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49-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
(BC-49-3)
Dimensions shown in millimeters
a
8.20
8.00 SQ
7.80
A1 CORNER
INDEX AREA
7
6
5
4
3
2
1
A
BALL A1
PAD CORNER
TOP VIEW
B
C
6.00
BSC SQ
D
E
F
G
1.00
BSC
DETAIL A
BOTTOM
VIEW
DETAIL A
0.25
MIN
0.70
0.60
0.50
BALL DIAMETER
SEATING
PLANE
*COMPLIANT WITH JEDEC STANDARDS MO-192-ABB-1
WITH EXCEPTION TO PACKAGE HEIGHT AND THICKNESS.
*1.31
1.21
1.10
COPLANARITY
0.20
012006-0
*1.85
1.71
1.50