MPX12, 10 kPa Uncompensated Silicon Pressure Sensors

Pressure
Freescale Semiconductor
MPX12
Rev 11, 07/2009
10 kPa Uncompensated
Silicon Pressure Sensors
MPX12
Series
The MPX12 series silicon piezoresistive pressure sensors provide a very
accurate and linear voltage output, directly proportional to the applied
pressure. This standard, low cost, uncompensated sensor permits
manufacturers to design and add their own external temperature
compensating and signal conditioning networks. Compensation techniques
are simplified because of the predictability of Freescale's single element
strain gauge design.
0 to 10 kPa (0 to 1.45 psi)
55 mV Full Scale Span
(Typical)
Application Examples
•
•
•
•
•
•
•
•
Features
•
•
•
•
•
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Low Cost
Patented Silicon Shear Stress Strain Gauge Design
Ratiometric to Supply Voltage
Easy to Use Chip Carrier Package Options
Gauge Options
Durable Epoxy Package
Air Movement Control
Environmental Control Systems
Level Indicators
Leak Detection
Medical Instrumentation
Industrial Controls
Pneumatic Control Systems
Robotics
ORDERING INFORMATION
Device Name
Package
Options
# of Ports
Case
No.
None
•
Single
Pressure Type
Dual
Gauge
Differential
Absolute
Device
Marking
Unibody Package (MPX12 Series)
MPX12D
Tray
344
MPX12DP
Tray
344C
MPX12GP
Tray
344B
•
•
•
MPX12D
•
MPX12DP
MPX12GP
•
Small Outline Package (MPXV12 Series)
MPXV12DP
MPXV12DP
Tray
1351
MPXV12GP
Tray
1369
•
•
MPXV12GP
MPXV12GW6U
Rail
1735
•
•
MPXV12GW
MPXV12GW7U
Rail
1560
•
•
MPXV12GW
Rail
1320A
•
•
MPXM12GS
Tape & Reel
1320A
•
•
MPXM12GS
•
•
MPAK Package (MPXM12 Series)
MPXM12GS
MPXM12GST1
© Freescale Semiconductor, Inc., 2007-2009. All rights reserved.
Pressure
UNIBODY PACKAGES
MPX12D
CASE 344-15
MPX12GP
CASE 344B-01
MPX12DP
CASE 344C-01
SMALL OUTLINE PACKAGES
MPXV12DP
CASE 1351-01
MPXV12GP
CASE 1369-01
MPXV12GW6U
CASE 1735-02
MPXV12GW7U
CASE 1560-02
MPAK PACKAGE
MPXM12GS/GST1
CASE 1320A-02
MPX12
2
Sensors
Freescale Semiconductor
Pressure
Operating Characteristics
Table 1. Operating Characteristics (VS = 3.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2)
Characteristic
Symbol
Min
Typ
Max
Unit
POP
0
—
10
kPa
Supply Voltage
VS
—
3.0
6.0
Vdc
Supply Current
Io
—
6.0
—
mAdc
VFSS
45
55
70
mV
Voff
0
20
35
mV
ΔV/ΔP
—
5.5
—
mV/kPa
—
–0.5
—
5.0
%VFSS
—
—
±0.1
—
%VFSS
Temperature Hysteresis (–40°C to +125°C)
—
—
±0.5
—
%VFSS
Temperature Coefficient of Full Scale Span
TCVFSS
–0.22
—
–0.16
%VFSS/°C
TCVoff
—
±15
—
μV/°C
TCR
0.21
—
0.27
%Zin/°C
Input Impedance
Zin
400
—
550
Ω
Output Impedance
Zout
750
—
1250
Ω
tR
—
1.0
—
ms
—
—
20
—
ms
—
—
±0.5
—
%VFSS
Differential Pressure
Range(1)
(2)
Full Scale
Span(3)
(4)
Offset
Sensitivity
Linearity
Pressure Hysteresis
(6)
(0 to 10 kPa)
Temperature Coefficient of Offset
Temperature Coefficient of Resistance
(5)
Response Time
Warm-Up
(10% to 90%)
Time(6)
Offset Stability
(7)
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional
error due to device self-heating.
