EClamp2508K Datasheet

EClamp2508K
ESD/EMI Protection
for Color LCD Interfaces
PRELIMINARY
PROTECTION PRODUCTS - EMIClamp®
Description
Features
The EClamp® 2508K device is a low pass filter array
with integrated TVS diodes. It is designed to suppress
unwanted EMI/RFI signals and provide electrostatic
discharge (ESD) protection in portable electronic
equipment. This state-of-the-art device utilizes solidstate silicon-avalanche technology for superior clamping performance and DC electrical characteristics.
They have been optimized for protection of color
LCD panels in cellular phones and other portable
electronics.
‹ Bidirectional EMI/RFI filter with integrated TVS
for ESD protection
‹ ESD protection to IEC 61000-4-2 (ESD) Level 4,
of TVS diodes for ESD protection, and a 3-pole inductor - capacitor network for EMI/RFI filtering. A typical
inductor value of 17nH and a capacitor value of 12pF
are used to achieve 20dB minimum attenuation from
800MHz to 2.7GHz. The TVS diodes provide effective
suppression of ESD voltages in excess of ±15kV (air
discharge) and ±8kV (contact discharge) per IEC
61000-4-2, level 4.
Mechanical Characteristics
±15kV (air), ±8kV (contact)
‹ Filter performance: 20dB minimum attenuation
‹
‹
‹
‹
The device consists of eight identical circuits comprised ‹
‹
‹
‹
‹
‹
‹
‹
The EClamp2508K is in a 16-pin, SLP3313P16 package. It measures 3.3 x 1.3 x 0.50mm. The leads are
spaced at a pitch of 0.4mm and are finished with leadfree NiPdAu. The small package makes it ideal for use
in portable electronics such as cell phones, digital still
cameras, and PDAs.
800MHz to 2.7GHz
TVS working voltage: 5V
Inductor: 17nH (Typical)
Capacitors: 12pF (Typical at VR = 2.5V)
Protection and filtering for eight lines
Solid-state technology
SLP3313P16 16-pin package
PB-Free, Halogen Free, RoHS/WEEE Compliant
Nominal Dimensions: 3.3 x 1.3 x 0.50mm
Lead Pitch: 0.4mm
Lead finish: NiPdAu
Marking : Marking Code and Date Code
Packaging : Tape and Reel
Applications
‹ Color LCD Protection
‹ Cell Phone CCD Camera Lines
‹ Clamshell Cell Phones
Circuit Diagram (Each Line)
Package Configuration
3.30
1
17nH
IN
2
OUT
12pF
1.30
12pF
0.40 BSC
GND
0.50
16 Pin SLP package (Bottom Side View)
Nominal Dimensions in mm
Device Schematic (8X)
Revision 04/14/2010
1
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EClamp2508K
PRELIMINARY
PROTECTION PRODUCTS
Maximum Ratings
R ating
Symbol
Value
Units
VESD
+/- 20
+/- 15
kV
Junction Temp erature
TJ
125
o
Op erating Temp erature
Top
-40 to +85
o
Storage Temp erature
TSTG
-55 to +150
o
ESD p er IEC 61000-4-2 (Air)
ESD p er IEC 61000-4-2 (Contact)
C
C
C
Electrical Characteristics (T = 25oC)
P ar am et er
S y m b ol
Con d i t i on s
T VS Reverse Stand-Off Voltage
VRWM
T VS Reverse Breakdown Voltage
V BR
It = 1mA
IR
VRWM = 3.3V
T VS Reverse Leakage Current
Mi n i mu m
6
Ty p i c a l
M ax i m u m
Units
5
V
8
10
V
0.03
0.1
μA
18
Ohms
250
MHz
17
nH
DC Resistance
RDC
Filter Cut-Off Frequency
fc
Inductance
L
Capacitance
C1 , C2
VR = 2.5V, f = 1MHz
10
12
15
pF
Total Capacitance
C1 + C2
Input to Gnd,
Each Line
VR = 2.5V, f = 1MHz
20
24
30
pF
© 2010 Semtech Corp.
