PIC24FV32KA304 Family Silicon Errata and Data Sheet Clarification

PIC24FV32KA304 FAMILY
PIC24FV32KA304 Family
Silicon Errata and Data Sheet Clarification
The PIC24FV32KA304 family devices that you have
received conform functionally to the current Device
Data Sheet (DS39995D), except for the anomalies
described in this document.
The silicon issues discussed in the following pages are
for silicon revisions with the Device and Revision IDs
listed in Table 1. The silicon issues are summarized in
Table 2.
The errata described in this document will be addressed
in future revisions of the PIC24FV32KA304 family
silicon.
Note:
This document summarizes all silicon
errata issues from all revisions of silicon,
previous as well as current. Only the issues
indicated in the last column of Table 2
apply to the current silicon revision (A7).
Data sheet clarifications and corrections start on Page 6,
following the discussion of silicon issues.
The silicon revision level can be identified using the
current version of MPLAB® IDE and Microchip’s programmers, debuggers and emulation tools, which are
available at the Microchip corporate web site
(www.microchip.com).
TABLE 1:
For example, to identify the silicon revision level using
MPLAB IDE in conjunction with MPLAB ICD 2 or
PICkit™ 3:
1.
2.
3.
4.
Using the appropriate interface, connect the
device to the MPLAB ICD 2 programmer/
debugger or PICkit™ 3.
From the main menu in MPLAB IDE, select
Configure>Select Device, and then select the
target part number in the dialog box.
Select
the
MPLAB
hardware
tool
(Debugger>Select Tool).
Perform a “Connect” operation to the device
(Debugger>Connect). Depending on the development tool used, the part number and Device
Revision ID value appear in the Output window.
Note:
If you are unable to extract the silicon
revision level, please contact your local
Microchip sales office for assistance.
The DEVREV values for the various PIC24FV32KA304
family silicon revisions are shown in Table 1.
SILICON DEVREV VALUES
Part Number
Device
ID(1)
Revision ID for Silicon
Revision(2)
A4
A6
Part Number
Device
ID(1)
A7
A4
PIC24F32KA304
4516h
PIC24FV32KA304
4517h
PIC24F32KA302
4512h
PIC24FV32KA302
4513h
PIC24F32KA301
4518h
PIC24FV32KA301
4519h
PIC24F16KA304
4506h
PIC24FV16KA304
4507h
PIC24F16KA302
4502h
PIC24FV16KA302
4503h
PIC24F16KA301
4508h
PIC24FV16KA301
4509h
Note 1:
2:
0004h 0006h 00007h
Revision ID for
Silicon Revision(2)
A6
A7
0004h 0006h 0007h
The Device IDs (DEVID and DEVREV) are located at the last two implemented addresses of configuration
memory space. They are shown in hexadecimal in the format, “DEVID DEVREV”.
Refer to the “PIC24FXXKA1XX/FVXXKA3XX Family Flash Programming Specifications” (DS39919) for
detailed information on Device and Revision IDs for your specific device.
 2011-2015 Microchip Technology Inc.
DS80000522F-page 1
PIC24FV32KA304 FAMILY
TABLE 2:
Module
SILICON ISSUE SUMMARY
Feature
Item
Number
Affected
Revisions(1)
Issue Summary
A4
Core
Low-Voltage
Regulator
1.
High-voltage programming entry unavailable in Low-Voltage
Sleep modes.
X
Reset
BOR
2.
Unexpected BOR events when BOR is disabled in Sleep
mode.
X
A/D
Threshold
Detect
3.
Auto-scan feature may not trigger correctly in Sleep mode.
X
UART
TX Buffer
4.
Out-of-order transmit data when buffer is filled.
X
UART
Transmit
5.
UTXBF flag may not indicate correctly.
X
A/D
Threshold
Detect
6.
Current in Auto-Scan mode may exceed expected values.
X
A/D
Threshold
Detect
7.
Interrupt may not trigger in certain Auto-Scan modes.
X
HLVD
DC18 Value
Changes
8.
Change in trip points.
X
Note 1:
A6
A7
X
X
X
X
Only those issues indicated in the last column apply to the current silicon revision.
DS80000522F-page 2
 2011-2015 Microchip Technology Inc.
PIC24FV32KA304 FAMILY
Silicon Errata Issues
Note:
This document summarizes all silicon
errata issues from all revisions of silicon,
previous as well as current. Only the
issues indicated by the shaded column in
the following tables apply to the current
silicon revision (A7).
1. Module: Core (Low-Voltage Regulator)
When operating in Low-Voltage Sleep mode,
LVREN = 1 (RCON<12>) and LVRCFG = 0
(FPOR<2>), the device may not be able to enter
programming modes using high-voltage entry
(VIHH applied to MCLR).
If entry into a programming mode is required
while the device is in Low-Voltage Sleep mode,
use low-voltage entry into programming. Verify
that MCLR functionality is enabled, MCLRE = 1
(FPOR<7>), before attempting programming.