3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum related pressure.
4. Offset (VOFF) is defined as the output voltage at the minimum rated pressure.
5. Response Time is defined as the time form the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
6. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure is stabilized.
7. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
MPX12
Sensors
Freescale Semiconductor
3
Pressure
Maximum Ratings
Table 2. Maximum Ratings(1)
Rating
Maximum Pressure (P1 > P2)
Burst Pressure (P1 > P2)
Storage Temperature
Operating Temperature
Symbol
Value
Unit
PMAX
75
kPa
PBURST
100
kPa
TSTG
–40 to +125
°C
TA
–40 to +125
°C
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
3
+VS
2
Sensing
Element
4
+VOUT
–VOUT
1
GND
Figure 1. Uncompensated Pressure Sensor Schematic
Voltage Output versus Applied Differential Pressure
The output voltage of the differential or gauge sensor
increases with increasing pressure applied to the pressure
side (P1) relative to the vacuum side (P2). Similarly, output
voltage increases as increasing vacuum is applied to the
vacuum side (P2) relative to the pressure side (P1).
MPX12
4
Sensors
Freescale Semiconductor
Pressure
Temperature Compensation
Figure 2 shows the typical output characteristics of the
MPX12 series over temperature.
Because this strain gauge is an integral part of the silicon
diaphragm, there are no temperature effects due to
differences in the thermal expansion of the strain gauge and
the diaphragm, as are often encountered in bonded strain
gauge pressure sensors. However, the properties of the
strain gauge itself are temperature dependent, requiring that
the device be temperature compensated if it is to be used
over an extensive temperature range.
Temperature compensation and offset calibration can be
achieved rather simply with additional resistive components, or
by designing your system using the MPX2010D series sensor.
Several approaches to external temperature
compensation over both –40 to +125°C and 0 to +80°C
ranges are presented in Applications Note AN840.
LINEARITY
Linearity refers to how well a transducer's output follows
the equation: VOUT = VOFF + sensitivity x P over the operating
pressure range (Figure 3). There are two basic methods for
calculating nonlinearity: (1) end point straight line fit or (2) a
least squares best line fit. While a least squares fit gives the
“best case” linearity error (lower numerical value), the
calculations required are burdensome.
Conversely, an end point fit will give the “worst case” error
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user.
Freescale’s specified pressure sensor linearities are based
on the end point straight line method measured at the
midrange pressure.
80
70
+25°C
VS = 3 VDC
P1 > P2
-40°C
Output (mVdc)
60
Span
Range
(Typ)
50
40
+125°C
30
20
Offset
(Typ)
10
0
PSI 0
0.3
kPa
2.0
0.6
0.9
4.0
6.0
1.2
1.5
8.0
10
Pressure Differential
Figure 2. Output vs. Pressure Differential
80
Linearity
70
60
Actual
Output (mVdc)
50
Span
(VFSS)
40
Theoretical
30
20
Offset
(VOFF)
10
0
0
Pressure (kPa)
Max
POP
Figure 3. Linearity Specification Comparison
MPX12
Sensors
Freescale Semiconductor
5
Pressure
Stainless
Steel Cap
Die
Gel Die Coat
P1
Thermoplastic
Case
Wire Bond
Lead Frame
P2
Die Bond
Differential Sensing
Element
Figure 4. Cross-Sectional Diagram (not to scale)
Figure 4 illustrates the differential/gauge die. A gel isolates
the die surface and wire bonds from the environment, while
allowing the pressure signal to be transmitted to the silicon
diaphragm.
Operating characteristics, internal reliability and
qualification tests are based on use of dry clean air as the
pressure media. Media other than dry clean air may have
adverse effects on sensor performance and long term
reliability. Contact the factory for information regarding media
compatibility in your application.
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing gel which isolates
the die from the environment. Freescale’s MPx12 series is
designed to operate with positive differential pressure
applied, P1 > P2.
