Product / Package Information Environmental Information Package Body Size (mm) Lead Count Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant LFCSP - Sawn 5 X 5 X 0.75 (3.3 EP) 32 100 Sn Yes Yes Yes Yes Materials Declaration Molding Compound Homogeneous Material Level Substance Description Other inorganic materials Thermosets Other inorganic materials Subtotal Silica Epoxy & Phenol Resin Carbon black CAS# 60676-86-0 Proprietary 1333-86-4 Component Level Weight (g) 4.58E-02 6.74E-03 1.63E-04 5.27 E-02 Percentage (%) PPM Percentage (%) 86.91 12.78 0.31 100.00 869100 127800 3100 1000000 38.44 5.65 0.14 44.23 PPM 384398 56525 1371 442294 Leadframe Homogeneous Material Level Substance Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Copper Iron Zinc Phosphorus CAS# 7440-50-8 7439-89-6 7440-66-6 7723-14-0 Component Level Weight (g) 5.59 E-02 1.35 E-03 6.88 E-05 1.72 E-05 5.73 E-02 Percentage (%) PPM Percentage (%) 97.50 2.35 0.12 0.03 100.00 975000 23500 1200 300 1000000 46.89 1.13 0.06 0.01 48.09 PPM 468896 11302 577 144 480919 Internal Leadframe Plating Component Level Homogeneous Material Level Description Precious metals Substance Silver CAS# 7440-22-4 Weight (g) 5.73 E-04 Percentage (%) PPM Percentage (%) 100.0 1000000 0.48 PPM 4809 External Leadframe Plating Component Level Homogeneous Material Level Description Tin & its alloys Substance Tin CAS# 7440-31-5 Weight (g) 3.34 E-03 Percentage (%) PPM Percentage (%) 100.0 1000000 2.81 PPM 28061 Bond Wires Component Level Homogeneous Material Level Substance Description Precious metals Precious metals Subtotal Gold Palladium CAS# Weight (g) 7440-57-5 7440-05-3 6.32 E-04 6.38 E-06 6.38 E-04 CAS# Weight (g) Percentage (%) PPM Percentage (%) 99.0 1.0 100.0 990000 10000 1000000 0.53 0.01 0.54 PPM 5298 54 5352 Chip Homogeneous Material Level Description Other inorganic materials Substance Gallium Arsenide 1303-00-0 4.03 E-03 Component Level Percentage (%) PPM Percentage (%) 100.0 1000000 3.38 PPM 33823 Die Attach Homogeneous Material Level Description Precious metals Thermoset Other organic materials Other organic materials Other organic materials Other organic materials Other organic materials Other inorganic materials Other organic materials Subtotal Package Totals Substance Silver Epichlorohydrin-formaldehyde-phenol copolymer Epoxy resin, epichlorohydrin-dimer fatty acid Butyrolactone, gammaPoly(oxypropylene)diamine 2,6-Diglycidyl phenyl allyl ether oligomer Organosilane Copper(II) oxide Epoxy resin modifier CAS# 7440-22-4 9003-36-5 68475-94-5 96-48-0 9046-10-0 Unassigned TS ref# 10001 1317-38-0 TS ref# 10038 Component Level Weight (g) 4.39 E-04 1.76 E-05 1.76 E-05 1.76 E-05 1.76 E-05 1.76 E-05 1.76 E-05 1.76 E-05 2.94 E-06 5.65 E-04 Weight (g) 1.19 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Percentage (%) PPM Percentage (%) 77.71 3.11 3.11 3.11 3.11 3.11 3.11 3.11 0.52 100.0 777100 31100 31100 31100 31100 31100 31100 31100 5200 1000000 0.37 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.002 0.47 Percentage (%) 100 PPM 3684 147 147 147 147 147 147 147 25 4741 PPM 1000000