Full Material Declaration for attached parts list Full Material Declaration for attached parts list Report generated: 8 April 2016, 12:51 GMT Diotec Semiconductor AG DUNS-Nummer: 330866844 -, Kreuzmattenstr. 4, Heitersheim, B.-W., 79423, Germany Declarations Autorisiert durch: Udo Steinebrunner, Product Manager, - Deklaration gilt ab: 1 May 2009 [Approved on 8 April 2016, 12:53 GMT] Materialien und Stoffe Verwendung/Andordnung Chip (die) Die attach Encapsulation Material group Other inorganic materials Lead and Lead alloys EP (Epoxy resin) % w/w des Materials im Artikel 0.30000% 1.27000% 41.26000% Leadfinish Tin plating 1.38000% Leadframe Copper (e.g. copper amounts in cable harnesses) 55.79000% Substances in the material CAS Number % w/w des Stoffs im Artikel Nickel 7440-02-0 1.00000% Gold 7440-57-5 11.50000% Polydimethylsiloxane 63394-02-5 rubber 25.00000% Silicon 7440-21-3 62.50000% Silver 7440-22-4 2.50000% Tin 7440-31-5 5.00000% Lead 7439-92-1 92.50000% Carbon black 1333-86-4 0.30000% Epoxy resin 89 26335-32-0 28.30000% Quartz sand 60676-86-0 71.40000% Silver 7440-22-4 3.50000% Tin 7440-31-5 96.50000% Copper 7440-50-8 100.00000% Beigefügte Artikelliste Part number Artikelbezeichnung Artikelmasse Artikelmasse UoM TO-269AA/MiniDIL Bridge Rectifier Dual Inline 0.1 g Page 1 Report generated: 8 April 2016, 12:51 GMT