The Pressure (P1) side may be identified by using the
following table
Part Number
MPX12D
Case Type
Pressure (P1) Side
Identifier
344
Stainless Steel Cap
MPX12DP
344C
Side with Part Marking
MPX12GP
344B
Side with Port Attached
MPXV12DP
1351
Side with Part Marking
MPXV12GP
1369
Side with Port
MPXV12GW6U
1735
Side with Port
MPXV12GW7U
1560
Side with Port
1320A
Side with Port Attached
MPXM12GS/GST1
MPX12
6
Sensors
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
C
R
M
1
B
2
–A–
Z
4
3
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION –A– IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
DIM
A
B
C
D
F
G
J
L
M
N
R
Y
Z
N
1
PIN 1
2
3
L
4
–T–
SEATING
PLANE
J
F
G
F
D
Y
4 PL
0.136 (0.005)
STYLE 1:
PIN 1.
2.
3.
4.
M
T A
DAMBAR TRIM ZONE:
THIS IS INCLUDED
WITHIN DIM. “F” 8 PL
M
STYLE 2:
PIN 1.
2.
3.
4.
GROUND
+ OUTPUT
+ SUPPLY
– OUTPUT
STYLE 3:
PIN 1.
2.
3.
4.
VCC
– SUPPLY
+ SUPPLY
GROUND
INCHES
MIN
MAX
0.595
0.630
0.514
0.534
0.200
0.220
0.016
0.020
0.048
0.064
0.100 BSC
0.014
0.016
0.695
0.725
30 _ NOM
0.475
0.495
0.430
0.450
0.048
0.052
0.106
0.118
MILLIMETERS
MIN
MAX
15.11
16.00
13.06
13.56
5.08
5.59
0.41
0.51
1.22
1.63
2.54 BSC
0.36
0.40
17.65
18.42
30 _ NOM
12.07
12.57
10.92
11.43
1.22
1.32
2.68
3.00
GND
–VOUT
VS
+VOUT
CASE 344-15
ISSUE AA
UNIBODY PACKAGE
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5, 1982.
2. CONTROLLING DIMENSION: INCH.
–A–
–T–
U
L
R
H
N
PORT #1
POSITIVE
PRESSURE
(P1)
–Q–
B
1 2
PIN 1
3 4
K
–P–
0.25 (0.010)
J
M
T Q
S
S
F
C
G
D 4 PL
0.13 (0.005)
M
T S
S
Q
S
DIM
A
B
C
D
F
G
H
J
K
L
N
P
Q
R
S
U
INCHES
MIN
MAX
1.145 1.175
0.685 0.715
0.305 0.325
0.016 0.020
0.048 0.064
0.100 BSC
0.182 0.194
0.014 0.016
0.695 0.725
0.290 0.300
0.420 0.440
0.153 0.159
0.153 0.159
0.230 0.250
0.220 0.240
0.910 BSC
STYLE 1:
PIN 1.
2.
3.
4.
MILLIMETERS
MIN
MAX
29.08
29.85
17.40
18.16
7.75
8.26
0.41
0.51
1.22
1.63
2.54 BSC
4.62
4.93
0.36
0.41
17.65
18.42
7.37
7.62
10.67
11.18
3.89
4.04
3.89
4.04
5.84
6.35
5.59
6.10
23.11 BSC
GROUND
+ OUTPUT
+ SUPPLY
- OUTPUT
CASE 344B-01
ISSUE B
UNIBODY PACKAGE
MPX12
Sensors
Freescale Semiconductor
7
Pressure
PACKAGE DIMENSIONS
PORT #1
R
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
–A–
U
V
W
L
H
PORT #2
N
PORT #1
POSITIVE PRESSURE
(P1)
PORT #2
VACUUM
(P2)
–Q–
B
SEATING
PLANE
SEATING
PLANE
1 2 3 4
PIN 1
K
–P–
–T–
–T–
0.25 (0.010)
M
T Q
S
S
F
J
G
D 4 PL
C
0.13 (0.005)
M
T S
S
Q
S
DIM
A
B
C
D
F
G
H
J
K
L
N
P
Q
R
S
U
V
W
INCHES
MIN
MAX
1.145
1.175
0.685
0.715
0.405
0.435
0.016
0.020
0.048
0.064
0.100 BSC
0.182
0.194
0.014
0.016
0.695
0.725
0.290
0.300
0.420
0.440
0.153
0.159
0.153
0.159
0.063
0.083
0.220
0.240
0.910 BSC
0.248
0.278
0.310
0.330
STYLE 1:
PIN 1.
