
Table 2.
Ordering options
Type number
Orderable
part number
Package
Packing method
Minimum
order
quantity
Temperature
SA612AD/01
SA612AD/01,112
SO8
Standard marking
*IC’s tube - DSC bulk pack
2000
Tamb = 40 C to +85 C
SA612AD/01,118
SO8
Reel 13” Q1/T1
*Standard mark SMD
2500
Tamb = 40 C to +85 C
7
6
5
E
B
2
3
GND
4
OUT_A
1
IN_B
OSCILLATOR
IN_A
VOLTAGE
REGULATOR
OUT_B
8
OSC_B
VCC
OSC_E
5. Block diagram
aaa-013372
Fig 1.
SA612A
Product data sheet
Block diagram
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Rev. 3 — 4 June 2014
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2 of 19
SA612A
NXP Semiconductors
Double-balanced mixer and oscillator
6. Pinning information
6.1 Pinning
SA612AD/01
IN_A
1
8
VCC
IN_B
2
7
OSC_E
GND
3
6
OSC_B
OUT_A
4
5
OUT_B
aaa-013371
Fig 2.
Pin configuration for SO8
6.2 Pin description
Table 3.
SA612A
Product data sheet
Pin description
Symbol
Pin
Description
IN_A
1
RF input A
IN_B
2
RF input B
GND
3
ground
OUT_A
4
mixer output A
OUT_B
5
mixer output B
OSC_B
6
oscillator input (base)
OSC_E
7
oscillator output (emitter)
VCC
8
supply voltage
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Rev. 3 — 4 June 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
3 of 19
SA612A
NXP Semiconductors
Double-balanced mixer and oscillator
7. Functional description
The SA612A is a Gilbert cell, an oscillator/buffer, and a temperature-compensated bias
network as shown in Figure 3. The Gilbert cell is a differential amplifier (IN_A and IN_B
pins) that drives a balanced switching cell. The differential input stage provides gain and
determines the noise figure and signal handling performance of the system.
18 kΩ
buffer
1.5 kΩ
1.5 kΩ
4
5
6
7
25 kΩ
BIAS
BIAS
2
1
BIAS
1.5 kΩ
1.5 kΩ
3
GND
Fig 3.
aaa-013205
Equivalent circuit
The SA612A is designed for optimum low-power performance. When used with the
SA614A as a 45 MHz cordless phone/cellular radio second IF and demodulator, the
SA612A is capable of receiving 119 dBm signals with a 12 dB S/N ratio. Third-order
intercept is typically 15 dBm (that is approximately +5 dBm output intercept because of
the RF gain). The system designer must be cognizant of this large signal limitation. When
designing LANs or other closed systems where transmission levels are high, and
small-signal or signal-to-noise issues are not critical, the input to the SA612A should be
appropriately scaled.
Besides excellent low-power performance well into VHF, the SA612A is flexible. The input,
output and oscillator ports support various configurations provided the designer
understands certain constraints, which are explained here.
The RF inputs (IN_A and IN_B pins) are biased internally. They are symmetrical. The
equivalent AC input impedance is approximately 1.5 k  3 pF through 50 MHz. IN_A and
IN_B pins can be used interchangeably, but they should not be DC biased externally.
Figure 4 shows three typical input configurations.
SA612A
Product data sheet
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Rev. 3 — 4 June 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
4 of 19
SA612A
NXP Semiconductors
Double-balanced mixer and oscillator
SA612A
SA612A
2
1
2
1
2
1
SA612A
input
aaa-013374
a. Single-ended
tuned input
Fig 4.
aaa-013375
aaa-013376
b. Balanced input
(for attenuation of
second-order
products)
c. Single-ended
untuned input
Input configuration
The mixer outputs (OUT_A and OUT_B pins) are also internally biased. Each output is
connected to the internal positive supply by a 1.5 k resistor. This permits direct output
termination yet allows for balanced output as well. Figure 5 shows three single-ended
output configurations and a balanced output.
