SD05C THRU SD24C Single Line TVS Diode for ESD Protection in Portable Electronics PRELIMINARY PROTECTION PRODUCTS Description Features u 350 Watts peak pulse power (tp = 8/20µs) u Transient protection for data lines to The SDxxC TVS diodes are designed to replace multilayer varistors (MLVs) in portable applications such as cell phones, notebook computers, and PDAs. They offer superior electrical characteristics such as lower clamping voltage and no device degradation when compared to MLVs. The SDxxC series TVS diodes are designed to protect sensitive semiconductor components from damage or upset due to electrostatic discharge (ESD) and other voltage induced transient events. u u u u u u u The SDxxC is in a SOD-323 package and will protect one bidirectional line. They are available with working voltages of 5 - 24 volts. These devices will fit on the same PCB pad area as an 0805 MLV device. They give the designer the flexibility to protect one line in applications where arrays are not practical. Additionally, it may be sprinkled around the board in applications where board space is at a premium. IEC 61000-4-2 (ESD) 15kV (air), 8kV (contact) IEC 61000-4-4 (EFT) 40A (5/50ns) IEC 61000-4-5 (Lightning) 24A (8/20µs) Small package for use in portable electronics Suitable replacement for MLVs in ESD protection applications Protects one I/O or power line Low clamping voltage Working voltages: 5V, 12V, 15V, 24V Low leakage current Solid-state silicon avalanche technology Mechanical Characteristics u u u u They may may be used to meet the ESD immunity requirements of IEC 61000-4-2, Level 4 (15kV air, 8kV contact discharge). EIAJ SOD-323 package Molding compound flammability rating: UL 94V-0 Marking : Marking code Packaging : Tape and Reel per EIA 481 Applications u u u u u u u Cell Phone Handsets and Accessories Microprocessor based equipment Personal Digital Assistants (PDAs) Notebooks, Desktops, & Servers Portable Instrumentation Pagers Peripherals Schematic & PIN Configuration 1 2 SOD-323 (Top View) Revision 9/2000 1 www.semtech.com SD05C THRU SD24C PROTECTION PRODUCTS Absolute Maximum Rating R ating Symbo l Value Units Peak Pulse Pow er (tp = 8/20µs) Pp k 350 Watts Peak Pulse Current (tp = 8/20µs) I PP 24 A ESD Voltage (HBM Waveform p er IEC 61000-4-2) V PP 30 kV Lead Soldering Temp erature TL 260 (10 sec.) °C Op erating Temp erature TJ -55 to +125 °C TSTG -55 to +150 °C Storage Temp erature Electrical Characteristics SD05C T VS fo r 5V Line s Par ame te r Symbo l Co nd itio ns Minimum Typ ical Maximum Units 5 V Reverse Stand-Off Voltage V RWM Reverse Breakdow n Voltage V BR It = 1mA Reverse Leakage Current IR VRWM = 5V, T=25°C 10 µA Clamp ing Voltage VC IPP = 5A, tp = 8/20µs 9.8 V Clamp ing Voltage VC IPP = 24A, tp = 8/20µs 14.5 V Junction Cap acitance Cj V R = 0V, f = 1MHz 200 pF Symbo l Co nd itio ns Maximum Units 12 V 6 V SD12C T VS fo r 12V Line s Par ame te r Minimum Typ ical Reverse Stand-Off Voltage V RWM Reverse Breakdow n Voltage V BR It = 1mA Reverse Leakage Current IR VRWM = 12V, T=25°C 1 µA Clamp ing Voltage VC IPP = 5A, tp = 8/20µs 19 V Clamp ing Voltage VC IPP = 15A, tp = 8/20µs 24 V Junction Cap acitance Cj VR = 0V, f = 1MHz 100 pF ã 2000 Semtech Corp. 2 13.3 V www.semtech.com SD05C THRU SD24C PRELIMINARY PROTECTION PRODUCTS Electrical Characteristics (Continued) SD15C T VS fo r 15V Line s Par ame te r Symbo l Co nd itio ns Minimum Typ ical Maximum Units 15 V Reverse Stand-Off Voltage V RWM Reverse Breakdow n Voltage V BR It = 1mA Reverse Leakage Current IR VRWM = 15V, T=25°C 1 µA Clamp ing Voltage VC IPP = 5A, tp = 8/20µs 24 V Clamp