2.
3.
4.
MILLIMETERS
MIN
MAX
29.08
29.85
17.40
18.16
10.29
11.05
0.41
0.51
1.22
1.63
2.54 BSC
4.62
4.93
0.36
0.41
17.65
18.42
7.37
7.62
10.67
11.18
3.89
4.04
3.89
4.04
1.60
2.11
5.59
6.10
23.11 BSC
6.30
7.06
7.87
8.38
GROUND
+ OUTPUT
+ SUPPLY
– OUTPUT
CASE 344C-01
ISSUE B
UNIBODY PACKAGE
MPX12
8
Sensors
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
CASE 1351-01
ISSUE A
SMALL OUTLINE PACKAGE
MPX12
Sensors
Freescale Semiconductor
9
Pressure
PACKAGE DIMENSIONS
CASE 1351-01
ISSUE A
SMALL OUTLINE PACKAGE
MPX12
10
Sensors
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
2 PLACES 4 TIPS
0.008 (0.20) C A B
E
A
GAGE
PLANE
e
5
4
e/2
.014 (0.35)
θ
L
D
A1
DETAIL G
8
1
b
0.004 (0.1)
NOTES:
1. CONTROLLING DIMENSION: INCH.
2. INTERPRET DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994.
3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152)
PER SIDE.
4. DIMENSION "b" DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM.
8X
F
M
E1
B
N
∅T
K
A
P
C A B
8X
M
0.004 (0.1)
DETAIL G
C
SEATING
PLANE
DIM
A
A1
b
D
E
E1
e
F
K
L
M
N
P
T
θ
INCHES
MILLIMETERS
MIN
MAX
MIN
MAX
0.300
0.330
7.11
7.62
0.002
0.010
0.05
0.25
0.038
0.042
0.96
1.07
0.465
0.485
11.81
12.32
0.717 BSC
18.21 BSC
0.465
0.485
11.81
12.32
0.100 BSC
2.54 BSC
0.245
0.255
6.22
6.47
0.120
0.130
3.05
3.30
0.061
0.071
1.55
1.80
0.270
0.290
6.86
7.36
0.080
0.090
2.03
2.28
0.009
0.011
0.23
0.28
0.115
0.125
2.92
3.17
0˚
7˚
0˚
7˚
CASE 1369-01
ISSUE O
SMALL OUTLINE PACKAGE
MPX12
Sensors
Freescale Semiconductor
11
Pressure
PACKAGE DIMENSIONS
CASE 1735-02
ISSUE B
SMALL OUTLINE PACKAGE
MPX12
12
Sensors
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
CASE 1735-02
ISSUE B
SMALL OUTLINE PACKAGE
MPX12
Sensors
Freescale Semiconductor
13
Pressure
PACKAGE DIMENSIONS
CASE 1735-02
ISSUE B
SMALL OUTLINE PACKAGE
MPX12
14
Sensors
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
CASE 1560-03
ISSUE D
SMALL OUTLINE PACKAGE
MPX12
Sensors
Freescale Semiconductor
15
Pressure
PACKAGE DIMENSIONS
CASE 1560-03
ISSUE D
SMALL OUTLINE PACKAGE
MPX12
16
Sensors
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
CASE 1560-03
ISSUE D
SMALL OUTLINE PACKAGE
MPX12
Sensors
Freescale Semiconductor
17
Pressure
PACKAGE DIMENSIONS
CASE 1320A-02
ISSUE A
MPAK PACKAGE
MPX12
18
Sensors
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
CASE 1320A-02
ISSUE A
MPAK PACKAGE
MPX12
Sensors
Freescale Semiconductor
19
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MPX12
Rev. 11
07/2009
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