Full Material Declaration for attached parts list Full Material Declaration for attached parts list Report generated: 21 June 2016, 16:26 GMT Diotec Semiconductor AG DUNS number: 330866844 -, Kreuzmattenstr. 4, Heitersheim, B.-W., 79423, Germany Declarations authorised by: Udo Steinebrunner, Product Manager, - Declaration effective from: 1 January 2007 [Approved on 21 June 2016, 16:24 GMT] Materials and substances Use/Location Chip (die) Die attach Encapsulation Leadfinish Leadframe % w/w of material in the part Material group Other inorganic materials 2.00000% Lead and Lead alloys 1.20000% Other 40.00000% thermoplastics Tin plating 0.50000% Copper alloys 56.30000% Substances in the material CAS Number % w/w of substance in the material Nickel 8049-31-8 1.00000% Gold 7440-57-5 11.50000% Polydimethylsiloxane 63394-02-5 rubber 25.00000% Silicon 7440-21-3 62.50000% SILVER METAL 7440-22-4 2.50000% Tin 7440-31-5 5.00000% Lead 7439-92-1 92.50000% Carbon black 1333-86-4 0.30000% ANTIMONY TRIOXIDE 1309-64-4 0.80000% 3,5,3â¬5â‐ Tetrabromobisphenol A (TBBA) 79-94-7 0.99000% Epoxy resin 89 26335-32-0 27.61000% Quartz silica 14808-60-7 70.30000% Copper 7440-50-8 0.70000% Silver 7440-22-4 2.80000% Tin 7440-31-5 96.50000% Copper 7440-50-8 100.00000% Attached parts list Part number Part name Part Mass Part Mass UoM GBUxxX Bridge Rectifier Single Inline 3.8 g Page 1 Report generated: 21 June 2016, 16:26 GMT