1SC3528Y24I0CE01

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Features
§
forward current ≦50mA
§
Wide viewing angle:120°
§
Operating Temperature -40~80℃
§
Storage temperature-40~80℃
§
ROHS and REACH-compliant
§
Junction Temperature110℃
§
PACKAGE:2000 PCS/REEL.
§
Qualified according to JEDEC moisturevity Level 3
§
Chip material: AlGaInP
§
Reverse Voltage:5V
§
Duty 1/10,Pulse Width 0.1ms
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Product Identification Code
1 S C 3528 Y24I 0 C E 01
Process
Type
Category
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LED Type
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Size
Flow code
PCB module
code
Cap color
Lap polarity
Dice wavelength
0
0
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Electrical-Optical Characteristics(Ta=25℃)
Value
Parameter
Symbol
Min.
Forward Voltage
Vf
Luminous intensity
Iv
460
λd
582
Ir
﹍
Wavelength
Reverse Current
Unit
Test condition
Typ.
Max.
2.0
2.5
V
If=20mA
800
﹍
mcd
If=20mA
597
(nm)
If=20mA
10
μA
Vr=5V
﹍
Deg
If=20mA
﹍
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Viewing angle
2θ1/2
﹍
120
▲Luminous intensity (IV) ±10%, Forward Voltage (VF) ±0.1V, Wavelength(λd) ±0.5nm
▲IS standard testing
Range of bins
BinB
BinC
BinD
Bin
1.8-1.9
1.9-2.0
2.0-2.1
VF(V)
Bin4
Bin5
Bin6
Bin
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55-70
70-90
90-120
0 Iv(mcd)
Bin11
Bin12
Bin13
Bin
0
460-600
600-780
0 Iv(mcd) 350-460
Bin18
Bin19
Bin20
Bin
Iv(mcd) 2200-2800 2800-3600 3600-4600
Bin25
Bin26
Bin
Iv(mcd) 13130-17000 17000-22100
B
C
D
Bin
585-588
588-591
WL(nm) 582-585
BinE
BinF
BinG
2.1-2.2
2.2-2.3
2.3-2.4
Bin7
Bin8
Bin9
Bin10
120-160
160-210
210-270
270-350
Bin14
Bin15
Bin16
Bin17
780-1000
1000-1300
1300-1700
1700-2200
Bin21
Bin22
Bin23
Bin24
4600-6000
6000-7800
E
F
591-594
594-597
7800-10100 10100-13130
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0
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Relative Luminous Intensity
Relative Spectral Distribution
Wavelength (nm)
Typical Spatial Distribution
Ta=25°
Relative Luminous Flux .Current
Ta=25
Genealogies angle
Relative Luminous Flux .Ambient Temperature
Relative Luminous Flux(%)
㎜
150
Relative luminous Intensity(%)
Optical Characteristics-1
110%
125
100
75
50
25
0
0
Ta=25℃
5
10
15
20
25
30
70%
50%
30%
20
Forward Current IF(mA)
Forward Voltage VF(V) Ta=25°
40
60
80
100 115
Junction Temperature(°)
Forward Current (mA)
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Electrical Characteristics
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0
90%
Thermal Design
Maximum Current(mA)
Relative Lumious Flux(%)
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Ambient Temperature(°)0
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Optical Characteristics-2
Wavelength and current
The relative wavelength (%)
Relative Forward Voltage(%)
Forward Voltage Temperature
Ambient Temperature(°)
Forward Current IF(mA)
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0
0
0
0
0
IF(mA)
Current
IF(mA)
d Current
Outline Dimensions
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All dimensions are in millimeters.(inch)
§ Tolerance is ±0.1(0.004)㎜ unless other specified
§
§ Specifications are subject to change without notice.
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Reflow Profile
1.IR reflow soldering Profile
Lead Free solder
300
℃
250
temperature
10sec. max
1-5℃/sec
2-5℃/sec
230℃ max
Pre heating 150-180℃
200
260℃ max
2-5℃/sec
150
120sec.Max
50sec.max
100
50
25℃
0
0
50
100
Time
150
200
250
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300
sec
2.IR reflow soldering Profile
Lead solder
300
℃
1-5℃/sec
temperature
250
10sec. max
210℃ max
Pre heating 150-180℃
200
240℃ max
2-5℃/sec
2-5℃/sec
150
120sec.Max
50sec.max
100
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0
0
50
25℃
0
0
50
100
Time
150
200
250
300
sec
NOTES:
1.We recommend the reflow temperature 240℃(±5℃).the maximum soldering temperature
should be limited to 260℃.
2.Don’t cause stress to the silicone resin while it is exposed to high temperature.
3.Number of reflow process shall be 1 time.
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Test circuit and handling precautions
 Test circuit
V
LED
 Handling precautions
1. Over-current-proof
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Customer must apply resistors for protection; otherwise slight voltage shift will cause
big current change (Burn out will happen).
