1ZHP35AQ24BHZ1ZG

3535HP Series
3535HP UV LED
◆ Outline : 3.5*3.5*2.0mm
3.5*3.5*2.9mm
◆ High efficiency
◆ Good thermal dissipation & optical uniformity
Table of contents
Features
Features--------------------------------------------------1
 RoHS and REACH-compliant
Product code method---------------------------------2
 MSL2 qualified according to J-STD 020
Product list ----------------------------------------------3
 ESD 8KV (HBM : MIL-STD-883 Class 3B)
Maximum rating----------------------------------------4
Intensity binning----------------------------------------5
Forward voltage binning------------------------------5
Applications
Wavelength binning-----------------------------------6
 UV Curing
Relative spectral power distribution---------------7
 Medical applications
Electronic-optical characteristics ------------------7
 Industrial facility applications
Typical spatial distribution---------------------------8
Thermal design for de-rating------------------------8
Dimensions----------------------------------------------9
Suggest Stencil Pattern-----------------------------10
Packing--------------------------------------------------11
Reflow profile------------------------------------------13
Precautions--------------------------------------------14
Test items and results of reliability---------------17
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3535HP Series
 Product code method
1 - Z - HP35 - A – Q24B - H - Z - 1 - Z – G
1 - Z - HP35 - B – Q24B - H - Z - 1 - Z – G
1 - Z - HP35 - A – Q34B - H - Z - 1 - Z – G
1 - Z - HP35 - B – Q34B - H - Z - 1 - Z – G
1 - Z - HP35 - A – Q54B - H - Z - 1 - Z – G
1 - Z - HP35 - B – Q54B - H - Z - 1 - Z – G
① ②
③
④
⑤
⑥ ⑦
⑧ ⑨
⑩
①
②
③
④
Process type
Category
Specification
Lens code
Z: SMD LED
HP35: Ceramic
1: Normal process
3535
⑥
Support code
H: HTCC
⑦
Zener &
High CRI
Z: Zener
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⑧
Cap color code
1: Series No.
A: 120°
⑤
Dice wavelength
& Luminous rank
Qxxx: UV product
B: 60°
⑨
Module& Lens
code
Z: Molding
⑩
Current code
G: 500mA
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3535HP Series
 Product list
Radiant Power (mW)
Color
500mA
700mA
Min.
Min.
U062
620
824
U066
660
877
U070
700
931
U074
740
984
U078
780
1037
U082
820
1090
U086
860
1144
U090
900
1197
U062
620
824
U066
660
877
U070
700
931
U074
740
984
U078
780
1037
U082
820
1090
U086
860
1144
U090
900
1197
U062
620
824
U066
660
877
U070
700
931
U074
740
984
U078
780
1037
U082
820
1090
U086
860
1144
U090
900
1197
Group
UV
UV
UV
Peak
Wavelength
(nm)
380-390
390-410
410-430
Forward Voltage (V)
@500mA
Min.
Max.
2.8
2.8
2.8
Viewing
Angle
Part Number
120°
1ZHP35AQ24BHZ1ZG
60°
1ZHP35BQ24BHZ1ZG
120°
1ZHP35AQ34BHZ1ZG
60°
1ZHP35BQ34BHZ1ZG
120°
1ZHP35AQ54BHZ1ZG
60°
1ZHP35BQ54BHZ1ZG
4.0
4.0
4.0
Notes:
1. Forward voltage (VF ) ±0.05V, Radiant power (PO) ±7%
2. IS standard testing.
3. Viewing angle(2θ1/2) ±10°
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3535HP Series
 Maximum Rating (Ta : 25℃)
Characteristics
Symbol
DC Forward Current1
IF
Reverse Voltage
Min.
Typical
Max.
Unit
500
700
mA
VR
-5
V
Reverse Current (-5V)
IR
10
μA
Junction Temperature2
Tj
125
℃
Storage Temperature Range
Tstg
100
℃
Soldering Temperature
Tsol
260
℃
-40
–
Notes:
1. For other ambient, limited setting of current will depend on de-rating curves.
2. When drive on maximum current , Tj must be kept below 125℃
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3535HP Series
 Intensity binning
Bin code
Min. Po
Max. Po
(500mA)
(mW)
(mW)
U062
620
660
U066
660
700
U070
700
740
U074
740
780
U078
780
820
U082
820
860
U086
860
900
U090
900
940
Bin code
Min. VF
Max. VF
(500mA)
(V)
(V)
V2830
2.8
3.0
V3032
3.0
3.2
V3234
3.2
3.4
V3436
3.4
3.6
V3638
3.6
3.8
V3840
3.8
4.0
 Forward voltage binning
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3535HP Series
 Wavelength binning
Bin code
Min. Wp
Max. Wp
(500mA)
(nm)
(nm)
Q380
380
385
Q385
385
390
Q390
390
395
Q395
395
400
Q400
400
405
Q405
405
410
Q410
410
415
Q415
415
420
Q420
420
425
Q425
425
430
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3535HP Series
 Relative spectral power distribution
 Electronic-optical characteristics
Forward Current vs. Forward Voltage (Ta=25℃)
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Relative Radiant Power vs. Forward Current (Ta=25℃)
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3535HP Series
 Typical Spatial Distribution
120°
60°
 Thermal Design for De-rating
The maximum forward current is determined by the thermal resistance between the LED junction and
ambient. It is crucial for the end product to be designed in a manner that minimizes the thermal
resistance from the solder point to ambient in order to optimize lamp life and optical characteristics.
