1TC5003B12E2CF01

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COMMODITY: SURFACE MOUNT LED SMD SPECIFICATION
Part No: 1TC5003B12E2CF01
Characters
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5.0mm×5.0mm SMT LED , 1.5mm THICKNESS.
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LOW POWER CONSUMPTION.
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VIEWING ANGLE 120°.
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VARIOUS COLORS AND LENS TYPES AVAILABLE.
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PACKAGE: 1000 PCS/REEL.
ITEM
MATERIALS
Resin(Mold)
Silicon
Lens Color
Water Transparent
Dice
InGaN
Emitted color
Blue
Absolute Maximum Ratings(Ta=25℃)
Item
Symbol
Value
Unit
Power Dissipation/DICE
PD
120*3
mW
DC Forward Current/DICE
IF
30*3
mA
Single Chip Pulsed Forward Current
IFP
100*
mA
Reverse Voltage
VR
5
V
Operating Temperature
Topr
-30 ~ +80„
℃
Storage Temperature
Tstg
-40 ~ +100
℃
Tsol
260for5sec△
℃
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Soldering Temperature
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0 ※Duty 1/10 Pulse Width 0.1ms.
0 △Soldering time max 10sec
„please refer to IF-Ta diagram of curves for the temperature during application
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Electrical-Optical Characteristics(Ta=25℃)
Value
Symbol
Parameter
Min.
Typ.
Max.
Unit
Test condition
Forward Voltage
Vf
2.8
3.3
3.6
V
If=20mA*3
Luminous intensity
Iv
780
1000
1700
mcd
If=20mA*3
Wavelength
λD
462.5
472.5
nM
If=20mA*3
Reverse Current
Ir
﹍
﹍
10
μA
Vr=5V
2θ1/2
﹍
120
﹍
Deg
If=20mA*3
Viewing angle
1.Luminous intensity (IV) ±10%, Forward Voltage (VF) ±0.1V, Wavelength(λd )±0.5nm
2.IS standard testing
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Range of bins
Bin
BinB
BinC
BinD
BinE
BinF
BinG
BinH
VF(v)
2.8-2.9
2.9-3.0
3.0-3.1
3.1-3.2
3.2-3.3
3.3-3.4
3.4-3.5
Bin
BinI
VF(v)
3.5-3.6
Bin15
Bin16
1000-1300
1300-1700
Bin14
Bin
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0 Iv(mcd) 780-1000
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D
Bin
0 WL(nm) 462.5-467.5
E
467.5-472.5
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Outline Dimensions
0.6
3
5
4
5.0
6
0.6
0.2
5
3
1
6
1.1
4
2
1.1
5.0
5.4±0.1
1
2
C1.0
3.34
0.8
1.6
5
20mA
3
20mA
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20mA
1
45°
3.4
unit:mm
2
4
6
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All dimensions are in millimeters.
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Tolerance is ±0.1 unless other specified
Specifications are subject to change without notice.
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COMMODITY: SURFACE MOUNT CHIP LED SMD SPECIFICATION
DEVICE NUMBER: 1TC5003B12E2CF01
Fig.1 IF-VF(Ta=25℃)
Fig.2 Relative Luminous Intensity-IF
(Ta=25℃)
Forward Current IF(mA)
Relative Luminous Intensity
.
Forward Current IF(mA)
Forward Voltage VF(V)
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Fig.3 Wavelength Characteristics
Fig.4 Relative Luminous Intensity-Ta
Relative Luminous Intensity
Relative Luminous Intensity
(Ta=25℃)
Wavelength λ (nm)
Fig.5 IF-Ta
Ambient Temperature Ta (℃)
Directive Characteristics(Ta=25℃)
Forward Current IF(mA)
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Ambient Temperature Ta (℃)
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Reflow Profile
„ Reflow Temp/Time
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NOTES:
1. We recommend the reflow temperature 240℃(±5℃).the maximum soldering
temperature should be limited to 260℃.
2. Don’t cause stress to the silicone resin while it is exposed to high temperature.
3. Number of reflow process shall be 1 time.
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Test circuit and handling precautions
„ Test circuit
„ Handling precautions
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1. Over-current-proof
Customer must apply resistors for protection; otherwise slight voltage shift will cause
big current change (Burn out will happen).
2.Storage
2.1 It is recommended to store the products in the following conditions:
Humidity: 60% R.H. Max.