CFU455
or equivalent
Ctune(xtal)
5
5
12 pF
SA612A
Filter: K&L 38780 or equivalent
Ctune(xtal) matches 3.5 kΩ to next stage
4
4
SA612A
aaa-013377
b. Single-ended crystal filter
5
5
a. Single-ended ceramic filter
aaa-013378
SA612A
4
4
SA612A
aaa-013380
aaa-013379
c. Single-ended IFT
Fig 5.
d. Balanced output
Output configuration
SA612A
Product data sheet
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Rev. 3 — 4 June 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
5 of 19
SA612A
NXP Semiconductors
Double-balanced mixer and oscillator
The oscillator can sustain oscillation beyond 200 MHz in crystal or tuned tank
configurations. The upper limit of operation is determined by tank ‘Q’ and required drive
levels. The higher the ‘Q’ of the tank or the smaller the required drive, the higher the
permissible oscillation frequency. If the required LO is beyond oscillation limits, or the
system calls for an external LO, the external signal can be injected at OSC_B (pin 6)
through a DC blocking capacitor. External LO should be 200 mV (peak-to-peak) minimum
up to 300 mV (peak-to-peak) maximum.
Figure 6 shows several proven oscillator circuits. Figure 6a is appropriate for cordless
phones or cellular radio. As shown, an overtone mode of operation is utilized. Capacitor
C3 and inductor L1 act as a fundamental trap. In fundamental mode oscillation, the trap is
omitted.
C2
L1
XTAL
C3
aaa-013381
a. Colpitts crystal
oscillator
(overtone mode)
Fig 6.
5
6
7
8
5
aaa-013382
b. Colpitts L/C tank
oscillator
4
3
1
4
SA612A
2
6
3
2
1
SA612A
4
3
2
1
SA612A
7
8
5
6
7
8
C1
aaa-013383
c. Hartley L/C tank
oscillator
Oscillator circuits
Figure 7 shows a Colpitts varactor tuned tank oscillator suitable for synthesizer-controlled
applications. It is important to buffer the output of this circuit to assure that switching
spikes from the first counter or prescaler do not end up in the oscillator spectrum. The
dual-gate MOSFET provides optimum isolation with low current. The FET offers good
isolation, simplicity, and low current, while the bipolar transistors provide the simple
solution for non-critical applications. The resistive divider in the emitter-follower circuit
should be chosen to provide the minimum input signal that assures correct system
operation.
SA612A
Product data sheet
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Rev. 3 — 4 June 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
6 of 19
SA612A
NXP Semiconductors
Double-balanced mixer and oscillator
5.5 μH
+6 V
10 nF
10 μF
0.1 μF
8
1
to buffer
7
2
SA612A
10 pF
7 pF
3
6
4
5
1000 pF
1000 pF
DC control voltage
from synthesizer
MV2105
or equivalent
0.06 μH
0.01 μF
100 kΩ
2 kΩ
2N918
0.01 pF
3SK126
2 pF
to synthesizer
100 kΩ
330 Ω
2N5484
to synthesizer
0.01 μF
100 kΩ
1.0 nF
aaa-013384
Fig 7.
Colpitts oscillator suitable for synthesizer applications and typical buffers
8. Application design-in information
22 pF
0.5 μH to
1.3 μH
44.545 MHz
third overtone crystal
1 nF
5.6 pF
5.5 μH
5
6
10 nF
7
100 nF
6.8 μF
8
VCC
45 MHz
RF input
47 pF
220 pF
0.209 μH
to
0.283 μH
4
3
2
1
SA612A
SFG455A3
or equivalent
455 kHz
output
100 nF
aaa-013385
Fig 8.
SA612A
Product data sheet
Typical application for cordless/cellular radio
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Rev. 3 — 4 June 2014
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SA612A
NXP Semiconductors
Double-balanced mixer and oscillator
9. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
VCC
supply voltage
Tstg
storage temperature
Tamb
ambient temperature
operating
Min
Max
Unit
-
9
V
65
+150
C
40
+85
C
10. Static characteristics
Table 5.
Static characteristics
Tamb = 25 C; VCC = +6 V; unless specified otherwise. Refer to Figure 15.
Symbol
Parameter
VCC
ICC
Conditions
Min
Typ
Max
Unit
supply voltage
4.5
-
8.0
V
supply current
-
2.4
3.0
mA
Typ
Max
11. Dynamic characteristics
Table 6.
Dynamic characteristics
Tamb = 25 C; VCC = +6 V; unless specified otherwise. Refer to Figure 15.
