Materials Declaration Package Body Size LeadCount Option Item Epoxy Cresol Novolac SiO2 Filler Phenol Novolac Antimony_Sb2O3 Brominated Resin Carbon Black Item Cu Fe P Zn Ag Item Sn PDIP 300 mils 16 Pb Free Molding Compound % of Compound Weight (g) 16 8.57 E-02 72 3.86 E-01 8 4.28 E-02 2.2 1.18 E-02 1.6 8.57 E-03 0.2 1.07 E-03 Sub-Total 5.35 E-01 PPM 92590 416654 46295 12731 9259 1157 578686 Item Pb Cd Hg Cr+6 Leadframe % of Leadframe 97.5 2.35 0.03 0.12 Sub-Total Weight (g) 3.52 E-01 8.48 E-03 1.08 E-04 4.33 E-04 3.61 E-01 PPM 380451 9170 117 468 390206 Item Pb Cd Hg Cr+6 PBB PBDE Internal Leadframe Plating Weight (g) % of Plating 1.10 E-03 100 PPM 1185 External Leadframe Plating % of Plating Weight (g) 1.76 E-02 100 PPM 19069 Die Attach Paste Sub-Total 1.76 E-02 Weight (g) 1.97 E-04 PPM Au Bond Wires % of Wire 99.99 Si Chip % of Chip 100 Weight (g) 9.08 E-03 PPM 9813 Die Attach % of Die Attach 25 75 Weight (g) 1.92 E-04 5.75 E-04 PPM Item Resin Ag Filler Sub-Total Molding Compound Method PPM <2 US EPA method #3052 & 6010B Not Detected BS EN 1122:2001 ICP AES <2 US EPA method #3052 & 7471A <2 US EPA method #3060A & 6010B PPM <2 <2 <2 <2 Not Detected Not Detected Method ICP AES ICP AES ICP AES ICP AES 19069 212 7.67 E-04 207 622 829 Package Totals PPM Weight (g) 1000000 9.25 E-01 CRS-N-E Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 1/18/2005 Materials Declaration Package Body Size LeadCount Option Item Epoxy Cresol Novolac SiO2 Filler Phenol Novolac Antimony_Sb2O3 Brominated Resin Carbon Black Item Cu Fe P Zn PDIP 300 mils 16 Sn/Pb Molding Compound % of Compound Weight (g) 16 8.57 E-02 72 3.86 E-01 8 4.28 E-02 2.2 1.18 E-02 1.6 8.57 E-03 0.2 1.07 E-03 Sub-Total 5.35 E-01 Leadframe % of Leadframe 97.5 2.35 0.03 0.12 Sub-Total Item Sn Pb External Leadframe Plating % of Plating Weight (g) 1.50 E-02 85 2.65 E-03 15 Sub-Total 1.76 E-02 Bond Wires % of Wire Weight (g) 1.97 E-04 99.99 Au 92590 416654 46295 12731 9259 1157 578686 Item Pb Cd Hg Cr+6 Molding Compound Method PPM <2 US EPA method #3052 & 6010B Not Detected BS EN 1122:2001 ICP AES <2 US EPA method #3052 & 7471A <2 US EPA method #3060A & 6010B Die Attach Paste Weight (g) 3.52 E-01 8.48 E-03 1.08 E-04 4.33 E-04 3.61 E-01 Internal Leadframe Plating Weight (g) % of Plating 1.10 E-03 100 Ag PPM PPM 380451 9170 117 468 390206 Item Pb Cd Hg Cr+6 PBB PBDE PPM <2 <2 <2 <2 Not Detected Not Detected Method ICP AES ICP AES ICP AES ICP AES PPM 1185 PPM 16208 2860 19069 PPM 212 Chip % of Chip Si 100 Item Resin Ag Filler Die Attach % of Die Attach 25 75 Sub-Total Weight (g) 9.08 E-03 PPM Weight (g) 1.92 E-04 5.75 E-04 PPM 7.67 E-04 9813 207 622 829 Package Totals PPM Weight (g) 1000000 9.25 E-01 CRS-N-A Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 1/18/2005