MDS

Full Material Declaration for attached parts list
Full Material Declaration for attached parts list
Report generated: 6 June 2016, 08:34 GMT
Diotec Semiconductor AG
DUNS-Nummer: 330866844
-, Kreuzmattenstr. 4, Heitersheim, B.-W., 79423, Germany
Declarations Autorisiert durch:
Udo Steinebrunner, Product Manager, -
Deklaration gilt ab: 1 May 2009 [Approved on 3 June 2016, 12:07 GMT]
Materialien und Stoffe
Verwendung/Andordnung
Chip (die)
Die attach
Encapsulation
Leadfinish
Leadframe
Page 1
Material
group
Other
inorganic
materials
Lead and
Lead alloys
EP (Epoxy
resin)
Tin plating
Copper (e.g.
copper
amounts in
cable
harnesses)
% w/w des
Materials
im Artikel
0.30000%
0.10000%
67.80000%
0.60000%
31.20000%
Substances in the
material
CAS Number
% w/w des
Stoffs im
Artikel
Nickel
7440-02-0
1.00000%
Gold
7440-57-5
11.50000%
Polydimethylsiloxane
rubber
63394-02-5
25.00000%
Silicon
7440-21-3
62.50000%
Silver
7440-22-4
2.50000%
Tin
7440-31-5
5.00000%
Lead
7439-92-1
92.50000%
Carbon black
1333-86-4
0.30000%
ANTIMONY
TRIOXIDE
1309-64-4
0.80000%
Tetrabromobisphenol
A (TBBPA)
79-94-7
0.99000%
Epoxy resin 89
26335-32-0
27.61000%
Quartz sand
60676-86-0
70.30000%
Copper
7440-50-8
0.70000%
Silver
7440-22-4
2.80000%
Tin
7440-31-5
96.50000%
Copper
7440-50-8
100.00000%
Report generated: 6 June 2016, 08:34 GMT
Full Material Declaration for attached parts list
Beigefügte Artikelliste
Part number
Artikelbezeichnung
Artikelmasse
Artikelmasse
UoM
BxxC3200...7000
Bridge Rectifier Single Inline
9
g
Page 2
Report generated: 6 June 2016, 08:34 GMT