VZDP52AWRGBF00Z4

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Customer Part No:
Part No: 5252WRGB-L preliminary
VZDP52AWRGBF00Z4
Specification:
Documents No:
Prepared By:
Alex Hsieh
/ Time: 2013/06/17
Checked By:
Kiwi Liao
/ Time: 2013/06/17
Customer Confirmation:
FEATURES
§ Forward maximum pulse current 700mA/per chip
§ Wide viewing angle: Typ.120°
§ Operating temperature -30~80℃
§ Storage temperature-40~100℃
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§ ROHS -compliant
§ Qualified according to JEDEC moisture Level 2
CATALOG
Electrical-Optical Characteristics …………...………………...
Optical Characteristics ……………………….…………………….
Structure and Outline Dimensions ....…………………………….
Reflow Profile …………………………………………………………
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Packing
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Test circuit and handling precautions
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3-4
5
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7-8
9-10
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 PART NUMBER TABLE
Substrate
Color
ALN
W/R/G/B
Emitter
5252DP

Flux Characteristics
Luminous Flux @ If=350mA (lm)
Rated Current
Color
Min
350mA
White
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120
---
120
350mA
Red
---
65
---
120
350mA
Green
---
110
---
120
350mA
Blue
---
24
---
120
Note:1. Luminous intensity (Iv) ±5%,
Typ
Viewing Angle
Max
Viewing angle(2θ1/2) ±5%/
2. IS standard testing
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3. Electrical-Optical Characteristics（Ta=25℃）

Electrical Characteristics at Ta = 25C.
Vf @ If=350mA
Rated Current
Color
Typ. (V)
Max. (V)
350mA
White
3.2
3.6
350mA
Red
2.2
2.8
350mA
Green
3.4
3.8
350mA
Blue
3.2
3.6
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Note:1.Forward Voltage (VF ) ±0.06V,
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0  Standard Bin & Wavelength Characteristics
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Standard Bin Wavelength (λd)@ If=350mA
Rated Current
Color
Min. (nm)
Max. (nm)
350mA
White
5000K
6500K
350mA
Red
620
630
350mA
Green
520
530
350mA
Blue
455
465
Note: 1. Wavelength is measured with an accuracy of 1nm.
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 OPTICAL CHARACTERISTICS


RELATIVE SPECTRAL POWER DISTRIBUTION
RELATIVE FLUX VS. CURRENT (TJ = 25°C)
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VOLTAGE VS. CURRENT (TJ = 25°C)
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 TYPICAL SPATIAL DISTRIBUTION
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COLOR COORDINATE
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 Structure and Outline Dimensions
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_
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§
All dimensions are in millimeters.
§
Tolerance is ±0.13 ㎜ unless other specified
 Circuit Type
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

REFLOW PROFILE
IR reflow soldering Profile
Lead Free solder
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NOTES:
1. We recommend the reflow temperature 180℃(±5℃).the maximum soldering temperature
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2. Don’t stress the silicone resin while it is exposed to high temperature.
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3. Number of reflow process shall be 1 time.
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4. Recommend Solder:
1.TAMURA-TLF-401-11
2. PF602-P
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
PACKING

Tape and Reel
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
TEST CIRCUIT AND HANDLING PRECAUTIONS

Test circuit
V

LED
Handling precautions
1、The following items are recommended when handling LEDs
1.1 The lens of LEDs should not be exposed to dust and debris. Excessive dust and debris may
cause a drastic decrease in light output.
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1.2 Avoid mechanical stress on LED lens
1.3 Do not touch the LED lens surface. It would affect the optical performance of the LED due to
the LED lens’ damage
1.4 Pick & place tool was recommended to use for the remove of LEDs from the factory tape &
reel packaging
3、Lens handling
Please follow the guideline to grab LEDs
3.1 Use tweezers to grab LEDs
000000000000003.2 Do not touch lens with the tweezers
3.3 Do not touch lens with fingers
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3.4 Do not apply more than 4N of lens (400g) directly onto the lens
0 4、Lens cleaning
In the case where a minimal level of dirt and dust particles can’t be guaranteed, a suitable
cleaning solution can be applied to the lens surface
4.1 Try a gentle swabbing using a lint-free swab
4.2 If needed, the use of lint-free swab and isopropyl alcohol used gently removes dirt from the
lens surface.
4.3 Do not use other solvents as they may directly react with the LED assembly
4.4 Do not use ultrasonic cleaning that the LED will be damaged
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5、Carrier Tape Handling
The following items are recommended when handling the Carrier tape of LEDs
5.1 Do not twist the carrier tape
5.2 The inward bending diameter should not smaller than 6cm for carrier tape.
5.3 Do not bend the tape outward.
<6cm
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