SA612A
Product data sheet
Symbol
Parameter
Conditions
Min
Unit
fi
input frequency
-
500
-
MHz
fosc
oscillator frequency
-
200
-
MHz
NF
noise figure
at 45 MHz
-
5.0
-
dB
IP3i
input third-order
intercept point
RF input = 45 dBm;
RF1 = 45.0 MHz;
RF2 = 45.06 MHz
-
13
-
dBm
Gconv
conversion gain
at 45 MHz
14
17
-
dB
Ri(RF)
RF input resistance
1.5
-
-
k
Ci(RF)
RF input capacitance
Ro(mix)
mixer output resistance
OUT_A, OUT_B pins
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 4 June 2014
-
3
-
pF
-
1.5
-
k
© NXP Semiconductors N.V. 2014. All rights reserved.
8 of 19
SA612A
NXP Semiconductors
Double-balanced mixer and oscillator
12. Performance curves
aaa-013241
3.5
ICC
(mA)
Gconv
(dB)
VCC = 8.5 V
3.0
aaa-013242
20.0
VCC = 8.5 V
18.0
6.0 V
2.5
4.5 V
6.0 V
16.0
4.5 V
2.0
1.5
−40
Fig 9.
−20
0
20
40
60
80 90
Tamb (°C)
Supply current versus temperature
−20
0
20
40
60
80 90
Tamb (°C)
Fig 10. Conversion gain versus temperature
aaa-013243
−10.0
14.0
−40
aaa-013244
6.0
NF
(dB)
IP3i
(dBm)
5.5
−12.0
VCC = 8.5 V
6.0 V
4.5 V
5.0
−14.0
4.5
−16.0
−40
−20
0
20
40
60
80 90
Tamb (°C)
Fig 11. Third-order intercept point versus temperature
aaa-013245
40
−20
0
20
40
60
80 90
Tamb (°C)
Fig 12. Noise Figure versus temperature
aaa-013246
−10
IP3i
(dBm)
third-order product
IF output power
(dBm)
4.0
−40
−12
0
−14
fund. product
−40
−16
−80
−80
−18
−60
−40
−20
4
0
20
RF input level (dBm)
6
8
10
VCC (V)
RF1 = 45 MHz; IF = 455 kHz; RF2 = 45.06 MHz
Fig 13. Third-order intercept and compression
SA612A
Product data sheet
Fig 14. Input third-order intercept point versus
supply voltage
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Rev. 3 — 4 June 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
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SA612A
NXP Semiconductors
Double-balanced mixer and oscillator
13. Test information
22 pF
0.5 μH to
1.3 μH
1 nF
44.545 MHz
third overtone crystal
10 pF
5.5 μH
5
10 nF
6
100 nF
7
6.8 μF
8
VCC
330 pF
303 μH
to
765 μH
SA612A
455 kHz
IF output
560 pF
45 MHz
RF input
47 pF
220 pF
4
3
2
1
100 nF
0.209 μH
to
0.283 μH
100 nF
aaa-013373
Fig 15. Test configuration
SA612A
Product data sheet
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Rev. 3 — 4 June 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
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SA612A
NXP Semiconductors
Double-balanced mixer and oscillator
14. Package outline
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Fig 16. Package outline SOT96-1 (SO8)
SA612A
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 4 June 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
11 of 19
SA612A
NXP Semiconductors
Double-balanced mixer and oscillator
15. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
15.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
15.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
•
•
•
•
•
•
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
15.3 Wave soldering
Key characteristics in wave soldering are:
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
SA612A
Product data sheet
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Rev. 3 — 4 June 2014
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SA612A
NXP Semiconductors
Double-balanced mixer and oscillator
15.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 17) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 7 and 8
Table 7.
SnPb eutectic process (from J-STD-020D)
Package thickness (mm)
Package reflow temperature (C)
Volume (mm3)
< 350
 350
< 2.5
235
220
 2.5
220
220
Table 8.
Lead-free process (from J-STD-020D)
Package thickness (mm)
Package reflow temperature (C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 17.
SA612A
Product data sheet
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Rev. 3 — 4 June 2014
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SA612A
NXP Semiconductors
Double-balanced mixer and oscillator
temperature
maximum peak temperature
= MSL limit, damage level
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 17. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
16. Soldering: PCB footprints
î
î
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SODFHPHQWDFFXUDF\“
'LPHQVLRQVLQPP
VRWBIU
Fig 18. PCB footprint for SOT96-1 (SO8); reflow soldering
SA612A
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 4 June 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
14 of 19
SA612A
NXP Semiconductors
Double-balanced mixer and oscillator
î
HQODUJHGVROGHUODQG
î
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Fig 19. PCB footprint for SOT96-1 (SO8); wave soldering
17. Abbreviations
Table 9.
