0 COMMODITY: SURFACE MOUNT LED SMD SPECIFICATION Part No: 1TC5003B12E2CF01 Characters § 5.0mm×5.0mm SMT LED , 1.5mm THICKNESS. § LOW POWER CONSUMPTION. § VIEWING ANGLE 120°. § VARIOUS COLORS AND LENS TYPES AVAILABLE. § PACKAGE: 1000 PCS/REEL. ITEM MATERIALS Resin(Mold) Silicon Lens Color Water Transparent Dice InGaN Emitted color Blue Absolute Maximum Ratings（Ta=25℃） Item Symbol Value Unit Power Dissipation/DICE PD 120*3 mW DC Forward Current/DICE IF 30*3 mA Single Chip Pulsed Forward Current IFP 100* mA Reverse Voltage VR 5 V Operating Temperature Topr -30 ~ +80 ℃ Storage Temperature Tstg -40 ~ +100 ℃ Tsol 260for5sec△ ℃ 0000000000000000000000000000000000000000000000000000000 00000000000000 Soldering Temperature 0 0 ※Duty 1/10 Pulse Width 0.1ms. 0 △Soldering time max 10sec please refer to IF-Ta diagram of curves for the temperature during application 0 0 0 Electrical-Optical Characteristics（Ta=25℃） Value Symbol Parameter Min. Typ. Max. Unit Test condition Forward Voltage Vf 2.8 3.3 3.6 V If=20mA*3 Luminous intensity Iv 780 1000 1700 mcd If=20mA*3 Wavelength λD 462.5 472.5 nM If=20mA*3 Reverse Current Ir ﹍ ﹍ 10 μA Vr=5V 2θ1/2 ﹍ 120 ﹍ Deg If=20mA*3 Viewing angle 1.Luminous intensity (IV) ±10%, Forward Voltage (VF) ±0.1V, Wavelength(λd )±0.5nm 2.IS standard testing 0000000000000000000000000000000000000000000000000000000 Range of bins Bin BinB BinC BinD BinE BinF BinG BinH VF(v) 2.8-2.9 2.9-3.0 3.0-3.1 3.1-3.2 3.2-3.3 3.3-3.4 3.4-3.5 Bin BinI VF(v) 3.5-3.6 Bin15 Bin16 1000-1300 1300-1700 Bin14 Bin 00000000000000 0 Iv(mcd) 780-1000 0 D Bin 0 WL(nm) 462.5-467.5 E 467.5-472.5 0 0 0 Outline Dimensions 0.6 3 5 4 5.0 6 0.6 0.2 5 3 1 6 1.1 4 2 1.1 5.0 5.4±0.1 1 2 C1.0 3.34 0.8 1.6 5 20mA 3 20mA 0000000000000000000000000000000000000000000000000000000 20mA 1 45° 3.4 unit:mm 2 4 6 00000000000000 0 0 0 0 § All dimensions are in millimeters. § § Tolerance is ±0.1 unless other specified Specifications are subject to change without notice. 0 0 COMMODITY: SURFACE MOUNT CHIP LED SMD SPECIFICATION DEVICE NUMBER: 1TC5003B12E2CF01 Fig.1 IF-VF(Ta=25℃) Fig.2 Relative Luminous Intensity-IF (Ta=25℃) Forward Current IF(mA) Relative Luminous Intensity . Forward Current IF(mA) Forward Voltage VF(V) 0000000000000000000000000000000000000000000000000000000 Fig.3 Wavelength Characteristics Fig.4 Relative Luminous Intensity-Ta Relative Luminous Intensity Relative Luminous Intensity (Ta=25℃) Wavelength λ (nm) Fig.5 IF-Ta Ambient Temperature Ta (℃) Directive Characteristics（Ta=25℃） Forward Current IF(mA) 00000000000000 0 0 0 Ambient Temperature Ta (℃) 0 0 0 Reflow Profile Reflow Temp/Time 0000000000000000000000000000000000000000000000000000000 00000000000000 0 0 0 NOTES: 1. We recommend the reflow temperature 240℃(±5℃).the maximum soldering temperature should be limited to 260℃. 2. Don’t cause stress to the silicone resin while it is exposed to high temperature. 3. Number of reflow process shall be 1 time. 0 0 0 Test circuit and handling precautions Test circuit Handling precautions 0000000000000000000000000000000000000000000000000000000 1. Over-current-proof Customer must apply resistors for protection; otherwise slight voltage shift will cause big current change (Burn out will happen). 2.Storage 2.1 It is recommended to store the products in the following conditions: Humidity: 60% R.H. Max. Temperature : 5℃~30℃(41℉~86℉) 2.2 Shelf life in sealed bag: 12 month at ＜5℃~30℃ and ＜60% R.H. after the package is 00000000000000 Opened, the products should be used within a week or they should be keeping to stored at 0 ≦20%R.H. with zip-lock sealed. 