TPS61161-Q1 www.ti.com......................................................................................................................................................................................... SLVSA18 – SEPTEMBER 2009 WHITE LED DRIVER WITH DIGITAL AND PWM BRIGHTNESS CONTROL FOR UP TO 10 LEDs IN SERIES Check for Samples: TPS61161-Q1 FEATURES 1 • • • • Qualified for Automotive Applications 2.7-V to 18-V Input Voltage Range 38-V Open LED Protection for 10 LEDs 200-mV Reference Voltage With ±2% Accuracy • • • • Flexible Digital and PWM Brightness Control Built-In Soft Start Up to 90% Efficiency 2-mm × 2-mm × 0.8-mm 6-pin QFN (DRV) Package With Thermal Pad DESCRIPTION With a 40-V rated integrated switch FET, the TPS61161 is a boost converter that drives up to 10 LEDs in series. The boost converter runs at 600-kHz fixed switching frequency to reduce output ripple, improve conversion efficiency, and allow for the use of small external components. The default white LED current is set with the external sensor resistor Rset, and the feedback voltage is regulated to 200 mV, as shown in the typical application. During the operation, the LED current can be controlled using the 1-wire digital interface ( EasyScale™ protocol) through the CTRL pin. Alternatively, a pulse width modulation (PWM) signal can be applied to the CTRL pin through which the duty cycle determines the feedback reference voltage. In either digital or PWM mode, the TPS61161 does not burst the LED current; therefore, it does not generate audible noises on the output capacitor. For maximum protection, the device features integrated open LED protection that disables the TPS61161 to prevent the output from exceeding the absolute maximum ratings during open LED conditions. The TPS61161 is available in a space-saving, 2-mm x 2-mm QFN (DRV) package with thermal pad. L1 22 mH VI 3 V to 18 V C1 1 mF TPS61161 ON/OFF DIMMING CONTROL VIN SW CTRL FB COMP GND C3 220 nF D1 C2 1 mF Rset 10 W L1: TDK VLCF5020T-220MR75-1 C1: Murata GRM188R61E105K C2: Murata GRM21BR71H105K D1: ONsemi MBR0540T1 20 mA Figure 1. Typical Application 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2009, Texas Instruments Incorporated TPS61161-Q1 SLVSA18 – SEPTEMBER 2009......................................................................................................................................................................................... www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION (1) TA PACKAGE –40°C to 125°C (1) (2) QFN – DRV (2) ORDERABLE PART NUMBER Reel of 3000 TPS61161QDRVRQ1 TOP-SIDE MARKING PSJQ For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) Supply voltage on VIN Voltage on CTRL VI (1) (2) (2) VALUE UNIT –0.3 to 20 V –0.3 to 20 V Voltage on FB and COMP (2) –0.3 to 3 V Voltage on SW (2) –0.3 to 40 V PD Continuous power dissipation TJ Operating junction temperature range –40 to 150 °C TSTG Storage temperature range –65 to 150 °C (1) (2) See Dissipation Rating Table Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values are with respect to network ground terminal. DISSIPATION RATINGS BOARD PACKAGE RθJC RθJA DERATING FACTOR ABOVE TA = 25°C TA < 25°C TA = 70°C TA = 125°C Low-K (1) DRV 100°C/W 291°C/W 7.1 mW/°C 887 mW 568 mW 175 mW 75°C/W 15.4 mW/°C 1925 mW 1232 mW 385 mW High-K (1) (2) (2) DRV The JEDEC low-K (1s) board used to derive this data was a 3in×3in, two-layer board with 2-ounce copper traces on top of the board. The JEDEC high-K (2s2p) board used to derive this data was a 3in×3in, multilayer board with 1-ounce internal power and ground planes and 2-ounce copper traces on top and bottom of the board. RECOMMENDED OPERATING CONDITIONS MIN TYP MAX UNIT VI Input voltage range, VIN 2.7 18 VO Output voltage range VIN 38 V L Inductor (1) 10 22 µH fdim PWM dimming frequency 5 100 kHz Duty PWM duty cycle resolution At 10 kHz 0.5 At 30 kHz 1.5 V % CIN Input capacitor CO Output capacitor (1) 0.47 10 µF TA Operating ambient temperature –40 125 °C (1) 2 1 µF These values are recommended values that have been successfully tested in several applications. Other values may be acceptable in other applications but should be fully tested by the user. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPS61161-Q1 TPS61161-Q1 www.ti.com......................................................................................................................................................................................... SLVSA18 – SEPTEMBER 2009 ELECTRICAL CHARACTERISTICS VIN = 3.6 V, CTRL = VIN, TA = –40°C to 125°C, typical values are at TA = 25°C (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT SUPPLY CURRENT VI Input voltage range, VIN IQ Operating quiescent current into VIN Device PWM switching no load 2.7 ISD Shutdown current CRTL = GND, VIN = 4.2 V UVLO Undervoltage lockout threshold VIN falling Vhys Undervoltage lockout hysteresis 2.2 18 V 1.8 mA 1 µA 2.5 V 70 mV ENABLE AND REFERENCE CONTROL V(CTRLh) CTRL logic high voltage VIN = 2.7 V to 18 V V(CTRLl) CTRL logic low voltage VIN = 2.7 V to 18 V R(CTRL) CTRL pull down resistor toff CTRL pulse width to shutdown 1.2 0.4 400 (1) tes_det EasyScale detection time tes_delay EasyScale detection delay tes_win EasyScale detection window time V 800 V 1600 kΩ CTRL high to low 2.5 ms CTRL pin low 260 µs Measured from CTRL high 100 µs 1 ms VOLTAGE AND CURRENT CONTROL VREF Voltage feedback regulation voltage 196 200 204 mV V(REF_PWM) Voltage feedback regulation voltage under brightness control VFB = 50 mV 47 50 53 mV VFB = 20 mV 17 20 23 IFB Voltage feedback input bias current VFB = 200 mV 2 µA fS Oscillator frequency 500 600 700 kHz Dmax Maximum duty cycle 90 93 tmin_on Minimum on pulse width Isink Comp pin sink current Isource Comp pin source current Gea Error amplifier transconductance Rea Error amplifier output resistance fea Error amplifier crossover frequency VFB = 100 mV % 40 ns 100 µA 100 240 320 µA 400 µmho 6 MΩ 5 pF connected to COMP 500 kHz VIN = 3.6 V 0.3 POWER SWITCH RDS(on) ILN_NFET N-channel MOSFET on-resistance VIN = 3.0 V N-channel leakage current VSW = 35 V, TA = 25°C ILIM N-Channel MOSFET current limit D = Dmax ILIM_Start Start up current limit D = Dmax tHalf_LIM Time step for half current limit Vovp Open LED protection threshold 0.6 0.7 Ω 1 µA 0.84 A OC and OLP V(FB_OVP) 0.56 0.7 0.4 A 5 37 Open LED protection threshold on FB Measured on the FB pin, percentage of Vref, Vref = 200 mV and 20 mV 38 ms 39 V 50% tREF VREF filter time constant 180 µs tstep VREF ramp up time 213 µs (1) To select EasyScale mode, the CTRL pin must be low for more than tes_det during tes_win Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPS61161-Q1 3 TPS61161-Q1 SLVSA18 – SEPTEMBER 2009......................................................................................................................................................................................... www.ti.com ELECTRICAL CHARACTERISTICS (continued) VIN = 3.6 V, CTRL = VIN, TA = –40°C to 125°C, typical values are at TA = 25°C (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT EasyScale TIMING tstart Start time of program stream 2 tEOS End time of program stream 2 360 µs tH_LB High time low bit Logic 0 2 180 µs tL_LB Low time low bit Logic 0 2 × tH_LB 360 µs tH_HB High time high bit Logic 1 2 × tL_HB 360 µs tL_HB Low time high bit Logic 1 2 180 µs VACKNL Acknowledge output voltage low Open drain, Rpullup =15 kΩ to VIN 0.4 V 2 µs 512 µs tvalACKN Acknowledge valid time See (2) tACKN Duration of acknowledge condition See (2) µs THERMAL SHUTDOWN Tshutdown Thermal shutdown threshold Thysteresis Thermal shutdown threshold hysteresis (2) 4 160 °C 15 °C Acknowledge condition active 0, this condition will only be applied in case the RFA bit is set. Open drain output, line needs to be pulled high by the host with resistor load. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPS61161-Q1 TPS61161-Q1 www.ti.com......................................................................................................................................................................................... SLVSA18 – SEPTEMBER 2009 DEVICE INFORMATION TOP VIEW FB COMP GND VIN Thermal Pad CTRL SW 6-PIN 2mm x 2mm x 0.8mm QFN TERMINAL FUNCTIONS TERMINAL NAME NO. I/O DESCRIPTION VIN 6 I The input supply pin for the IC. Connect VIN to a supply voltage between 2.7V and 18V. SW 4 I This is the switching node of the IC. Connect the inductor between the VIN and SW pin. This pin is also used to sense the output voltage for open LED protection GND 3 O Ground FB 1 I Feedback pin for current. Connect the sense resistor from FB to GND. COMP 2 O Output of the transconductance error amplifier. Connect an external capacitor to this pin to compensate the regulator. CTRL 5 I Control pin of the boost regulator. It is a multi-functional pin which can be used for enable control, PWM and digital dimming. Thermal Pad The thermal pad should be soldered to the analog ground plane. If possible, use thermal via to connect to ground plane for ideal power dissipation. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPS61161-Q1 5 TPS61161-Q1 SLVSA18 – SEPTEMBER 2009......................................................................................................................................................................................... www.ti.com FUNCTIONAL BLOCK DIAGRAM C2 D1 1 Rset 4 L1 FB SW Reference Control Error Amplifer OLP Vin 6 COMP 2 C1 PWM Control C3 5 CTRL Soft Start-up Ramp Generator + Current Sensor Oscillator GND 3 6 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPS61161-Q1 TPS61161-Q1 www.ti.com......................................................................................................................................................................................... SLVSA18 – SEPTEMBER 2009 TYPICAL CHARACTERISTICS TABLE OF GRAPHS FIGURE Efficiency TPS61161 VIN = 3.6 V; 4, 6, 8, 10 LEDs; L = 22 µH Figure 2 Efficiency TPS61161 Figure 3 Current limit TA = 25°C Figure 4 Current limit Figure 5 EasyScale step Figure 6 PWM dimming linearity VIN = 3.6 V; PWM Freq = 10 kHz and 40 kHz Figure 6 Output ripple at PWM dimming 8 LEDs; VIN = 3.6 V; ILOAD = 20 mA; PWM Freq = 10 kHz Figure 8 Switching waveform 8 LEDs; VIN = 3.6 V; ILOAD = 20 mA; L = 22 µH Figure 9 Start-up 8 LEDs; VIN = 3.6 V; ILOAD = 20 mA; L =22 µH Figure 10 Open LED protection 8 LEDs; VIN = 3.6 V; ILOAD = 20 mA; L = 22 µH Figure 11 EFFICIENCY vs OUTPUT CURRENT EFFICIENCY vs OUTPUT CURRENT 100 100 VI = 3.6 V 4 LEDs VI = 12 V 6 LEDs 90 90 8 LEDs 80 Efficiency - % Efficiency - % 80 10 LEDs 70 60 VI = 5 V VI = 3.6 V 70 60 4 (12.8 V), 6 (19.2 V) LEDs 8 (25.6 V),10 (32 V) LEDs 50 50 10 LEDs - TPS61161 40 40 10 20 30 Output Current - mA 40 50 0 20 30 Output Current - mA Figure 3. SWITCH CURRENT LIMIT vs DUTY CYCLE SWITCH CURRENT LIMIT vs TEMPERATURE 1000 1000 900 900 800 700 600 500 40 50 800 700 600 500 400 400 300 20 10 Figure 2. Switch Current Limit - mA Switch Current Limit - mA 0 30 40 50 60 Duty Cycle - % 70 80 90 300 -40 -20 Figure 4. 0 20 40 60 80 Temperature - °C 100 120 140 Figure 5. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPS61161-Q1 7 TPS61161-Q1 SLVSA18 – SEPTEMBER 2009......................................................................................................................................................................................... www.ti.com FB VOLTAGE vs EASYSCALE STEP FB VOLTAGE vs PWM DUTY CYCLE 200 200 10 kHz, 40 kHz 180 160 160 FB Voltage - mV FB Voltage - mV 140 120 100 80 120 80 60 40 40 20 0 0 2 4 6 8 10 12 14 16 18 20 22 24 26 Easy Scale Step Step 28 30 32 0 0 20 40 60 PWM Duty Cycle - % Figure 6. Figure 7. OUTPUT RIPPLE at PWM DIMMING SWITCHING WAVEFORM 80 100 PWM 2 V/div SW 20 V/div VOUT 20 mV/div AC VOUT 20 mV/div AC IL 200 mA/div ILED 10 mA/div t - 1 ms/div t - 100 ms/div Figure 8. Figure 9. START-UP OPEN LED PROTECTION CTRL 5 V/div OPEN LED 5 V/div FB 200 mV/div VOUT 10 V/div VOUT 10 V/div COMP 500 mV/div IL 200 mA/div IL 200 mA/div t - 2 ms/div t - 100 ms/div Figure 10. 8 Figure 11. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPS61161-Q1 TPS61161-Q1 www.ti.com......................................................................................................................................................................................... SLVSA18 – SEPTEMBER 2009 DETAILED DESCRIPTION OPERATION The TPS61161 is a high efficiency, high output voltage boost converter in small package size, The device is ideal for driving up to 10 white LED in series. The serial LED connection provides even illumination by sourcing the same output current through all LEDs, eliminating the need for expensive factory calibration. The device integrates 40-V/0.7-A switch FET and operates in pulse width modulation (PWM) with 600kHz fixed switching frequency. For operation see the block diagram. The duty cycle of the converter is set by the error amplifier output and the current signal applied to the PWM control comparator. The control architecture is based on traditional current-mode control; therefore, a slope compensation is added to the current signal to allow stable operation for duty cycles larger than 50%. The feedback loop regulates the FB pin to a low reference voltage (200mV typical), reducing the power dissipation in the current sense resistor. SOFT START-UP Soft-start circuitry is integrated into the IC to avoid a high inrush current during start-up. After the device is enabled, the voltage at FB pin ramps up to the reference voltage in 32 steps, each step takes 213 µs. This ensures that the output voltage rises slowly to reduce the input current. Additionally, for the first 5 ms after the COMP voltage ramps, the current limit of the switch is set to half of the normal current limit spec. During this period, the input current is kept below 400 mA (typical). See the start-up waveform of a typical example, Figure 10. OPEN LED PROTECTION Open LED protection circuitry prevents IC damage as the result of white LED disconnection. The TPS61161 monitors the voltage at the SW pin and FB pin during each switching cycle. The circuitry turns off the switch FET and shuts down the IC as soon as the SW voltage exceeds the Vovp threshold and the FB voltage is less than half of regulation voltage for 8 clock cycles. As a result, the output voltage falls to the level of the input supply. The device remains in shutdown mode until it is enabled by toggling the CTRL pin logic. To allow the use of inexpensive low-voltage output capacitor, the TPS61161 has different open lamp protection thresholds to prevent the internal 