SA612A
Product data sheet
Abbreviations
Acronym
Description
FET
Field-Effect Transistor
HF
High Frequency
IF
Intermediate Frequency
LAN
Local Area Network
LO
Local Oscillator
MOSFET
Metal-Oxide Semiconductor Field-Effect Transistor
RF
Radio Frequency
S/N
Signal-to-Noise ratio
VHF
Very High Frequency
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SA612A
NXP Semiconductors
Double-balanced mixer and oscillator
18. Revision history
Table 10.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
SA612A v.3
20140604
Product data sheet
-
SA612A v.2
Modifications:
•
The format of this data sheet has been redesigned to comply with the new identity guidelines of
NXP Semiconductors.
•
•
•
Legal texts have been adapted to the new company name where appropriate.
Section 1 “General description”, last sentence: deleted “8-lead dual in-line plastic package”
Table 1 “Ordering information”:
– Type number SA612AN (DIP8 package, SOT97-1 package outline) is discontinued and
removed from this data sheet
– Type number changed from “SA612AD” to “SA612AD/01”
•
•
Added Section 4.1 “Ordering options”
Figure 2 “Pin configuration for SO8”, pin names are updated:
– Pin 1: from “INPUT A” to “IN_A”
– Pin 2: from “INPUT B” to “IN_B”
– Pin 4: from “OUTPUT A” to “OUT_A”
– Pin 5: from “OUTPUT B” to “OUT_B”
– Pin 6: from “OSCILLATOR” to “OSC_B”
– Pin 7: from “OSCILLATOR” to “OSC_E”
•
•
Added Section 6.2 “Pin description”
•
Figure 7 “Colpitts oscillator suitable for synthesizer applications and typical buffers”: capacitor
value corrected from “0.10 pF” to “10 nF” (above pin 8)
•
Old table “AC/DC electrical characteristics” split into Table 5 “Static characteristics” and
Table 6 “Dynamic characteristics”
•
Table 6 “Dynamic characteristics”, Conditions for IP3i, input third-order intercept point, updated
from “at 45 MHz; RF input = 45 dBm” to “”
•
•
•
•
Package outline SOT97-1 (DIP8) is deleted
Section 7 “Functional description”, seventh paragraph, second sentence changed from “In this
circuit, a third overtone parallel-mode crystal with approximately 5 pF load capacitance should be
specified.” to “As shown, an overtone mode of operation is utilized.”
Added soldering information
Added Section 16 “Soldering: PCB footprints”
Added Section 17 “Abbreviations”
SA612A v.2
19971107
Product specification
853-0391 18662
NE/SA612A v.1
NE/SA612A v.1
19900917
Product specification
853-0391 00446
-
SA612A
Product data sheet
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Rev. 3 — 4 June 2014
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SA612A
NXP Semiconductors
Double-balanced mixer and oscillator
19. Legal information
19.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
19.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
19.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
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Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 4 June 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
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Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
19.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
20. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
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All information provided in this document is subject to legal disclaimers.
Rev. 3 — 4 June 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
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21. Contents
1
2
3
4
4.1
5
6
6.1
6.2
7
8
9
10
11
12
13
14
15
15.1
15.2
15.3
15.4
16
17
18
19
19.1
19.2
19.3
19.4
20
21
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
Functional description . . . . . . . . . . . . . . . . . . . 4
Application design-in information . . . . . . . . . . 7
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 8
Static characteristics. . . . . . . . . . . . . . . . . . . . . 8
Dynamic characteristics . . . . . . . . . . . . . . . . . . 8
Performance curves . . . . . . . . . . . . . . . . . . . . . 9
Test information . . . . . . . . . . . . . . . . . . . . . . . . 10
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11
Soldering of SMD packages . . . . . . . . . . . . . . 12
Introduction to soldering . . . . . . . . . . . . . . . . . 12
Wave and reflow soldering . . . . . . . . . . . . . . . 12
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 12
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 13
Soldering: PCB footprints. . . . . . . . . . . . . . . . 14
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 16
Legal information. . . . . . . . . . . . . . . . . . . . . . . 17
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 17
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Contact information. . . . . . . . . . . . . . . . . . . . . 18
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2014.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 4 June 2014
Document identifier: SA612A