0 0 3.Baking It is recommended to baking before soldering when the pack is unsealed after 24hrs. The Conditions are as followings: 3.1 70±3℃ x(12~24hrs) and ＜5%RH, taped reel type 3.2 100±3℃ x(45min~1hr), bulk type 3.3 130±3℃ x(15~30min), bulk type 0 0 0 Test items and results of reliability Type Test Item Test Conditions Note Number of Damaged Temperature Cycle -45℃ 30min ↑↓20 min 105℃ 30min 100 cycle 0/22 100 cycle 0/22 -10℃ 15min Environmental Sequence Thermal Shock ↑↓5sec 100℃ 15min High Humidity Heat Cycle 30℃⇔ 65℃ 90%RH 24hrs/1cycle 10 cycle 0/22 High Temperature Storage Ta=100℃ 1000 hrs 0/22 Operation Sequence 0000000000000000000000000000000000000000000000000000000 Humidity Heat Storage Ta=85℃ RH=85% 1000 hrs 0/22 Low Temperature Storage Ta=-40℃ 1000 hrs 0/22 Life Test Ta=25℃ IF=60mA 1000 hrs 0/22 High Humidity Heat Life Test 85℃ RH=85% IF=30mA 500 hrs 0/22 Ta=-20℃ IF=60mA 1000 hrs 0/22 00000000000000 0 Low Temperature Life Test 0 0 0 0 0 5050 Single-Color High Performance SMD Top LEDs Packaging Specifications z Feeding Direction z Dimensions of Reel (Unit: mm) 0000000000000000000000000000000000000000000000000000000 z Dimensions of Tape (Unit: mm) 00000000000000 0 0 0 NOTES 1. Empty component pockets are sealed with top cover tape; 2. The maximum number of missing smds is two; 3. The cathode is oriented towards the tape sprocket hole in accordance with ANSI/EIA RS-481 specifications; 4. 1,000pcs/Reel 0 0 0 5050 Single-Color High Performance SMD Top LEDs Packaging Specifications z Packaging specifications 0000000000000000000000000000000000000000000000000000000 NOTES: Reeled products (The most numbers of products are 1,000pcs) packed in a seal off moisture-proof bag along with a desiccant one by one, Five moisture-proof bag of 00000000000000 maximums (total maximum number of products are5,000pcs) packed in an inside box (size: 0 about 238mm x about 194mm x about 102mm) and four inside boxes of maximums are put 0 in the outside box (size: about 410mm x about 254mm x about 229mm) Together with buffer 0 material, and it is packed. (Part No., Lot No., quantity should appear on the label on the moisture-proof bag, part No. And quantity should appear on the inspection request form on the cardboard box.) . 0 0 0 LED Usage and Handling Instructions No.1、soldering： A、It is not better to be manual soldering. B、Reflow soldering： 1、Soldering according to the following temperature chart is highly recommended 0000000000000000000000000000000000000000000000000000000 2、Soldering paste Use soldering paste with the melting point at 230℃ is recommended No.2、Collet 1、Abnormal situation caused by improper setting of collet To choose the right collet is the key issue in improving the product’s quality. LED is 00000000000000 different from other electronic components, which is not only about electrical output but 0 also for optical output. This characteristic made LED more fragile in the process of SMT. If 0 the collet’s lowering down height is not well set, it will bring damage to the gold wire at the 0 time of collet’s picking up and loading which will cause the LED fail to light up, light up now and then or other quality problems 2、How to choose the collet During SMT, please choose the collet that has larger outer diameter than the lighting area of lens, in case that improper position of collet will damage the gold wire inside the LED. Different collets fit for different products, please refer to the following pictures cross out:. 0 0 0 Outer diameter of collet should be larger than the lighting area Picture 1（√） Outer diameter of collet Picture 2（×） 3、How to set the height of collet The reason why for top view SMD, the height of collet before it presses downward will directly affect the quality of products during SMT is that if the collect go down too much, it will press lens and cause the distortion or breaking of gold wire. The setting of collet position should follow the pictures belowed. 0000000000000000000000000000000000000000000000000000000 Picture 3（√） Picture 4（×） No.3、Other points for attention 00000000000000 0 A、No pressure should be exerted to the epoxy shell of the SMD under high 0 temperature. 0 B、Do not scratch or wipe the lens since the lens and gold wire inside are rather fragile and cross out easy to break. C、LED should be used as soon as possible when being taken out of the original package, and should be stored in anti-moisture and anti-ESD package. No.4、This usage and handling instruction is only for your reference. 0 0