Full Material Declaration for attached parts list Full Material Declaration for attached parts list Report generated: 6 June 2016, 08:33 GMT Diotec Semiconductor AG DUNS number: 330866844 -, Kreuzmattenstr. 4, Heitersheim, B.-W., 79423, Germany Declarations authorised by: Udo Steinebrunner, Product Manager, - Declaration effective from: 1 May 2009 [Approved on 3 June 2016, 12:07 GMT] Materials and substances Use/Location Chip (die) Die attach Encapsulation Leadfinish Leadframe Page 1 Material group Other inorganic materials Lead and Lead alloys EP (Epoxy resin) Tin plating Copper (e.g. copper amounts in cable harnesses) % w/w of material in the part 0.30000% 0.10000% 67.80000% 0.60000% 31.20000% Substances in the material CAS Number % w/w of substance in the material Nickel 7440-02-0 1.00000% Gold 7440-57-5 11.50000% Polydimethylsiloxane rubber 63394-02-5 25.00000% Silicon 7440-21-3 62.50000% Silver 7440-22-4 2.50000% Tin 7440-31-5 5.00000% Lead 7439-92-1 92.50000% Carbon black 1333-86-4 0.30000% ANTIMONY TRIOXIDE 1309-64-4 0.80000% Tetrabromobisphenol A (TBBPA) 79-94-7 0.99000% Epoxy resin 89 26335-32-0 27.61000% Quartz sand 60676-86-0 70.30000% Copper 7440-50-8 0.70000% Silver 7440-22-4 2.80000% Tin 7440-31-5 96.50000% Copper 7440-50-8 100.00000% Report generated: 6 June 2016, 08:33 GMT Full Material Declaration for attached parts list Attached parts list Part number Part name Part Mass Part Mass UoM BxxC3200...7000 Bridge Rectifier Single Inline 9 g Page 2 Report generated: 6 June 2016, 08:33 GMT