2.Storage
2.1 It is recommended to store the products in the following conditions:
Humidity: 60% R.H. Max.
Temperature : 5℃~30℃(41℉~86℉)
2.2 Shelf life in sealed bag: 12 month at <5℃~30℃ and <60% R.H. after the package is
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Opened, the products should be used within a week or they should be keeping to stored at
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≦20%R.H. with zip-lock sealed.
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3.Baking
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It is recommended to baking before soldering when the pack is unsealed after 24hrs. The
Conditions are as followings:
3.1 70±3℃ x 24hrs and <5%RH, taped reel type
3.2 100±3℃ x 2hrs , bulk type
3.3 130±3℃ x(15~30min), bulk type
It shall be normal to see slight color fading of carrier(light yellow) after baking in process
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Packing-1
3528 Single-Color High Performance SMD Top LEDs Packaging Specifications
 Feeding Direction
 Dimensions of Reel (Unit: mm)
Feeding Direction
 Dimensions of Tape (Unit: mm)
A
SEC.A-A
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A
 Arrangement of Tape
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NOTES
1. Empty component pockets are sealed with top cover tape;
2. The maximum number of missing smds is two;
3. The cathode is oriented towards the tape sprocket hole in accordance with ANSI/EIA RS-481 specifications;
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4. 2,000pcs/Reel
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Packing-2
3528 Single-Color High Performance SMD Top LEDs Packaging Specifications
 Packaging specifications
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NOTES:
Reeled products (The most numbers of products are 2,000pcs) packed in a seal off moisture-proof bag
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0 along with a desiccant one by one, Seven moisture-proof bag of maximums (total maximum number of
0 products are 14,000pcs) packed in an inside box (size: about 238mm x about 194mm x about 102mm) and
0 four inside boxes of maximums are put in the outside box (size: about 410mm x about 254mm x about
229mm) Together with buffer material, and it is packed. (Part No., Lot No., quantity should appear on the
label on the moisture-proof bag, part No. And quantity should appear on the in section request form on the
cardboard box.) .
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Precautions
1、Abnormal situation caused by improper setting of collet
To choose the right collet is the key issue in improving the product’s quality. LED is different from
other electronic components, which is not only about electrical output but also for optical output. This
characteristic made LED more fragile in the process of SMT. If the collet’s lowering down height is not
well set, it will bring damage to the gold wire at the time of collet’s picking up and loading which will
cause the LED fail to light up, light up now and then or other quality problems
2、How to choose the collet
During SMT, please choose the collet that has larger outer diameter than the lighting area of lens, in case
that improper position of collet will damage the gold wire inside the LED. Different collets fit for different
products, please refer to the following pictures cross out:.
Outer diameter of collet should
be larger than the lighting area
Outer diameter of collet
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Picture 1()
Picture 2(×)
3、How to set the height of collet
The reason why for top view SMD, the height of collet before it presses downward will directly affect
the quality of products during SMT is that if the collect go down too much, it will press lens and cause the
distortion or breaking of gold wire. The setting of collet position should follow the pictures belowed.
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Picture 3()
Picture 4(×)
No.3、Other points for attention
A、No pressure should be exerted to the epoxy shell of the SMD under high temperature.
B、Do not scratch or wipe the lens since the lens and gold wire inside are rather fragile and cross
out easy to break.
C、LED should be used as soon as possible when being taken out of the original package, and
should be stored in anti-moisture and anti-ESD package.
No.4、This usage and handling instruction is only for your reference.
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Test items and results of reliability
Type
Test Item
Test Standard
Environmental
Sequence
Temperature Cycle
Thermal Shock
High Temperature Storage
Humidity Heat Storage
Test Conditions
JEITA ED-4701
300 303
JEITA ED-4701
200 303
JEITA ED-4701
200 201
↑↓5 min
Life Test
↑↓5sec
Ta=100℃
RH=90%
Operation
Sequence
standard
High Humidity
Heat Life Test
Tested with
Brightek
standard
Tested with
Low Temperature Life Test
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Brightek
standard
20 cycle
0/22
1000 hrs
0/22
1000 hrs
0/22
1000 hrs
0/22
1000 hrs
0/22
500 hrs
0/22
1000 hrs
0/22
100℃ 15min
100 103
Brightek
0/50
-10℃ 15min
Ta=60℃
Tested with
100 cycle
100℃ 30min
JEITA ED-4701
200 202
Number of
Damaged
-40℃ 30min
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JEITA ED-4701
Low Temperature Storage
Note
Ta=-40℃
Ta=25℃
IF=20mA
60℃ RH=90%
IF=15mA
Ta=-20℃
IF=20mA
Judgment criteria of failure for the reliability
Measuring items
Symbol
Measuring conditions
Forward voltage
Vf(V)
IF=20mA
Reverse current
IR(uA)
Vr=5V
Judgement criteria for failure
Over
Over
U×1.2
U×2
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