Freescale Semiconductor Data Sheet: Technical Data Document Number: MPxx5004 Rev. 12.1, 05/2015 MPxx5004, 0 to 3.92 kPa, Differential and Gauge, Integrated Pressure Sensor Freescale’s MPxx5004 series piezoresistive transducer is a state-of-the-art monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This sensor combines a highly sensitive implanted strain gauge with advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure. MPXV5004 MPVZ5004 Top view DNC 5 4 VOUT DNC 6 3 GND DNC 7 2 VS DNC 8 1 DNC Features • • 1.5% maximum error for 0 to 100 mm H2O over +10 °C to +60 °C with autozero Pin 1 identification, notch on first pin or chamfered corner. 2.5% maximum error for 100 to 400 mm H2O over +10 °C to +60 °C with autozero • 6.25% maximum error for 0 to 400 mm H2O over 10 °C to +60 °C without autozero • Temperature compensated over 10 °C to 60 °C • Available in gauge surface mount (SMT) or through-hole (DIP) configurations • Durable thermoplastic (PPS) package Pinout Applications • Washing machine water level • Ideally suited for microprocessor or microcontroller-based systems • Appliance liquid level and pressure measurement • Respiratory equipment Small outline packages, through-hole MPVZ5004G7U Case 98ASB17758C MPXV5004GC7U Case 98ASB17759C Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. © 2006-2009, 2015 Freescale Semiconductor, Inc. All rights reserved. MPVZ5004GW7U Case 98ASA10611D Small outline packages, surface mount MPVZ5004G6U/6T1 Case 98ASB17756C MPXV5004GC6T1/6U, MPVZ5004GC6U Case 98ASB17757C MPXV5004DP Case 98ASA99255D MPVZ5004GW6U Case 98ASA10686D MPXV5004GP/GPT1 Case 98ASA99303D MPXV5004GVP Case 98ASA99302D Ordering Information # of Ports Part number Shipping Pressure type Package None Single Dual Gauge Differential Absolute Device marking Small outline package (MPXV5004 series) MPXV5004DP Tray 98ASA99255D • • MPXV5004GC6T1 Reel 98ASB17757C • • MPXV5004G MPXV5004GC6U Rail 98ASB17757C • • MPXV5004G MPXV5004GC7U Rail 98ASB17759C • • MPXV5004G MPXV5004GP Tray 98ASA99303D • • MPXV5004GP MPXV5004GPT1 Reel 98ASA99303D • • MPXV5004GP MPXV5004GVP Tray 98ASA99302D • • MPXV5004GVP MPXV5004DP Small outline package (Media resistant gel) (MPVZ5004 series) MPVZ5004G6T1 Reel 98ASB17756C • • MPVZ5004G MPVZ5004G6U Rail 98ASB17756C • • MPVZ5004G MPVZ5004G7U Rail 98ASB17758C • • MPVZ5004G MPVZ5004GC6U Rail 98ASB17757C • • MPVZ5004G MPVZ5004GW6U Rail 98ASA10686D • • MZ5004GW MPVZ5004GW7U Rail 98ASA10611D • • MZ5004GW MPxx5004 2 Sensors Freescale Semiconductor, Inc. Contents 1 2 3 4 5 General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 1.1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 1.2 Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Mechanical and Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.1 Maximum ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.2 Operating characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 On-chip Temperature Compensation and Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Package Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4.1 Pressure (P1)/Vacuum (P2) side identification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4.2 Minimum recommended footprint for surface mounted applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4.3 Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Related Documentation The MPXV5004G device features and operations are described in a variety of reference manuals, user guides, and application notes. To find the most-current versions of these documents: 1. Go to the Freescale homepage at: http://www.freescale.com/ 2. 