Affected Silicon Revisions
A6
A7
X
2. Module: Reset (BOR)
Under certain conditions, the device may
improperly perform a Brown-out Reset upon
wake-up from a Sleep mode. This has been
observed under two conditions:
1.
2.
Do not use Sleep mode when BOREN<1:0> = 10.
If the BOR is to operate under software control,
always enable the HLVD module, HLVDEN = 1
(HLVDCON<15>), before enabling the BOR
in software (SBOREN = 1). This procedure
activates the internal band gap reference and
assures its stability for the BOR circuit.
Affected Silicon Revisions
A4
A6
A7
X
X
X
3. Module: A/D (Threshold Detect)
Work around
A4
Work around
When the BOR is disabled in Sleep mode,
BOREN<1:0> = 10 (FPOR<1:0>), a BOR
may occur when the device wakes from
Sleep, regardless of the supply voltage.
When the BOR is configured for software
control (BOREN<1:0> = 01), the device
enters and wakes from Sleep normally
while the BOR is disabled in software,
SBOREN = 0 (RCON<13>). However, if the
BOR was disabled prior to entering Sleep
mode and is subsequently enabled after
waking from Sleep, a BOR may occur,
regardless of the supply voltage.
When the auto-scan feature of the Threshold
Detect is enabled (AD1CON5<15> = 1), automatic scan may fail when these conditions occur
together:
• the Device is in Sleep mode, and
• Timer1 is selected as the sample trigger clock
source (AD1CON1<7:4> = 0101).
Timer1 and other timers will function correctly as
sample triggers in other power-saving modes,
such as Idle mode.
Work around
If auto-scan functionality is required during
Sleep, use INT0 as the sample trigger.
Affected Silicon Revisions
A4
A6
A7
X
BOR functions normally when it is always
enabled or disabled (BOREN<1:0> = 11 or 00).
 2011-2015 Microchip Technology Inc.
DS80000522F-page 3
PIC24FV32KA304 FAMILY
4. Module: UART (TX Buffer)
If the transmit buffer is filled sequentially with
four characters, the characters may not be
transmitted in the correct order.
Work around
Do not completely fill the buffer before transmitting data; send three characters or less at a
time.
Affected Silicon Revisions
A4
A6
A7
X
6. Module: A/D (Threshold Detect)
In Auto-Scan mode, with low power enabled
(AD1CON5<15> = 1, AD1CON5<14> = 1) and
the device in Sleep mode, the ADRC may not
turn off between scans, resulting in a higher
current draw than anticipated.
Work around
None.
Affected Silicon Revisions
A4
A6
A7
X
5. Module: UART (Transmit)
7. Module: A/D (Threshold Detect)
The UARTx Transmit Buffer Full flag, UTXBF
(UxSTA<9>), may become cleared before data
starts moving out of the full buffer. If the flag is
used to determine when data can be written to
the buffer, new data may not be accepted and
data may not be transmitted.
In Auto-Scan mode (AD1CON5<15> = 1), when
the Auto-Scan Interrupt mode bits are set to ‘11’
(AD1CON5<9:8> = 11), the highest number
channel selected for scanning in AD1CSSL or
AD1CSSH may not trigger an interrupt on a valid
comparison.
Work around
Work around
Poll the Transmit Buffer Empty flag (TRMT,
UxSTA<8>) to determine when the transmit
buffer is empty and can be written to.
Add a dummy channel to the scanning sequence.
For example, when scanning AN0 and AN1, set
AD1CSSL to 0x0007 or 0x8003, or whatever is
practical given the implementation.
Alternatively, configure the UART to set the
UARTx Transmit Interrupt Flag (UxTXIF) whenever a character is shifted into the Transmit Shift
Register (UTXISEL<1:0> = 00). When a transmit interrupt occurs, this indicates that at least
one buffer position is open and that the buffer
can be written to.
Affected Silicon Revisions
A4
A6
Also, if the highest number channel needs to be
scanned, the AD1CHITH register can be polled
to observe a valid comparison.
Affected Silicon Revisions
A4
A6
A7
X
A7
X
DS80000522F-page 4
 2011-2015 Microchip Technology Inc.
PIC24FV32KA304 FAMILY
8. Module: HLVD (DC18 Value Changes)
The maximum and minimum values of the High/
Low-Voltage Detect Characteristics (DC18),
shown in Table 29-4 of the data sheet, have
changed for this revision. The new values are
shown in Table 3.
Affected Silicon Revisions
A4
A6
A7
X
X
X
TABLE 3:
HIGH/LOW-VOLTAGE DETECT CHARACTERISTICS
Standard Operating Conditions: 1.8V to 3.6V PIC24F32KA3XX
2.0V to 5.5V PIC24FV32KA3XX
Operating temperature
-40°C  TA  +85°C for Industrial
Param
Symbol
No.
