Product / Package Information Package Body Size (mm) Lead Count Terminal Finish MS Number Environmental Information RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant LFCSP - Punched 6 X 6 X 0.8 (2.9 EP) 40 100 Sn MS000522D Yes Yes Yes Yes Materials Declaration Molding Compound Description Other inorganic materials Thermosets Other inorganic materials Subtotal Substance Silica Epoxy & Phenol Resin Carbon black CAS# Weight (g) 60676-86-0 Proprietary 1333-86-4 4.40E-02 6.47E-03 1.57E-04 5.06 E-02 Homogeneous Material Level Component Level Percentage (%) PPM Percentage (%) 86.9 12.8 0.3 100.00 869100 127800 3100 1000000 48.42 7.12 0.17 55.71 PPM 484218 71204 1727 557148 Leadframe Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Substance Copper Iron Zinc Phosphorus CAS# Weight (g) 7440-50-8 7439-89-6 7440-66-6 7723-14-0 3.28 E-02 7.91 E-04 4.04 E-05 1.01 E-05 3.37 E-02 Homogeneous Material Level Component Level Percentage (%) PPM Percentage (%) 97.5 2.35 0.12 0.03 100.00 975000 23500 1200 300 1000000 36.13 0.87 0.04 0.01 37.05 PPM 361251 8707 445 111 370514 Internal Leadframe Plating Description Precious metals Substance Silver CAS# Weight (g) 7440-22-4 3.37 E-05 Homogeneous Material Level Component Level Percentage (%) PPM Percentage (%) 100.0 1000000 0.04 PPM 371 External Leadframe Plating Substance Description Tin & its alloys Tin CAS# Weight (g) 7440-31-5 2.15 E-03 Component Level Homogeneous Material Level Percentage (%) PPM Percentage (%) 100.0 1000000 2.37 PPM 23653 Bond Wires Substance Description Precious metals Gold CAS# Weight (g) 7440-57-5 1.06 E-03 Homogeneous Material Level Component Level Percentage (%) PPM Percentage (%) 100.0 1000000 1.16 PPM 11636 Chip Substance Description Other inorganic materials Doped Silicon CAS# Weight (g) 7440-21-3 2.86 E-03 Homogeneous Material Level Component Level Percentage (%) PPM Percentage (%) 100.0 1000000 3.15 PPM 31491 Die Attach Description Precious metals Thermoset Other organic materials Other organic materials Other organic materials Other organic materials Other organic materials Other inorganic materials Other organic materials Subtotal Package Totals Substance Silver Epichlorohydrin-formaldehyde-phenol copolymer Epoxy resin, epichlorohydrin-dimer fatty acid Butyrolactone, gammaPoly(oxypropylene)diamine 2,6-Diglycidyl phenyl allyl ether oligomer Organosilane Copper(II) oxide Epoxy resin modifier CAS# Weight (g) 7440-22-4 9003-36-5 68475-94-5 96-48-0 9046-10-0 Unassigned TS ref# 10001 1317-38-0 TS ref# 10038 3.66 E-04 1.47 E-05 1.47 E-05 1.47 E-05 1.47 E-05 1.47 E-05 1.47 E-05 1.47 E-05 2.45 E-06 4.72 E-04 Weight (g) 9.09 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Homogeneous Material Level Component Level Percentage (%) PPM Percentage (%) 77.71 3.11 3.11 3.11 3.11 3.11 3.11 3.11 0.52 100.0 777100 31100 31100 31100 31100 31100 31100 31100 5200 1000000 0.40 0.02 0.02 0.02 0.02 0.02 0.02 0.02 0.00 0.52 Percentage (%) 100 PPM 4031 161 161 161 161 161 161 161 27 5187 PPM 1000000