Full Material Declaration for attached parts list Full Material Declaration for attached parts list Report generated: 15 June 2016, 10:35 GMT Diotec Semiconductor AG DUNS number: 330866844 -, Kreuzmattenstr. 4, Heitersheim, B.-W., 79423, Germany Declarations authorised by: Udo Steinebrunner, Product Manager, - Declaration effective from: 1 January 2011 [Approved on 15 June 2016, 10:24 GMT] Materials and substances Use/Location Material group Chip (die) Other inorganic materials Die attach Encapsulation Sn-Pb solder % w/w of material in the part 0.06000% 0.03000% EP (Epoxy resin) 41.58000% Substances in the material CAS Number % w/w of substance in the material Silicon dioxide 14808-60-7 1.44000% Gold 7440-57-5 18.00000% Silicon 7440-21-3 80.56000% Silver 7440-22-4 2.50000% Tin 7440-31-5 5.00000% Lead 7439-92-1 92.50000% Carbon black 1333-86-4 0.30000% ANTIMONY TRIOXIDE 1309-64-4 0.80000% Tetrabromobisphenol A 79-94-7 0.99000% Epoxy resin 89 26335-32-0 27.61000% Crystalline silica 14808-60-7 70.30000% Leadfinish Tin plating 0.48000% Tin 7440-31-5 100.00000% Leadframe Copper (e.g. copper amounts in cable harnesses) 57.85000% Copper 7440-50-8 100.00000% Attached parts list Part number Part name Part Mass Part Mass UoM ITO-220AB/AC Diode/Transistor Power 1.8 g Page 1 Report generated: 15 June 2016, 10:35 GMT