ZSource = ZLoad = 50 Ohms
2
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EClamp2508K
PRELIMINARY
PROTECTION PRODUCTS
Typical Characteristics
Typical Insertion Loss S21 (Each Line)
CH1 S21
LOG
Analog Crosstalk (Each Line)
6 dB / REF 0 dB
CH1 S21
LOG
20 dB /REF 0 dB
1: -4. 46 dB
250 MHz
2: -26.206 dB
800 MHz
0 dB
-6 dB
3: -34.349 dB
1.8 GHz
1
-12 dB
4: -33.371 dB
2.7 GHz
-18 dB
-24 dB
2
-30 dB
3
4
-36 dB
-42 dB
-48 dB
1
MHz
10
MHz
100
MHz
1
3
GHz GHz
START . 030 MHz
STOP 3 000. 000000 MHz
STOP 3 000. 000000 MHz
START . 030 MHz
ESD Clamping (+8kV Contact)
ESD Clamping (-8kV Contact)
Note: Data is taken with a 10x attenuator
Note: Data is taken with a 10x attenuator
Capacitance vs. Reverse Voltage
(Normalized to 2.5 volts)
2
CJ(VR) / CJ(VR=2.5)
1.5
1
0.5
f = 1 MHz
0
0
1
2
3
4
5
Reverse Voltage - VR (V)
© 2010 Semtech Corp.
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EClamp2508K
PRELIMINARY
PROTECTION PRODUCTS
Device Connection
Figure 1 - Pin Identification and Configuration
(Top Side View)
The EClamp2508K is comprised of four identical
circuits each consisting of a low pass filter for EMI/RFI
suppression and dual TVS diodes for ESD protection.
The device is in a 16-pin SLP package. Electrical
connection is made to the 16 pins located at the
bottom of the device. A center tab serves as the
ground connection. The device has a flow through
design for easy layout. Pin connections are noted in
Figure 1. All path lengths should be kept as short as
possible to minimize the effects of parasitic inductance
in the board traces. Recommendations for the ground
connection are given below.
In 1
In 2
In 3
In 4
In 5
In 6
In 7
In 8
Ground Connection Recommendation
Parasitic inductance present in the board layout will
affect the filtering performance of the device. As
frequency increases, the effect of the inductance
becomes more dominant. This effect is given by
Equation 1.
Equation 1: The Impedance of an Inductor at
Frequency XLF
16
Gnd
8
9
Out 1
Out 2
Out 3
Out 4
Out 5
Out 6
Out 7
Out 8
Pin
Identification
1-8
Inp ut Lines
9 - 16
Outp ut Lines
Center Tab
Ground
Figure 2 - Inductance of Rectangular Wire Loops
XLF(L, f ) = 2 * π * f * L
Ground
Via 1
Where:
L= Inductance (H)
f = Frequency (Hz)
Ground
Via 2
d
Signal Layer
x
Via connections to the ground plane form rectangular
wire loops or ground loop inductance as shown in
Figure 2. Ground loop inductance can be reduced by
using multiple vias to make the connection to the
ground plane. Bringing the ground plane closer to the
signal layer (preferably the next layer) also reduces
ground loop inductance. Multiple vias in the device
ground pad will result in a lower inductive ground loop
over two exterior vias. Vias with a diameter d are
separated by a distance y run between layers separated by a distance x. The inductance of the loop path
is given by Equation 2. Thus, decreasing distance x
and y will reduce the loop inductance and result in
better high frequency filter characteristics.
© 2010 Semtech Corp.
1
y
Ground Layer
Layer
Equation 2: Inductance of Rectangular Wire Loop
Where:
d = Diameter of the wire (in)
x = Length of wire loop (in)
y = Breath of wire loop (in)
4
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EClamp2508K
PRELIMINARY
PROTECTION PRODUCTS
Applications Information
Figure 3 shows the recommended device layout. The
ground pad vias have a diameter of 0.008 inches
(0.20 mm) while the two external vias have a diameter
of 0.010 inches (0.250mm). The internal vias are
spaced approximately evenly from the center of the
pad. The designer may choose to use more vias with a
smaller diameter (such as 0.005 inches or 0.125mm)
since changing the diameter of the via will result in
little change in inductance (i.e. the log function in
Equation 2 is highly insensitive to parameter d) .