3. In the Keyword search box at the top of the page, enter the device number MPXV5004G. In the Refine Your Result pane on the left, click on the Documentation link. MPxx5004 Sensors Freescale Semiconductor, Inc. 3 1 General Description 1.1 Block diagram Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. VS Thin Film Temperature Compensation and Calibration Circuitry Sensing Element GND Gain Stage #2 and Ground Reference Shift Circuitry VOUT Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Figure 1. Integrated pressure sensor schematic 1.2 Pinout DNC 5 4 VOUT DNC 6 3 GND DNC 7 2 VS DNC 8 1 DNC Pin 1 identification, notch on first pin or chamfered corner. Figure 2. Device pinout (top view) Table 1. Pin functions Pin Name Function 1 DNC Do not connect to external circuitry or ground. Pin 1 is notated by the notch in the lead or chamfered corner. Voltage supply 2 VS 3 GND Ground 4 VOUT Output voltage 5 DNC Do not connect to external circuitry or ground. 6 DNC Do not connect to external circuitry or ground. 7 DNC Do not connect to external circuitry or ground. 8 DNC Do not connect to external circuitry or ground. MPxx5004 4 Sensors Freescale Semiconductor, Inc. 2 Mechanical and Electrical Specifications 2.1 Maximum ratings Table 2. Maximum ratings(1) Rating Symbol Value Unit Maximum pressure (P1 > P2) PMAX 16 kPa Storage temperature TSTG –30 to +100 °C TA 0 to +85 °C Operating temperature 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. 2.2 Operating characteristics Table 3. Operating characteristics (VS = 5.0 VDC, TA = 25 °C unless otherwise noted, P1 > P2) Characteristic Symbol Min Typ Max Units POP 0 — 3.92 400 kPa mm H2O VS 4.75 5.0 5.25 VDC IS — — 10 mAdc Span @ 306 mm H2O (3 Full-scale span @ 400 mm H2O (3.92 kPa)(2) VFSS — — 3.0 3.92 — — V Offset(3) VOFF 0.75 1.0 1.25 V V/P — 1.0 — V/kPa 0 to 100 mm H2O (10 °C to 60 °C) — — — ±1.5 100 to 400 mm H2O (10 °C to 60 °C) — — — ±2.5 0 to 400 mm H2O (10 °C to 60 °C) — — — ±6.25 Pressure range Supply voltage(1) Supply current kPa)(2) Sensitivity Accuracy (4) (5) %VFSS with autozero %VFSS with autozero %VFSS without autozero 1. Device is ratiometric within this specified excitation range. 2. Span is defined as the algebraic difference between the output voltage at specified pressure and the output voltage at the minimum rated pressure. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Accuracy (error budget) consists of the following: Linearity: Output deviation from a straight line relationship with pressure, using endpoint method, over the specified pressure range. Temperature hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Pressure hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25 °C. TcSpan: Output deviation over the temperature range of 10 °C to 60 °C, relative to 25 °C. TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 10 °C to 60 °C, relative to 25 °C. Variation from nominal: The variation from nominal values, for offset or full-scale span, as a percent of VFSS, at 25 °C. 5. Autozero at factory installation: Due to the sensitivity of the MPxx5004G, external mechanical stresses and mounting position can affect the zero pressure output reading. Autozeroing is defined as storing the zero pressure output reading and subtracting this from the device's output during normal operations. Reference AN1636 for specific information. The specified accuracy assumes a maximum temperature change of ±5 °C between autozero and measurement. MPxx5004 Sensors Freescale Semiconductor, Inc. 5 3 On-chip Temperature Compensation and Calibration The performance over temperature is achieved by integrating the shear-stress strain gauge, temperature compensation, calibration and signal conditioning circuitry onto a single monolithic chip. Figure 3 illustrates the gauge configuration in the basic chip carrier (case 98ASB17756C). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPxx5004 series sensor operating characteristics are based on use of dry air as pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term reliability. Internal reliability and qualification test for dry air, and other media, are available from the factory. Contact the factory for information regarding media tolerance in your application. Figure 4 shows the recommended decoupling circuit for interfacing the output of the MPxx5004 to the A/D input of the microprocessor or microcontroller. Proper decoupling of the power supply is recommended. Typical, minimum and maximum output curves are shown for operation over a temperature range of 10 °C to 60 °C using the decoupling circuit shown in Figure 4. The output will saturate outside of the specified pressure range. Fluorosilicone Gel Die Coat Die Stainless Steel Cap P1 Thermoplastic Case Wire Bond Lead Frame P2 Die Bond Differential Sensing Element Figure 3. Cross-sectional diagram (not to scale) +5 V VOUT OUTPUT VS IPS 1.0 μF 0.01 μF GND 470 pF Figure 4. Recommended power supply decoupling and output filtering (For additional output filtering, please refer to AN1646.) MPxx5004 6 Sensors Freescale Semiconductor, Inc. 5.0 TRANSFER FUNCTION: Vout = VS*[(0.2*P) + 0.2] ± 6.25% VFSS VS = 5.0 Vdc TEMP = 10 °C to 60°C 4.0 Output (V) 3.0 MAX TYPICAL 2.0 MIN 1.0 0 0 1.0 2.0 3.0 4.0 Differential Pressure (kPa) Figure 5. Output vs. pressure differential at ±6.25% VFSS (without autozero, Table 3, note 5) 5.0 TRANSFER FUNCTION: Vout = VS*[(0.2*P) + 0.2] ± 2.5% VFSS VS = 5.0 Vdc TEMP = 10 to 60°C 4.0 Output (V) 3.0 MAX TYPICAL 2.0 MIN 1.0 0 0 1.0 2.0 3.0 4.0 Differential Pressure (kPa) Figure 6. Output vs. pressure differential at ±2.5% VFSS (with autozero, Table 3, note 5) MPxx5004 Sensors Freescale Semiconductor, Inc. 7 4 Package Information 4.1 Pressure (P1)/Vacuum (P2) side identification Freescale Semiconductor designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The pressure (P1) side is the side containing silicone gel which isolates the die from the environment. The Freescale Semiconductor pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The pressure (P1) side may be identified by using the table below. Table 4. Pressure (P1)/Vacuum (P2) side identification table Part number 4.2 Case number Pressure (P1) side identifier MPXV5004DP 98ASA99255D Side with part marking MPXV5004GC6U/6T1, MPVZ5004GC6U 98ASB17757C Side with port attached MPXV5004GC7U 98ASB17759C Side with port attached MPXV5004GP/GPT1 98ASA99303D Side with port attached MPXV5004GVP 98ASA99302D Stainless steel cap MPVZ5004G6U/6T1 98ASB17756C Stainless steel cap MPVZ5004G7U 98ASB17758C Stainless steel cap MPVZ5004GW6U 98ASA10686D Vertical port attached MPVZ5004GW7U 98ASA10611D Vertical port attached Minimum recommended footprint for surface mounted applications Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads. 0.100 TYP 6X 2.54 0.660 16.76 0.060 TYP 8X 1.52 0.300 7.62 0.100 TYP 8X 2.54 inch mm SCALE 2:1 Figure 7. SOP footprint (case 98ASB17756C) MPxx5004 8 Sensors Freescale Semiconductor, Inc. 4.3 Package Dimensions This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ASB17756C.pdf. Case 98ASB17756C, small outline package, surface mount MPxx5004 Sensors Freescale Semiconductor, Inc. 9 This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ASB17757C.pdf. –A– D 8 PL 4 0.25 (0.010) 5 M T B S A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. S N –B– G 8 1 S DIM A B C D G H J K M N S V W W V C H J INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0 7 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0 7 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17 –T– PIN 1 IDENTIFIER M K SEATING PLANE Case 98ASB17757C, small outline package, through-hole This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ASB17758C.pdf. –A– NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. 6. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL. 4 5 –B– G 8 1 0.25 (0.010) M T B D 8 PL S A S DETAIL X S PIN 1 IDENTIFIER N C –T– SEATING PLANE DIM A B C D G J K M N S INCHES MIN MAX 0.415 0.425 0.415 0.425 0.210 0.220 0.026 0.034 0.100 BSC 0.009 0.011 0.100 0.120 0 15 0.405 0.415 0.540 0.560 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 5.33 5.59 0.66 0.864 2.54 BSC 0.23 0.28 2.54 3.05 0 15 10.29 10.54 13.72 14.22 K M J DETAIL X Case 98ASB17758C, small outline package, through-hole MPxx5004 10 Sensors Freescale Semiconductor, Inc. This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ASB17759C.pdf. FREESCALE D Case 98ASB17759C, small outline package, through-hole MPxx5004 Sensors Freescale Semiconductor, Inc. 11 This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ASA99255D.pdf. PAGE 1 OF 2 Case 98ASA99255D, small outline package, surface mount MPxx5004 12 Sensors Freescale Semiconductor, Inc. PAGE 2 OF 2 Case 98ASA99255D, small outline package, surface mount MPxx5004 Sensors Freescale Semiconductor, Inc. 13 This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ASA99302D.pdf. PAGE 1 OF 3 Case 98ASA99302D, small outline package, surface mount MPxx5004 14 Sensors Freescale Semiconductor, Inc. PAGE 2 OF 3 PAGE 2 OF 3 Case 98ASA99302D, small outline package, surface mount MPxx5004 Sensors Freescale Semiconductor, Inc. 15 PAGE 3 OF 3 PAGE 3 OF 3 Case 98ASA99302D, small outline package, surface mount MPxx5004 16 Sensors Freescale Semiconductor, Inc. This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ASA99303D.pdf. PAGE 1 OF 2 PAGE 1 OF 2 Case 98ASA99303D, small outline package MPxx5004 Sensors Freescale Semiconductor, Inc. 17 PAGE 2 OF 2 PAGE 2 OF 2 Case 98ASA99303D, small outline package MPxx5004 18 Sensors Freescale Semiconductor, Inc. This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ASA10611D.pdf. PAGE 1 OF 3 Case 98ASA10611D, small outline package MPxx5004 Sensors Freescale Semiconductor, Inc. 19 PAGE 2 OF 3 Case 98ASA10611D, small outline package MPxx5004 20 Sensors Freescale Semiconductor, Inc. PAGE 3 OF 3 Case 98ASA10611D, small outline package MPxx5004 Sensors Freescale Semiconductor, Inc. 21 This drawing is available at http://cache.freescale.com/files/shared/doc/package_info/98ASA10686D.pdf PAGE 1 OF 3 Case 98ASA10686D, small outline package MPxx5004 22 Sensors Freescale Semiconductor, Inc. PAGE 2 OF 3 Case 98ASA10686D, small outline package MPxx5004 Sensors Freescale Semiconductor, Inc. 23 PAGE 3 OF 3 Case 98ASA10686D, small outline package MPxx5004 24 Sensors Freescale Semiconductor, Inc. 5 Revision History Table 5. Revision history Revision number Revision date 12.1 05/2015 Description • Updated format. • Table 3: Updated Full-scale span Typ value, was 4.0 to 3.92. Updated Linearity defintion in note 4. • Updated package drawings with current versions. MPxx5004 Sensors Freescale Semiconductor, Inc. 25 How to Reach Us: Information in this document is provided solely to enable system and software Home Page: freescale.com implementers to use Freescale products. There are no express or implied copyright Web Support: freescale.com/support information in this document. licenses granted hereunder to design or fabricate any integrated circuits based on the Freescale reserves the right to make changes without further notice to any products herein. Freescale makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including “typicals,” must be validated for each customer application by customer’s technical experts. Freescale does not convey any license under its patent rights nor the rights of others. Freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address: freescale.com/salestermsandconditions. Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. All other product or service names are the property of their respective owners. © 2006-2009, 2015 Freescale Semiconductor, Inc. Document Number: MPxx5004 Rev. 12.1 05/2015