Product / Package Information Environmental Information Package Body Size (mm) Lead Count Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant LFCSP - Punched 10 X 10 X 0.85 (8.2 EP) 72 100 Sn Yes Yes Yes Yes Materials Declaration Molding Compound Homogeneous Material Level Description Other inorganic materials Thermosets Other inorganic materials Subtotal Substance Silica Epoxy & Phenol Resin Carbon black CAS# Component Level Weight (g) 60676-86-0 Proprietary 1333-86-4 1.43E-01 2.10E-02 5.09E-04 1.64 E-01 Percentage (%) PPM Percentage (%) 86.9 12.8 0.3 100.00 869100 127800 3100 1000000 47.14 6.93 0.17 54.24 PPM 471420 69322 1682 542423 Leadframe Homogeneous Material Level Substance Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Copper Iron Zinc Phosphorus CAS# Component Level Weight (g) 7440-50-8 7439-89-6 7440-66-6 7723-14-0 9.75 E-02 2.35 E-03 1.20 E-04 3.00 E-05 1.00 E-01 Percentage (%) PPM Percentage (%) 97.5 2.35 0.12 0.03 100.00 975000 23500 1200 300 1000000 32.21 0.78 0.04 0.01 33.04 PPM 322097 7763 396 99 330356 Internal Leadframe Plating Homogeneous Material Level Substance Description Precious metals Silver CAS# Component Level Weight (g) 9.79 E-04 7440-22-4 Percentage (%) PPM Percentage (%) 100.0 1000000 0.32 PPM 3236 External Leadframe Plating Homogeneous Material Level Description Tin & its alloys Substance Tin CAS# 7440-31-5 Component Level Weight (g) 5.84 E-03 Percentage (%) PPM Percentage (%) 100.0 1000000 1.93 PPM 19291 Bond Wires Homogeneous Material Level Description Precious metals Substance Gold CAS# 7440-57-5 Component Level Weight (g) 2.09 E-03 Percentage (%) PPM Percentage (%) 100.0 1000000 0.69 PPM 6908 Chip Component Level Homogeneous Material Level Description Other inorganic materials Substance Doped Silicon CAS# 7440-21-3 Weight (g) 2.55 E-02 Percentage (%) PPM Percentage (%) 100.0 1000000 8.43 PPM 84259 Die Attach Homogeneous Material Level Description Precious metals Thermoset Other organic materials Other organic materials Other organic materials Other organic materials Other organic materials Other inorganic materials Other organic materials Subtotal Package Totals Substance Silver Epichlorohydrin-formaldehyde-phenol copolymer Epoxy resin, epichlorohydrin-dimer fatty acid Butyrolactone, gammaPoly(oxypropylene)diamine 2,6-Diglycidyl phenyl allyl ether oligomer Organosilane Copper(II) oxide Epoxy resin modifier CAS# 7440-22-4 9003-36-5 68475-94-5 96-48-0 9046-10-0 Unassigned TS ref# 10001 1317-38-0 TS ref# 10038 Component Level Weight (g) 3.18 E-03 1.27 E-04 1.27 E-04 1.27 E-04 1.27 E-04 1.27 E-04 1.27 E-04 1.27 E-04 2.13 E-05 4.09 E-03 Weight (g) 3.03 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Percentage (%) PPM Percentage (%) 77.71 3.11 3.11 3.11 3.11 3.11 3.11 3.11 0.52 100.0 777100 31100 31100 31100 31100 31100 31100 31100 5200 1000000 1.05 0.04 0.04 0.04 0.04 0.04 0.04 0.04 0.01 1.35 Percentage (%) 100 PPM 10511 421 421 421 421 421 421 421 70 13526 PPM 1000000