40V FET from breaking down. The threshold is set at 38 V. The devices can be selected according to the number of external LEDs and their maximum forward voltage. SHUTDOWN The TPS61161 enters shutdown mode when the CTRL voltage is logic low for more than 2.5 ms. During shutdown, the input supply current for the device is less than 1 µA (max). Although the internal FET does not switch in shutdown, there is still a dc current path between the input and the LEDs through the inductor and Schottky diode. The minimum forward voltage of the LED array must exceed the maximum input voltage to ensure that the LEDs remain off in shutdown. However, in the typical application with two or more LEDs, the forward voltage is large enough to reverse bias the Schottky and keep leakage current low. CURRENT PROGRAM The FB voltage is regulated by a low 0.2V reference voltage. The LED current is programmed externally using a current-sense resistor in series with the LED string. The value of the RSET is calculated using Equation 1: V I LED + FB RSET (1) Where ILED = output current of LEDs VFB = regulated voltage of FB RSET = current sense resistor The output current tolerance depends on the FB accuracy and the current sensor resistor accuracy. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPS61161-Q1 9 TPS61161-Q1 SLVSA18 – SEPTEMBER 2009......................................................................................................................................................................................... www.ti.com LED BRIGHTNESS DIMMING MODE SELECTION The CTRL pin is used for the control input for both dimming modes, PWM dimming and 1 wire dimming. The dimming mode for the TPS61161 is selected each time the device is enabled. The default dimming mode is PWM dimming. To enter the 1 wire mode, the following digital pattern on the CTRL pin must be recognized by the IC every time the IC starts from the shutdown mode. 1. Pull CTRL pin high to enable the TPS61161, and to start the 1 wire detection window. 2. After the EasyScale detection delay (tes_delay, 100 µs) expires, drive CTRL low for more than the EasyScale detection time (tes_detect, 260 µs). 3. The CTRL pin has to be low for more than EasyScale detection time before the EasyScale detection window (tes_win, 1 ms) expires. EasyScale detection window starts from the first CTRL pin low to high transition. The IC immediately enters the 1-wire mode once the above three conditions are met. The EasyScale communication can start before the detection window expires. Once the dimming mode is programmed, it can not be changed without another start up. This means the IC needs to be shutdown by pulling the CTRL low for 2.5 ms and restarts. See the Dimming Mode Detection and Soft Start (Figure 12) for a graphical explanation. Insert battery PWM signal high CTRL low PWM mode Startup delay FB ramp Shutdown delay 200mV x duty cycle FB t Insert battery Enter ES mode Enter ES mode Timing window Programming code Programming code high CTRL low ES detect time ES mode ES detect delay Shutdown delay IC Shutdown Programmed value (if not programmed, 200mV default ) FB FB ramp FB ramp Startup delay 50mV Startup delay 50mV Figure 12. Dimming Mode Detection and Soft Start PWM Brightness Dimming PWM BRIGHTNESS DIMMING When the CTRL pin is constantly high, the FB voltage is regulated to 200 mV typically. However, the CTRL pin allows a PWM signal to reduce this regulation voltage; therefore, it achieves LED brightness dimming. The relationship between the duty cycle and FB voltage is given by Equation 2. V FB + Duty 200 mV (2) Where Duty = duty cycle of the PWM signal 200 mV = internal reference voltage As shown in Figure 13, the IC chops up the internal 200-mV reference voltage at the duty cycle of the PWM signal. The pulse signal is then filtered by an internal low pass filter. The output of the filter is connected to the error amplifier as the reference voltage for the FB pin regulation. Therefore, although a PWM signal is used for brightness dimming, only the WLED dc current is modulated, which is often referred as analog dimming. This eliminates the audible noise which often occurs when the LED current is pulsed in replica of the frequency and duty cycle of PWM control. Unlike other scheme which filters the PWM signal for analog dimming, TPS61161 regulation voltage is independent of the PWM logic voltage level which often has large variations. 