DC18
VHLVD
Characteristic
HLVD Voltage on
VDD Transition
Min
Typ
Max
Units
—
—
2.01
V
HLVDL<3:0> = 0001
1.91
—
2.25
V
HLVDL<3:0> = 0010
2.12
—
2.48
V
HLVDL<3:0> = 0011
2.27
—
2.67
V
HLVDL<3:0> = 0100
2.36
—
2.76
V
HLVDL<3:0> = 0101
2.55
—
2.99
V
HLVDL<3:0> = 0110
2.79
—
3.27
V
HLVDL<3:0> = 0111
2.93
—
3.43
V
HLVDL<3:0> = 1000
3.06
—
3.60
V
HLVDL<3:0> = 0000(2)
HLVDL<3:0> = 1001
3.23
—
3.79
V
HLVDL<3:0> = 1010(1)
3.40
—
4.00
V
HLVDL<3:0> = 1011(1)
3.61
—
4.23
V
HLVDL<3:0> = 1100(1)
3.83
—
4.49
V
1101(1)
4.08
—
4.80
V
HLVDL<3:0> = 1110(1)
4.38
—
5.14
V
HLVDL<3:0> =
Note 1:
2:
Conditions
These trip points should not be used on PIC24FXXKA30X devices.
This trip point should not be used on PIC24FVXXKA30X devices.
 2011-2015 Microchip Technology Inc.
DS80000522F-page 5
PIC24FV32KA304 FAMILY
Data Sheet Clarifications
The following typographic corrections and clarifications
are to be noted for the latest version of the device data
sheet (DS39995D):
1. Module: Electrical Characteristics
The extended temperature data, shown in bold, has
been added to Table 29-21.
TABLE 29-21: AC CHARACTERISTICS: INTERNAL RC ACCURACY
AC CHARACTERISTICS
Param
No.
Characteristic
Standard Operating Conditions: 1.8V to 3.6V PIC24F32KA3XX
2.0V to 5.5V PIC24FV32KA3XX
Operating temperature
-40°C  TA  +85°C for Industrial
-40°C TA  +125°C for Extended
Min
Typ
Max
Units
Conditions
Internal FRC Accuracy @ 8 MHz(1)
F20
FRC
-2
—
+2
%
+25ºC
3.0V  VDD  3.6V, F device
3.2V  VDD  5.5V, FV device
-5
—
+5
%
-40°C  TA +85°C
1.8V  VDD  3.6V, F device
2.0V  VDD  5.5V, FV device
-6
—
+6
%
-40°C TA +125°C
1.8V  VDD  3.6V, F device
2.0V  VDD  5.5V, FV device
-15
—
15
%
LPRC @ 31 kHz(2)
F21
Note 1:
2:
Frequency is calibrated at +25°C and 3.3V. The OSCTUN bits can be used to compensate for temperature
drift.
The change of LPRC frequency as VDD changes.
DS80000522F-page 6
 2011-2015 Microchip Technology Inc.
PIC24FV32KA304 FAMILY
APPENDIX A:
DOCUMENT
REVISION HISTORY
Rev A Document (3/2011)
Initial release of this document; issued for revision A4.
Includes silicon issues 1 (Core, Low-Voltage Regulator)
and 2 (Reset, BOR).
Rev B Document (5/2011)
Adds silicon issue 3 (A/D, Threshold Detect) to silicon
revision A4.
Adds data sheet clarifications 1 (Overview and Other
Locations), 2 (Overview) and 3 (A/D, Threshold Detect)
for data sheet revision B.
Rev C Document (9/2011)
Adds silicon issues 4 (UART, TX Buffer), 5 (UART,
Transmit), 6 (A/D, Threshold Detect), 7 (A/D, Threshold
Detect) and 8 (HLVD, DC18 Value Changes) to silicon
revision A4. Typographical correction in issue 1 (Core,
Low-Voltage Regulator).
Adds data sheet clarifications 4 through 7 (A/D
Converter), 8 and 9 (Comparator), 10 (Flash Program
Memory), 11 (Electrical Specifications), 12 (A/D
Converter) and 13 (Pin Diagrams) to data sheet
revision B.
Rev D Document (8/2012)
Adds latest silicon revision (A6) and shows that both
silicon issues 2 (Reset, BOR) and 8 (HLVD, DC18
Value Changes) are affected. Removes all data sheet
clarifications that were addressed in the latest release
of the data sheet.
Rev E Document (11/2013)
Adds data sheet clarification 1 (Electrical Characteristics.
Rev F Document (7/2015)
Adds current silicon revision A7.
 2011-2015 Microchip Technology Inc.
DS80000522F-page 7
PIC24FV32KA304 FAMILY
NOTES:
DS80000522F-page 8
 2011-2015 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
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OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
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Trademarks
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ISBN: 978-1-63277-628-0
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DS80000522F-page 9
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DS80000522F-page 10
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