ing Voltage VC IPP = 12A, tp = 8/20µs 29 V Junction Cap acitance Cj V R = 0V, f = 1MHz 75 pF Symbo l Co nd itio ns Maximum Units 24 V 16.7 V SD24C T VS fo r 24V Line s Par ame te r Minimum Typ ical Reverse Stand-Off Voltage V RWM Reverse Breakdow n Voltage V BR It = 1mA Reverse Leakage Current IR VRWM = 24V, T=25°C 1 µA Clamp ing Voltage VC IPP = 5A, tp = 8/20µs 40 V Clamp ing Voltage VC IPP = 8A, tp = 8/20µs 44 V Junction Cap acitance Cj VR = 0V, f = 1MHz 50 pF ã 2000 Semtech Corp. 3 26.7 V www.semtech.com SD05C THRU SD24C PROTECTION PRODUCTS Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Power Derating Curve 10 100 % of Rated Power or IPP Peak Pulse Power - PPP (kW) 110 1 0.1 90 80 70 60 50 40 30 20 10 0.01 0 0.1 1 10 100 0 1000 25 Pulse Duration - tp (µ s) Pulse Waveform 75 100 125 150 Clamping Voltage vs. Peak Pulse Current 110 30 90 80 70 e 60 Clamping Voltage - Vc (V) Waveform Parameters: tr = 8µs td = 20µs 100 Percent of IPP 50 Ambient Temperature - TA (oC) -t 50 40 td = IPP/2 30 20 10 Waveform Parameters: tr = 8µs td = 20µs 25 SD12C 20 15 SD05C 10 5 0 0 5 10 15 20 25 30 0 Time (µs) 0 5 10 15 20 25 30 Peak Pulse Current -Ipp (A) ã 2000 Semtech Corp. 4 www.semtech.com SD05C THRU SD24C PRELIMINARY PROTECTION PRODUCTS Applications Information Device Connection Options Device Schematic & Pin Configuration The SDxxC TVS diodes are designed to protect one data, I/O, or power supply line. The device is designed to replace multi-layer varistors (MLVs) in portable applications. It is easily implemented on existing 0805 MLV pads and is only slightly larger than 0603 MLV pads. The device is bidirectional and may be used on lines where the signal polarity is above and below ground. The device is symmetrical, so there is no cathode band. Size Comparison to 0805 MLV Circuit Board Layout Recommendations for Suppression of ESD. Good circuit board layout is critical for the suppression of fast rise-time transients such as ESD. The following guidelines are recommended (Refer to application note SI99-01 for more detailed information): l l l l l l l l l Place the TVS near the input terminals or connectors to restrict transient coupling. Minimize the path length between the TVS and the protected line. The ESD transient return path to ground should be kept as short as possible. Place a TVS & decoupling capacitor between power and ground of components that may be vulnerable to electrostatic discharges to the ground plane. Minimize all conductive loops including power and ground loops. Use multilayer boards when possible. Minimize interconnecting line lengths Never run critical signals near board edges. Fill unused portions of the PCB with ground plane. SOD-323 Component Placement Comparison 0805 MLV on 0805 Solder Pad ã 2000 Semtech Corp. 0805 MLV Note: Nominal dimensions in inches 5 SOD-323 on 0805 MLV Pad SOD-323 on Recommended (SOD-323) Solder Pad www.semtech.com SD05C THRU SD24C PROTECTION PRODUCTS Outline Drawing - SOD-323 Land Pattern - SOD-323 ã 2000 Semtech Corp. 6 www.semtech.com SD05C THRU SD24C PRELIMINARY PROTECTION PRODUCTS Marking Codes Par t Numbe r Mar king Co d e SD05C 5/5 SD12C 6/6 SD15C 7/7 SD24C 8/8 Ordering Information P ar t Numbe r Wo r king Vo ltage Qty p e r Reel R e e l Size SD05C.TC 5V 3,000 7 SD05C.TG 5V 10,000 13 SD12C.TC 12V 3,000 7 SD12C.TG 12V 10,000 13 SD15C.TC 15V 3,000 7 SD15C.TG 15V 10,000 13 SD24C.TC 24V 3,000 7 SD24C.TG 24V 10,000 13 Contact Information Semtech Corporation Protection Products Division 652 Mitchell Rd., Newbury Park, CA 91320 Phone: (805)498-2111 FAX (805)498-3804 ã 2000 Semtech Corp. 7 www.semtech.com