Figure 4 shows a typical insertion loss (S21) plot for
the device using Semtech’s filter evaluation board with
50 Ohm traces and the recommended via configuration.
Figure 4 - Filter Characteristics Using Recommended
Layout with Internal Vias
CH1 S21
LOG
6 dB / REF 0 dB
1: -4. 46 dB
250 MHz
2: -26.206 dB
800 MHz
0 dB
-6 dB
3: -34.349 dB
1.8 GHz
1
-12 dB
4: -33.371 dB
2.7 GHz
-18 dB
-24 dB
2
-30 dB
3
4
-36 dB
-42 dB
Figure 3 - Recommended Layout Using Ground Vias
-48 dB
1
MHz
START . 030 MHz
© 2010 Semtech Corp.
5
10
MHz
100
MHz
3
1
GHz GHz
STOP 3 000. 000000 MHz
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EClamp2508K
PRELIMINARY
PROTECTION PRODUCTS
Applications Information - Spice Model
Line In
0.5nH
0.5nH
L
Line Out
16nH
EClamp2508K Spice Model
EClamp2508K Spice Parameters
© 2010 Semtech Corp.
Parameter
Unit
D1 (T VS)
D2 (T VS)
IS
Amp
1.48E-14
1.48E-14
BV
Volt
7.44
7.44
VJ
Volt
0.75
0.75
RS
Ohm
0.53
0.53
IB V
Amp
1E-3
1E-3
CJO
Farad
19.4E-12
19.4E-12
TT
sec
2.541E-9
2.541E-9
M
--
0.25
0.25
N
--
1.1
1.1
EG
eV
1.11
1.11
6
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EClamp2508K
PRELIMINARY
PROTECTION PRODUCTS
Outline Drawing - SLP3313P16
A
D
B
DIM
PIN 1
INDICATOR
(LASER MARK)
E
A
SEATING
PLANE
aaa C
A2
C
A1
A
A1
A2
b
D
D1
E
E1
e
L
N
aaa
bbb
DIMENSIONS
INCHES
MILLIMETERS
MIN NOM MAX MIN NOM MAX
.018 .020 .022
.000 .001 .002
(.005)
.006 .008 .010
.128 .130 .133
.110 .114 .118
.049 .051 .054
.008 .012 .016
.016 BSC
.008 .010 .012
16
.003
.004
0.45 0.50 0.55
0.00 0.02 0.05
(0.13)
0.15 0.20 0.25
3.25 3.30 3.375
2.80 2.90 3.00
1.25 1.30 1.375
0.20 0.30 0.40
0.40 BSC
0.20 0.25 0.30
16
0.08
0.10
D1
1
2
LxN
E/2
E1
N
bxN
e
bbb
C A B
e/2
D/2
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.
Land Pattern - SLP3313P16
P
X
DIMENSIONS
Z
G
H (C)
Y
DIM
C
G
H
K
P
X
Y
Z
INCHES
(.050)
.027
.012
.118
.016
.008
.023
.073
MILLIMETERS
(1.27)
0.69
0.30
3.00
0.40
0.20
0.58
1.85
K
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
© 2010 Semtech Corp.
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EClamp2508K
PRELIMINARY
PROTECTION PRODUCTS
Marking
Ordering Information
2508K
PIN 1
INDICATOR
YYWW
Part Number
Qty per
Reel
R eel Size
EClamp 2508K.TCT
3000
7 Inch
EMIClamp and EClamp are marks of Semtech Corporation
Note: YYWW = Date Code
Tape and Reel Specification
Pin 1 Location
User Direction of feed
Device Orientation in Tape
A0
1.51 +/-0.10 mm
B0
K0
3.51 +/-0.10 mm
0.66 +/-0.10 mm
Tape
Width
B, (Max)
D
D1
8 mm
4.2 mm
(.165)
1.5 + 0.1 mm
- 0.0 mm
(0.59 +.005
- .000)
0.8 mm
±0.05
(.031)
E
1.750±.10
mm
(.069±.004)
F
K
(MAX)
P
P0
P2
T(MAX)
W
3.5±0.05
mm
(.138±.002)
2.4 mm
(.094)
4.0±0.1
mm
(.157±.004)
4.0±0.1
mm
(.157±.004)
2.0±0.05mm
(.079±.002)
0.4 mm
(.016)
8.0 mm
+ 0.3 mm
- 0.1 mm
(.312±.012)
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Rd., Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
© 2010 Semtech Corp.
8
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