10 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPS61161-Q1 TPS61161-Q1 www.ti.com......................................................................................................................................................................................... SLVSA18 – SEPTEMBER 2009 For optimum performance, use the PWM dimming frequency in the range of 5 kHz to 100 kHz. The requirement of minimum dimming frequency comes from the EasyScale detection delay and detection time specification in the dimming mode selection. Since the CTRL pin is logic only pin, adding external RC filter applied to the pin does not work. VBG 200 mV CTRL Error Amplifier FB Figure 13. Block Diagram of Programmable FB Voltage Using PWM Signal To use lower PWM dimming, add an external RC network connected to the FB pin as shown in the additional typical application (Figure 18). DIGITAL 1 WIRE BRIGHTNESS DIMMING The CTRL pin features a simple digital interface to allow digital brightness control. The digital dimming can save the processor power and battery life as it does not require a PWM signal all the time, and the processor can enter idle mode if available. The TPS61161 adopts the EasyScale™ protocol for the digital dimming, which can program the FB voltage to any of the 32 steps with single command. The step increment increases with the voltage to produce pseudo logarithmic curve for the brightness step. See the Table 1 for the FB pin voltage steps. The default step is full scale when the device is first enabled (VFB = 200 mV). The programmed reference voltage is stored in an internal register. A power reset clears the register value and reset it to default. EasyScale™: 1-WIRE DIGITAL DIMMING EasyScale is a simple but flexible one-pin interface to configure the FB voltage. The interface is based on a master-slave structure, where the master is typically a microcontroller or application processor. Figure 14 and Table 2 give an overview of the protocol. The protocol consists of a device specific address byte and a data byte. The device specific address byte is fixed to 72 hex. The data byte consists of five bits for information, two address bits, and the RFA bit. The RFA bit set to high indicates the Request for Acknowledge condition. The Acknowledge condition is only applied if the protocol was received correctly. The advantage of EasyScale compared with other on pin interfaces is that its bit detection is in a large extent independent from the bit transmission rate. It can automatically detect bit rates between 1.7 kbit/s and up to 160 kbit/s. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPS61161-Q1 11 TPS61161-Q1 SLVSA18 – SEPTEMBER 2009......................................................................................................................................................................................... www.ti.com Table 1. Selectable FB Voltage FB voltage (mV) D4 D3 D2 D1 D0 0 0 0 0 0 0 0 1 5 0 0 0 0 1 2 8 0 0 0 1 0 3 11 0 0 0 1 1 4 14 0 0 1 0 0 5 17 0 0 1 0 1 6 20 0 0 1 1 0 7 23 0 0 1 1 1 8 26 0 1 0 0 0 9 29 0 1 0 0 1 10 32 0 1 0 1 0 11 35 0 1 0 1 1 12 38 0 1 1 0 0 13 44 0 1 1 0 1 14 50 0 1 1 1 0 15 56 0 1 1 1 1 16 62 1 0 0 0 0 17 68 1 0 0 0 1 18 74 1 0 0 1 0 19 80 1 0 0 1 1 20 86 1 0 1 0 0 21 92 1 0 1 0 1 22 98 1 0 1 1 0 23 104 1 0 1 1 1 24 116 1 1 0 0 0 25 128 1 1 0 0 1 26 140 1 1 0 1 0 27 152 1 1 0 1 1 28 164 1 1 1 0 0 29 176 1 1 1 0 1 30 188 1 1 1 1 0 31 200 1 1 1 1 1 DATA IN DATABYTE Device Address Start Start DA7 DA6 DA5 DA4 DA3 DA2 DA1 0 1 1 1 0 0 1 DA0 EOS Start RFA 0 A1 A0 D4 D3 D2 D1 D0 EOS DATA OUT ACK Figure 14. EasyScale Protocol Overview 12 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPS61161-Q1 TPS61161-Q1 www.ti.com......................................................................................................................................................................................... SLVSA18 – SEPTEMBER 2009 Table 2. EasyScale Bit Description BYTE Device Address Byte 72 hex Data byte BIT NUMBER NAME TRANSMISSION DIRECTION 7 DA7 0 MSB device address 6 DA6 1 5 DA5 1 4 DA4 3 DA3 2 DA2 0 1 DA1 1 DESCRIPTION 1 IN 0 0 DA0 0 LSB device address 7 (MSB) RFA Request for acknowledge. If high, acknowledge is applied by device 6 A1 0 Address bit 1 5 A0 0 Address bit 0 4 D4 3 D3 2 D2 Data bit 2 1 D1 Data bit 1 0 (LSB) D0 Data bit 0 Data bit 4 IN ACK Data bit 3 Acknowledge condition active 0, this condition will only be applied in case RFA bit is set. Open drain output, Line needs to be pulled high by the host with a pullup resistor. This feature can only be used if the master has an open drain output stage. In case of a push pull output stage Acknowledge condition may not be requested! OUT Easy Scale Timing, without acknowledge RFA = 0 t Start DATA IN t Start Address Byte DATA Byte Static High Static High DA7 0 DA0 0 D0 1 RFA 0 TEOS TEOS Easy Scale Timing, with acknowledge RFA = 1 t Start DATA IN t Start Address Byte DATA Byte Static High Static High DA7 0 DA0 0 TEOS RFA 1 D0 1 Controller needs to Pullup Data Line via a resistor to detect ACKN DATA OUT tLow Low Bit (Logic 0) t High tLOW t valACK ACKN t ACKN Acknowledge true, Data Line pulled down by device Acknowledge false, no pull down tHigh High Bit (Logic 1) Figure 15. EasyScale™— Bit Coding Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPS61161-Q1 13 TPS61161-Q1 SLVSA18 – SEPTEMBER 2009......................................................................................................................................................................................... www.ti.com All bits are transmitted MSB first and LSB last. Figure 15 shows the protocol without acknowledge request (Bit RFA = 0), Figure 15 with acknowledge (Bit RFA = 1) request. Prior to both bytes, device address byte and data byte, a start condition must be applied. For this, the CTRL pin must be pulled high for at least tstart (2 µs) before the bit transmission starts with the falling edge. If the CTRL pin is already at high level, no start condition is needed prior to the device address byte. The transmission of each byte is closed with an End of Stream condition for at least tEOS (2 µs). The bit detection is based on a Logic Detection scheme, where the criterion is the relation between tLOW and tHIGH. It can be simplified to: High Bit: tHIGH > tLOW, but with tHIGH at least 2x tLOW, see Figure 15. Low Bit: tHIGH < tLOW, but with tLOW at least 2x tHIGH, see Figure 15. The bit detection starts with a falling edge on the CTRL pin and ends with the next falling edge. Depending on the relation between tHIGH and tLOW, the logic 0 or 1 is detected. The acknowledge condition is only applied if: • Acknowledge is requested by a set RFA bit. • The transmitted device address matches with the device address of the device. • 16 bits is received correctly. If the device turns on the internal ACKN-MOSFET and pulls the CTRL pin low for the time tACKN, which is 512 µs maximum then the Acknowledge condition is valid after an internal delay time tvalACK. This means that the internal ACKN-MOSFET is turned on after tvalACK, when the last falling edge of the protocol was detected. The master controller keeps the line low in this period. The master device can detect the acknowledge condition with its input by releasing the CTRL pin after tvalACK and read back a logic 0. The CTRL pin can be used again after the acknowledge condition ends. Note that the acknowledge condition may only be requested in case the master device has an open drain output. For a push-pull output stage, the use a series resistor in the CRTL line to limit the current to 500 µA is recommended to for such cases as: • an accidentally requested acknowledge • to protect the internal ACKN-MOSFET UNDERVOLTAGE LOCKOUT An undervoltage lockout prevents operation of the device at input voltages below typical 2.2 V. When the input voltage is below the undervoltage threshold, the device is shutdown and the internal switch FET is turned off. If the input voltage rises by undervoltage lockout hysteresis, the IC restarts. THERMAL SHUTDOWN An internal thermal shutdown turns off the device when the typical junction temperature of 160°C is exceeded. The device is released from shutdown automatically when the junction temperature decreases by 15°C. 14 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPS61161-Q1 TPS61161-Q1 www.ti.com......................................................................................................................................................................................... SLVSA18 – SEPTEMBER 2009 APPLICATION INFORMATION MAXIMUM OUTPUT CURRENT The overcurrent limit in a boost converter limits the maximum input current and thus maximum input power for a given input voltage. Maximum output power is less than maximum input power due to power conversion losses. Therefore, the current limit setting, input voltage, output voltage and efficiency can all change maximum current output. The current limit clamps the peak inductor current; therefore, the ripple has to be subtracted to derive maximum dc current. The ripple current is a function of switching frequency, inductor value and duty cycle. The following equations take into account of all the above factors for maximum output current calculation. 1 IP = é 1 1 ù + )ú êL ´ Fs ´ ( Vout + Vf - Vin Vin û ë (3) Where: Ip = inductor peak to peak ripple L = inductor value Vf = Schottky diode forward voltage Fs = switching frequency Vout = output voltage of the boost converter. It is equal to the sum of VFB and the voltage drop across LEDs. I out_max + Vin ǒI lim * I Pń2Ǔ h Vout (4) Where: Iout_max = maximum output current of the boost converter Ilim = over current limit η = efficiency For instance, when VIN is 3.0 V, 8 LEDs output equivalent to VOUT of 26 V, the inductor is 22 µH, the Schottky forward voltage is 0.2 V; and then the maximum output current is 65 mA in typical condition. When VIN is 5 V, 10 LEDs output equivalent to VOUT of 32 V, the inductor is 22 µH, the Schottky forward voltage is 0.2 V; and then the maximum output current is 85 mA in typical condition. INDUCTOR SELECTION The selection of the inductor affects steady state operation as well as transient behavior and loop stability. These factors make it the most important component in power regulator design. There are three important inductor specifications, inductor value, dc resistance and saturation current. Considering inductor value alone is not enough. The inductor value determines the inductor ripple current. Choose an inductor that can handle the necessary peak current without saturating, according to half of the peak-to-peak ripple current given by Equation 3, pause the inductor dc current given by: I in_DC + Vout Iout Vin h (5) Inductor values can have ±20% tolerance with no current bias. When the inductor current approaches saturation level, its inductance can decrease 20% to 35% from the 0-A value depending on how the inductor vendor defines saturation current. Using an inductor with a smaller inductance value forces discontinuous PWM when the inductor current ramps down to zero before the end of each switching cycle. This reduces the boost converter’s maximum output current, causes large input voltage ripple and reduces efficiency. Large inductance value provides much more output current and higher conversion efficiency. For these reasons, a 10-µH to 22-µH inductor value range is recommended. A 22-µH inductor optimized the efficiency for most application while maintaining low inductor peak to peak ripple. Table 3 lists the recommended inductor for the TPS61161. When recommending inductor value, the factory has considered –40% and +20% tolerance from its nominal value. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPS61161-Q1 15 TPS61161-Q1 SLVSA18 – SEPTEMBER 2009......................................................................................................................................................................................... www.ti.com TPS61161 has built-in slope compensation to avoid sub-harmonic oscillation associated with current mode control. If the inductor value is lower than 10 µH, the slope compensation may not be adequate, and the loop can be unstable. Therefore, customers need to verify the inductor in their application if it is different from the recommended values. Table 3. Recommended Inductors for TPS61161 PART NUMBER L (µH) DCR MAX (Ω) SATURATION CURRENT (mA) SIZE (L × W × H mm) VENDOR LQH3NPN100NM0 10 0.3 750 3×3×1.5 Murata VLCF5020T-220MR75-1 22 0.4 750 5×5×2.0 TDK CDH3809/SLD 10 0.3 570 4×4×1.0 Sumida A997AS-220M 22 0.4 510 4×4×1.8 TOKO SCHOTTKY DIODE SELECTION The high switching frequency of the TPS61161 demands a high-speed rectification for optimum efficiency. Ensure that the diode average and peak current rating exceeds the average output current and peak inductor current. In addition, the diode’s reverse breakdown voltage must exceed the open LED protection voltage. The ONSemi MBR0540 and the ZETEX ZHCS400 are recommended for TPS61161. COMPENSATION CAPACITOR SELECTION The compensation capacitor C3 (see the block diagram), connected from COMP pin to GND, is used to stabilize the feedback loop of the TPS61161. Use a 220-nF ceramic capacitor for C3. INPUT AND OUTPUT CAPACITOR SELECTION The output capacitor is mainly selected to meet the requirements for the output ripple and loop stability. This ripple voltage is related to the capacitor’s capacitance and its equivalent series resistance (ESR). Assuming a capacitor with zero ESR, the minimum capacitance needed for a given ripple can be calculated by C out + ǒV out * V inǓ Iout Vout Fs V ripple (6) where, Vripple = peak-to-peak output ripple. The additional output ripple component caused by ESR is calculated using: V ripple_ESR + I out RESR (7) Due to its low ESR, Vripple_ESR can be neglected for ceramic capacitors, but must be considered if tantalum or electrolytic capacitors are used. Care must be taken when evaluating a ceramic capacitor’s derating under dc bias, aging, and ac signal. For example, larger form factor capacitors (in 1206 size) have a resonant frequencies in the range of the switching frequency. So the effective capacitance is significantly lower. The dc bias can also significantly reduce capacitance. Ceramic capacitors can loss as much as 50% of its capacitance at its rated voltage. Therefore, leave the margin on the voltage rating to ensure adequate capacitance at the required output voltage. The capacitor in the range of 1 µF to 4.7 µF is recommended for input side. The output requires a capacitor in the range of 0.47 µF to 10 µF. The output capacitor affects the loop stability of the boost regulator. If the output capacitor is below the range, the boost regulator can potentially become unstable. For example, if use the output capacitor of 0.1 µF, a 470 nF compensation capacitor has to be used for the loop stable. The popular vendors for high value ceramic capacitors are: TDK (http://www.component.tdk.com/components.php) Murata (http://www.murata.com/cap/index.html) 16 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPS61161-Q1 TPS61161-Q1 www.ti.com......................................................................................................................................................................................... SLVSA18 – SEPTEMBER 2009 LAYOUT CONSIDERATIONS As for all switching power supplies, especially those high frequency and high current ones, layout is an important design step. If layout is not carefully done, the regulator could suffer from instability as well as noise problems. To reduce switching losses, the SW pin rise and fall times are made as short as possible. To prevent radiation of high frequency resonance problems, proper layout of the high frequency switching path is essential. Minimize the length and area of all traces connected to the SW pin and always use a ground plane under the switching regulator to minimize inter-plane coupling. The loop including the PWM switch, Schottky diode, and output capacitor, contains high current rising and falling in nanosecond and should be kept as short as possible. The input capacitor needs not only to be close to the VIN pin, but also to the GND pin in order to reduce the IC supply ripple. Figure 16 shows a sample layout. C1 Rset Vin LEDs Out Vin FB L1 CTRL COMP CTRL GND SW C3 C2 GND Place enough VIAs around thermal pad to enhance thermal performance LEDs IN Minimize the area of this trace Figure 16. Sample Layout THERMAL CONSIDERATIONS The maximum IC junction temperature should be restricted to 125°C under normal operating conditions. This restriction limits the power dissipation of the TPS61161. Calculate the maximum allowable dissipation, PD(max), and keep the actual dissipation less than or equal to PD(max). The maximum-power-dissipation limit is determined using Equation 8: P D(max) + 125°C * T A RqJA (8) where, TA is the maximum ambient temperature for the application. RθJA is the thermal resistance junction-to-ambient given in Power Dissipation Table. The TPS61161 comes in a thermally enhanced QFN package. This package includes a thermal pad that improves the thermal capabilities of the package. The RθJA of the QFN package greatly depends on the PCB layout and thermal pad connection. The thermal pad must be soldered to the analog ground on the PCB. Using thermal vias underneath the thermal pad as illustrated in the layout example. Also see the QFN/SON PCB Attachment application report (SLUA271). Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPS61161-Q1 17 TPS61161-Q1 SLVSA18 – SEPTEMBER 2009......................................................................................................................................................................................... www.ti.com ADDITIONAL TYPICAL APPLICATIONS L1 10 mH Vin 3 V to 5 V C1 1 mF D1 C2 0.47 mF TPS61160 (TBD) ON/OFF DIMMING CONTROL VIN SW CTRL FB COMP GND Rset 10 W C3 220 nF 20 mA L1: Murata LQH3NPN100NM0 C1: Murata GRM188R61A105K C2: Murata GRM188R61E474K D1: ONsemi MBR0540T1 Figure 17. Li-Ion Driver for 6 White LEDs C1 1 mF L1 10 mH D1 TPS61160 (TBD) C2 0.47 mF ON/OFF DIMMING CONTROL VIN SW CTRL FB 10 kW COMP GND 80 kW C3 220 nF Rset 10 W 100 kW L1: Murata LQH3NPN100NM0 C1: Murata GRM188R61A105K C2: Murata GRM188R61E474K D1: ONsemi MBR0540T1 0.1 mF PWM Signal: 1.8 V; 200 Hz LED Current = 1.8 V x (1 - d)/ (8 x Rset) Figure 18. Li-Ion Driver for 6 White LEDs With External PWM Dimming Network L1 22 mH Vin 3 V to 5 V C1 1 mF D1 C2 1 mF TPS61161 ON/OFF DIMMING CONTROL VIN SW CTRL FB COMP GND C3 220 nF Rset 10 W L1: TDK VLCF5020T-220MR75-1 C1: Murata GRM188R61A105K C2: Murata GRM21BR71H105K D1: ONsemi MBR0540T1 20mA Figure 19. Li-Ion Driver for 8 White LEDs 18 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPS61161-Q1 PACKAGE OPTION ADDENDUM www.ti.com 6-Oct-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing TPS61161QDRVRQ1 ACTIVE SON DRV Pins Package Eco Plan (2) Qty 6 3000 Green (RoHS & no Sb/Br) Lead/Ball Finish CU NIPDAU MSL Peak Temp (3) Level-2-260C-1 YEAR (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF TPS61161-Q1 : • Catalog: TPS61161 NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 1-Jun-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device TPS61161QDRVRQ1 Package Package Pins Type Drawing SON DRV 6 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 3000 180.0 8.4 Pack Materials-Page 1 2.3 B0 (mm) K0 (mm) P1 (mm) 2.3 1.15 4.0 W Pin1 (mm) Quadrant 8.0 Q2 PACKAGE MATERIALS INFORMATION www.ti.com 1-Jun-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPS61161QDRVRQ1 SON DRV 6 3000 210.0 185.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap Wireless Connectivity www.ti.com/wirelessconnectivity TI E2E Community Home Page e2e.ti.com Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2012, Texas Instruments Incorporated