Temperature : 5℃~30℃(41℉~86℉)
2.2 Shelf life in sealed bag: 12 month at <5℃~30℃ and <60% R.H. after the package is
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Opened, the products should be used within a week or they should be keeping to stored at
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≦20%R.H. with zip-lock sealed.
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3.Baking
It is recommended to baking before soldering when the pack is unsealed after 24hrs. The
Conditions are as followings:
3.1 70±3℃ x(12~24hrs) and <5%RH, taped reel type
3.2 100±3℃ x(45min~1hr), bulk type
3.3 130±3℃ x(15~30min), bulk type
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Test items and results of reliability
Type
Test Item
Test Conditions
Note
Number of
Damaged
Temperature Cycle
-45℃ 30min
↑↓20 min
105℃ 30min
100 cycle
0/22
100 cycle
0/22
-10℃ 15min
Environmental
Sequence
Thermal Shock
↑↓5sec
100℃ 15min
High Humidity Heat Cycle
30℃⇔ 65℃
90%RH 24hrs/1cycle
10 cycle
0/22
High Temperature Storage
Ta=100℃
1000 hrs
0/22
Operation
Sequence
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Humidity Heat Storage
Ta=85℃
RH=85%
1000 hrs
0/22
Low Temperature Storage
Ta=-40℃
1000 hrs
0/22
Life Test
Ta=25℃
IF=60mA
1000 hrs
0/22
High Humidity Heat Life Test
85℃ RH=85%
IF=30mA
500 hrs
0/22
Ta=-20℃
IF=60mA
1000 hrs
0/22
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Low Temperature Life Test
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5050 Single-Color High Performance SMD Top LEDs Packaging Specifications
z Feeding Direction
z Dimensions of Reel (Unit: mm)
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z Dimensions of Tape (Unit: mm)
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NOTES
1. Empty component pockets are sealed with top cover tape;
2. The maximum number of missing smds is two;
3. The cathode is oriented towards the tape sprocket hole in accordance with ANSI/EIA RS-481 specifications;
4. 1,000pcs/Reel
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5050 Single-Color High Performance SMD Top LEDs Packaging Specifications
z
Packaging specifications
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NOTES:
Reeled products (The most numbers of products are 1,000pcs) packed in a seal off
moisture-proof bag along with a desiccant one by one, Five moisture-proof bag of
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maximums (total maximum number of products are5,000pcs) packed in an inside box (size:
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about 238mm x about 194mm x about 102mm) and four inside boxes of maximums are put
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in the outside box (size: about 410mm x about 254mm x about 229mm) Together with buffer
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material, and it is packed. (Part No., Lot No., quantity should appear on the label on the
moisture-proof bag, part No. And quantity should appear on the inspection request form on
the cardboard box.) .
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LED Usage and Handling Instructions
No.1、soldering:
A、It is not better to be manual soldering.
B、Reflow soldering:
1、Soldering according to the following temperature chart is highly recommended
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2、Soldering paste
Use soldering paste with the melting point at 230℃ is recommended
No.2、Collet
1、Abnormal situation caused by improper setting of collet
To choose the right collet is the key issue in improving the product’s quality. LED is
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different from other electronic components, which is not only about electrical output but
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also for optical output. This characteristic made LED more fragile in the process of SMT. If
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the collet’s lowering down height is not well set, it will bring damage to the gold wire at the
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time of collet’s picking up and loading which will cause the LED fail to light up, light up
now and then or other quality problems
2、How to choose the collet
During SMT, please choose the collet that has larger outer diameter than the lighting
area of lens, in case that improper position of collet will damage the gold wire inside the
LED. Different collets fit for different products, please refer to the following pictures cross
out:.
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Outer diameter of collet should
be larger than the lighting area
Picture 1(√)
Outer diameter of collet
Picture 2(×)
3、How to set the height of collet
The reason why for top view SMD, the height of collet before it presses
downward will directly affect the quality of products during SMT is that if
the collect go down too much, it will press lens and cause the distortion or
breaking of gold wire. The setting of collet position should follow the
pictures belowed.
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Picture 3(√)
Picture 4(×)
No.3、Other points for attention
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A、No pressure should be exerted to the epoxy shell of the SMD under high
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temperature.
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B、Do not scratch or wipe the lens since the lens and gold wire inside are rather
fragile and cross out easy to break.
C、LED should be used as soon as possible when being taken out of the original
package, and should be stored in anti-moisture and anti-ESD package.
No.4、This usage and handling instruction is only for your reference.
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