Materials Declaration Package Body Size LeadCount Option PDIP 300 mils 14 PbFree Molding Compound % of Compound Weight (g) 16 1.02 E-01 72 4.57 E-01 8 5.08 E-02 2.2 1.40 E-02 1.6 1.02 E-02 0.2 1.27 E-03 PPM 104198 468893 52099 14327 10420 1302 Item Pb Cd Hg Cr+6 Cu Fe P Zn Leadframe % of Leadframe 97.5 2.35 0.03 0.12 PPM 313668 7560 97 386 Ag Internal Leadframe Plating % of Plating Weight (g) 9.21 E-04 100 Item Pb Cd Hg Cr+6 PBB PBDE Item Epoxy Cresol Novolac SiO2 Filler Phenol Novolac Antimony_Sb2O3 Brominated Resin Carbon Black Item Item Sn Au Si Item Resin Ag Filler Molding Compound Method PPM <2 US EPA method #3052 & 6010B Not Detected BS EN 1122:2001 ICP AES <2 US EPA method #3052 & 7471A <2 US EPA method #3060A & 6010B Die Attach Paste Weight (g) 3.06 E-01 7.37 E-03 9.41 E-05 3.76 E-04 External Leadframe Plating Weight (g) % of Plating 100 1.54 E-02 PPM <2 <2 <2 <2 Not Detected Not Detected Method ICP AES ICP AES ICP AES ICP AES PPM 945 PPM 15831 Bond Wires % of Wire 99.99 Weight (g) 1.72 E-04 PPM Chip % of Chip 100 Weight (g) 9.08 E-03 PPM Die Attach % of Die Attach 25 75 Weight (g) 1.92 E-04 5.75 E-04 PPM 176 9310 197 590 Package Totals Weight (g) PPM 1000000 9.75 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Materials Declaration Package Body Size LeadCount Option PDIP 300 mils 14 Sn/Pb Molding Compound % of Compound Weight (g) 16 1.02 E-01 72 4.57 E-01 8 5.08 E-02 2.2 1.40 E-02 1.6 1.02 E-02 0.2 1.27 E-03 PPM 104198 468893 52099 14327 10420 1302 Item Pb Cd Hg Cr+6 Cu Fe P Zn Leadframe % of Leadframe 97.5 2.35 0.03 0.12 PPM 313668 7560 97 386 Ag Internal Leadframe Plating % of Plating Weight (g) 9.21 E-04 100 Item Pb Cd Hg Cr+6 PBB PBDE Item Epoxy Cresol Novolac SiO2 Filler Phenol Novolac Antimony_Sb2O3 Brominated Resin Carbon Black Item Item Sn Pb Au Si Item Resin Ag Filler Molding Compound Method PPM <2 US EPA method #3052 & 6010B Not Detected BS EN 1122:2001 ICP AES <2 US EPA method #3052 & 7471A <2 US EPA method #3060A & 6010B Die Attach Paste Weight (g) 3.06 E-01 7.37 E-03 9.41 E-05 3.76 E-04 External Leadframe Plating Weight (g) % of Plating 85 1.31 E-02 15 2.32 E-03 PPM <2 <2 <2 <2 Not Detected Not Detected Method ICP AES ICP AES ICP AES ICP AES PPM 945 PPM 13456 2375 Bond Wires % of Wire 99.99 Weight (g) 1.72 E-04 PPM Chip % of Chip 100 Weight (g) 9.08 E-03 PPM Die Attach % of Die Attach 25 75 Weight (g) 1.92 E-04 5.75 E-04 PPM 176 9310 197 590 Package Totals Weight (g) PPM 1000000 9.75 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary