SD12CT1 D

SD12CT1
Transient Voltage
Suppressor
Bi−directional ESD Protection
with Ultra Low Clamping Voltage
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The SD12C is designed to protect voltage sensitive components from
ESD and transient voltage events. Excellent clamping capability, low
leakage, and fast response time, make this part ideal for ESD protection
on designs where board space is at a premium. Because of its small size, it
is suited for use in cellular phones, portable devices, digital cameras,
power supplies and many other portable applications.
Specification Features:
•
•
•
•
•
•
•
•
Peak Power − 350 W (8 20 ms)
Low Leakage
Low Clamping Voltage
Small Package for use in Portable Electronics
Meets IEC61000−4−2 Level 4
Meets IEC6100−4−4 Level 4
Meets 16 kV Human Body Model ESD Requirements
Pb−Free Package is Available
2
1
SOD−323
CASE 477
STYLE 1
MARKING DIAGRAM
Mechanical Characteristics:
CASE: Void-free, transfer-molded, thermosetting plastic
ZK M G
G
Epoxy Meets UL 94, V−0
MOUNTING POSITION: Any
QUALIFIED MAX REFLOW TEMPERATURE: 260°C
ZK = Specific Device Code
M = Date Code*
G = Pb−Free Package
Device Meets MSL 1 Requirements
Replace the “T1” with “T3” in the Device Number to order the
13 inch/10,000 unit reel.
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
ORDERING INFORMATION
Package
Shipping †
SD12CT1
SOD−323
3000/Tape & Reel
SD12CT1G
SOD−323
(Pb−Free)
3000/Tape & Reel
Device
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2007
February, 2007 − Rev. 1
1
Publication Order Number:
SD12CT1/D
SD12CT1
MAXIMUM RATINGS
Rating
Peak Power Dissipation @ 20 ms @ TL ≤ 25°C
IEC 61000−4−2 (ESD)
Symbol
Value
Unit
Ppk
350
W
±30
±30
kV
40
A
200
1.5
mW
mW/°C
RqJA
635
°C/W
TJ, Tstg
−65 to +150
°C
TL
260
°C
Air
Contact
IEC 61000−4−4 (EFT)
Total Device Dissipation FR−5 Board,
(Note 1) @ TA = 25°C
Derate above 25°C
PD
Thermal Resistance from Junction−to−Ambient
Junction and Storage Temperature Range
Lead Solder Temperature − Maximum (10 Second Duration)
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Minimum Solder Footprint.
ELECTRICAL CHARACTERISTICS
I
(TA = 25°C unless otherwise noted)
Symbol
IPP
Parameter
IPP
Maximum Reverse Peak Pulse Current
VC
Clamping Voltage @ IPP
VRWM
IR
VBR
IT
QVBR
IT
VC VBR VRWM IR
IR V
RWM VBR VC
IT
Working Peak Reverse Voltage
V
Maximum Reverse Leakage Current @ VRWM
Breakdown Voltage @ IT
IPP
Test Current
Bi−Directional TVS
Maximum Temperature Variation of VBR
ELECTRICAL CHARACTERISTICS (TJ = 25°C, unless otherwise specified)
Parameter
Reverse Working Voltage
Breakdown Voltage
Reverse Leakage Current
Clamping Voltage
Additional Clamping Voltage
Maximum Peak Pulse Current
Capacitance
Conditions
Symbol
(Note 2)
VRWM
IT = 1 mA, (Note 3)
VBR
Min
Typ
Max
Unit
12
V
13.3
V
VRWM = 12 V
IR
1.0
mA
IPP = 5 A, (8 x 20 msec Waveform)
IPP = 15 A, (8 x 20 msec Waveform)
VC
19
24
V
8 x 20 msec Waveform
IPP
15
VR = 0 V, f = 1 MHz
Cj
VR = 12 V, f = 1 MHz
64
A
pF
36
2. TVS devices are normally selected according to the working peak reverse voltage (VRWM), which should be equal or greater than the DC
or continuous peak operating voltage level.
3. VBR is measured at pulse test current IT.
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2
SD12CT1
PACKAGE DIMENSIONS
SOD−323
CASE 477−02
ISSUE G
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. LEAD THICKNESS SPECIFIED PER L/F DRAWING
WITH SOLDER PLATING.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
5. DIMENSION L IS MEASURED FROM END OF
RADIUS.
HE
D
b
1
2
E
MILLIMETERS
DIM MIN
NOM MAX
A
0.80
0.90
1.00
A1 0.00
0.05
0.10
A3
0.15 REF
b
0.25
0.32
0.4
C 0.089
0.12 0.177
D
1.60
1.70
1.80
E
1.15
1.25
1.35
L
0.08
HE
2.30
2.50
2.70
A3
A
C
NOTE 3
L
NOTE 5
A1
INCHES
NOM MAX
0.035 0.040
0.002 0.004
0.006 REF
0.010 0.012 0.016
0.003 0.005 0.007
0.062 0.066 0.070
0.045 0.049 0.053
0.003
0.090 0.098 0.105
MIN
0.031
0.000
STYLE 1:
PIN 1. CATHODE
2. ANODE
SOLDERING FOOTPRINT*
0.63
0.025
0.83
0.033
1.60
0.063
2.85
0.112
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
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Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
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USA/Canada
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Phone: 421 33 790 2910
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Phone: 81−3−5773−3850
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3
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
SD12CT1/D