1000
900
Rj-a = 10 ℃/W
Rj-a = 15 ℃/W
Rj-a =20 ℃/W
Rj-a =25 ℃/W
Maximum Current (mA)
800
700
600
500
400
300
200
100
0
0
10
20
30
40
50
60
70
80
90 100 110 120 130 140 150
Ambient Temperature (℃)
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3535HP Series
 Dimensions
120°
60°
§ All dimensions are in millimeters.
§ Tolerance is ±0.13mm unless other specified.
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3535HP Series
 Suggest Stencil Pattern (Recommendations for reference)
§ Suggest stencil t =0.12 mm
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3535HP Series
 Packing
-
+
Trailer 160(min) of
empty pockets sealed
with tape
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Loaded Pockets
(1000 pcs)
Leader 400mm (min) of
empty pockets sealed
with tape
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3535HP Series
Label
Label
Label
Notes:
1.
Each reel (minimum number of pieces is 100 and maximum is 1000 for 120 degree
product / 500 for 60 degree product) is packed in a moisture-proof bag along with 2 packs
of desiccant and a humidity indicator card;
2.
A maximum of 5 moisture-proof bags are packed in an inner box (size: 240mm x 200mm
x 105mm ±5mm)
3.
A maximum of 4 inner boxes are put in an outer box (size: 410mm x 255mm x 230mm
±5mm)
4.
Part No., Lot No., quantity should be indicated on the label of the moisture-proof bag and
the cardboard box.
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3535HP Series
 Reflow Profile
IR reflow soldering Profile
Lead Free solder
Lead solder
300
℃
1-5℃/sec
temperature
250
Pre heating 150-180℃
200
240℃ max
10sec. max
210℃ max
2-5℃/sec
2-5℃/sec
150
120sec.Max
50sec.max
100
50
25℃
0
0
50
100
Time
150
200
250
300
sec
Notes:
1. The recommended reflow temperature is 240℃(±5℃). The maximum soldering temperature
should be limited to 260℃.
2. Do not stress the silicone resin while it is exposed to high temperature.
3. The reflow process should not exceed 3 times.
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3535HP Series
 Precautions
1. Recommendation for using LEDs
1.1 The lens of LEDs should not be exposed to dust or debris. Excessive dust and debris may
cause a drastic decrease in the luminosity.
1.2 Avoid mechanical stress on LED lens.
1.3 Do not touch the LED lens surface. It would affect the optical performance of the LED due
to the LED lens’ damage.
1.4 Pick & place tools are recommended for the remove of LEDs from the factory tape & reel
packaging
2. Pick & place nozzle
The pickup tool was recommended and shown as below
3. Lens handling
Please follow the guideline to pick LEDs.
3.1 Use tweezers to pick LEDs.
3.2 Do not touch the lens by using tweezers.
3.3 Do not touch lens with fingers.
3.4 Do not apply more than 4N (400gw) directly onto the lens.
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3535HP Series
Correct (  )
Wrong ( X )
1. Lens cleaning
In the case which a small amount of dirt and dust particles remain on the lens surface, a suitable
cleaning solution can be applied.
1.1 Try a gentle wiping with dust-free cloth.
1.2 If needed, use dust-free cloth and isopropyl alcohol to gently clean the dirt from the lens
surface.
1.3 Do not use other solvents as they may directly react with the LED assembly.
1.4 Do not use ultrasonic cleaning which will damage the LEDs.
2. Carrier tape handling
The following items are recommended when handling the carrier tape of LEDs.
2.1 Do not twist the carrier tape.
2.2 The inward bending diameter should not be smaller than 6cm for each carrier tape.
2.3 Do not bend the tape outward.
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3535HP Series
3. Storage
3.1 The moisture-proof bag is sealed:
The LEDs should be stored at 30°C or less and 90%RH or less. And the LEDs are limited to
use within one year, while the LEDs is packed in moisture-proof package with the
desiccants inside.
3.2 The moisture-proof bag is opened:
The LEDs should be stored at 30°C or less and 60%RH or less. Moreover, the LEDs are
limited to solder process within 168hrs. If the humidity indicator card shows the pink color in
10% even higher or exceed the storage limiting time since opened, that we recommended
to baking LEDs at 60°C at least 24hrs. To seal the remainder LEDs return to the
moisture-proof bag, it’s recommended to be with workable desiccants.
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3535HP Series
 Test Items and Results of Reliability
Test Item
Test Conditions
Duration/
Number of
Cycle
Damage
100 cycles
0/22
1000 hrs
0/22
1000 hrs
0/22
1000 hrs
0/22
1000 hrs
0/22
1000 hrs
0/22
1000 hrs
0/22
3 Times
0/22
Reference
–40℃ 30min
Thermal Shock
↑↓5min
AECQ101
125℃ 30min
High Temperature
Ta=100℃
Storage
Humidity Heat
Ta=85℃
Storage
RH=85%
Low Temperature
Ta=-40℃
Storage
Ta=25℃
Life Test
If=500mA
High Humidity Heat
85℃ RH=85%
Operation
If=500mA
High Temperature
Ta=85℃
Operation
If=500mA
ESD(HBM)
8KV at 1.5kΩ;100pf
EIAJ ED-4701
200 201
EIAJ ED-4701
100 103
EIAJ ED-4701
200 202
MIL-STD-883
Criteria for Judging the Damage
Item
Symbol
Condition
Forward Voltage
VF
Reverse Current
Luminous Intensity
Criteria for Judgment
Min
Max
If=500mA
_
USL1×1.1
IR
VR =5V
_
100μA
Iv
If=500mA
LSL2×0.7
_
Notes:
1. USL: Upper specification level
2. LSL: Lower specification level
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