Materials Declaration Package Body Size LeadCount Option SSOP 5.3 mm 24 Pb Free Molding Compound % of Compound Weight (g) 10 1.15 E-02 85 9.78 E-02 3 3.45 E-03 1.5 1.73 E-03 0.5 5.75 E-04 PPM 61968 526724 18590 9295 3098 Cu Fe P Zn Leadframe % of Leadframe 97.5 2.35 0.03 0.12 Weight (g) 5.51 E-02 1.33 E-03 1.69 E-05 6.78 E-05 PPM 296605 7149 91 365 Ag Internal Leadframe Plating % of Plating Weight (g) 9.00 E-04 100 PPM 4848 External Leadframe Plating Weight (g) % of Plating 100 3.10 E-03 PPM 16699 Item Epoxy resin SiO2 Filler Phenol Resin Antimony_Sb2O3 Brominated Resin Item Item Sn Au Bond Wires % of Wire 99.99 Weight (g) 6.20 E-04 PPM 3340 Si Chip % of Chip 100 Weight (g) 9.20 E-03 PPM 49558 Die Attach % of Die Attach 25 75 Weight (g) 7.75 E-05 2.33 E-04 PPM Item Resin Ag Filler Item Pb Cd Hg Cr+6 Molding Compound Method PPM <2 US EPA method #3052 & 6010B Not Detected BS EN 1122:2001 ICP AES <2 US EPA method #3052 & 7471A <2 US EPA method #3060A & 6010B Die Attach Paste Item Pb Cd Hg Cr+6 PBB PBDE PPM <5 <5 <5 <5 Not Detected Not Detected Method ICP AES ICP AES ICP AES ICP AES 417 1252 Package Totals Weight (g) PPM 1000000 1.86 E-01 AMK-RS-E Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 6/21/04 Materials Declaration Package Body Size LeadCount Option Item Epoxy resin SiO2 Filler Phenol Resin Antimony_Sb2O3 Brominated Resin Item Cu Fe P Zn SSOP 5.3 mm 24 Sn/Pb Molding Compound % of Compound Weight (g) 10 1.15 E-02 85 9.78 E-02 3 3.45 E-03 1.5 1.73 E-03 0.5 5.75 E-04 PPM 61968 526724 18590 9295 3098 Leadframe % of Leadframe 97.5 2.35 0.03 0.12 PPM 296605 7149 91 365 Weight (g) 5.51 E-02 1.33 E-03 1.69 E-05 6.78 E-05 Ag Internal Leadframe Plating % of Plating Weight (g) 9.00 E-04 100 Sn Pb External Leadframe Plating Weight (g) % of Plating 85 2.64 E-03 15 4.65 E-04 Item Molding Compound PPM Method US EPA method #3052 & 6010B BS EN 1122:2001 ICP AES US EPA method #3052 & 7471A US EPA method #3060A & 6010B Die Attach Paste Item Pb Cd Hg Cr+6 PBB PBDE PPM <5 <5 <5 <5 Not Detected Not Detected Method ICP AES ICP AES ICP AES ICP AES PPM 14194 2505 Bond Wires % of Wire 99.99 Weight (g) 6.20 E-04 PPM Si Chip % of Chip 100 Weight (g) 9.20 E-03 PPM 49558 Die Attach % of Die Attach 25 75 Weight (g) 7.75 E-05 2.33 E-04 PPM Item PPM <2 Not Detected <2 <2 4848 Au Resin Ag Filler Item Pb Cd Hg Cr+6 3340 417 1252 Package Totals Weight (g) PPM 1000000 1.86 E-01 AMK-RS-A Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 6/21/04