LSI CSP ■ CSP (Chip Size Package) •CSP The FBGA (commonly known as CSP) has an area array terminal structure with solder balls on the bottom, to give it a near chip-size footprint. This high-density, compact and low-profile package technology will greatly help in the design of compact mobile equipment, such as mobile phones and digital cameras. ● Compact FBGA (CSP) and lightweight Ability to create a near-chip size and lighter-weight package in comparison with conventional plastic packages. ● High reliability Comparable high reliability with that of conventional plastic packages. ● Mountability Conventional mounting system is available for CSP. SOP and QFP can be mounted together with CSP. Terminal pitch 0.8 mm 0.65 mm 0.5 mm 0.4 mm Maximum terminal counts 352 (16 mm x 16 mm) 352 (16 mm x 16 mm) 372 (16 mm x 16 mm) 264 (10 mm x 10 mm) Nominal dimensions 5 mm x 5 mm to 10 mm x 10 mm 6 mm x 6 mm to 16 mm x 16 mm Gold wire IC Mold resin Packages Features Package height 0.8 mm to 1.5 mm (MAX.) Cross section example Substrate Cu pattern Solder ball Terminal pitch : 0.8 mm 0.65 mm 0.5 mm 0.4 mm Diameter : 0.45 mm 0.4 mm 0.3 mm 0.25 mm CSP • Wafer-level The wafer-level CSP (WL-CSP) is a kind of chip-size package which is manufactured by assembling directly onto the finished wafer. ● Compact and thinner size It makes it possible to create an almost IC-size and lighter-weight package. ● Mountability Features The conventional CSP mounting system can be also used in that of wafer-level CSP, which facilitates chip mounting more than bare-chip mounting does. It can be mounted together with other existing packages and passive components. Chip size* 4 mm x 4 mm 3.5 mm x 3.5 mm 3 mm x 3 mm Pad pitch 0.5 mm 0.4 mm 0.5 mm 0.4 mm 0.5 mm 0.4 mm Maximum terminal counts 49 (7 x 7) 81 (9 x 9) 36 (6 x 6) 49 (7 x 7) 25 (5 x 5) 36 (6 x 6) * Rectangular chip form is also available. Cu pattern IC Cross section example Package height 0.5 mm to 1 mm (MAX.) Passivation layer Solder ball 23 LSI ■ SiP • SiP (System in Package) System in Package is SHARP’s original high-density mounting technology that achieves high-density memory capacity and multiple functions by stacking multiple ICs or multiple packages. The System in Package technology means chip-stacked package technology that can achieve up to 5-chip mounting by stacking ICs in a single package. The System in Package technology contributes to higher functionality of applications, such as mobile phones and digital cameras, as well as to reduction in size and weight. Chip Stacked CSP ● Wide variety of lineup It is possible to provide a wide lineup of stacked CSPs, including 2-chip, 3-chip, 4-chip and 5-chip stacked CSPs, to respond to customer needs. ● Compact and thinner size Encapsulating multiple ICs into an existing plastic package contributes to decreasing the mounting area. In addition, SHARP’s wafer thinning technology makes it possible to achieve 1.4 mm (MAX.) package height. ● Multiple Features functions Multiple ICs of different sizes and functions, such as logic LSIs and memories, can be incorporated in a single package, making possible multiple functions. ● Same-size IC stacking technology SHARP's stacking technology enables stacking of multiple same-size ICs, contributing to higher memory density. (4-chip stacked CSP) When using a SHARP four-chip stacked CSP, the mounting area and weight of a package can be decreased by half in comparison with using two 2-chip stacked CSPs, or a 3-chip stacked CSP and a conventional CSP. (5-chip stacked CSP) Gold wire IC Mold resin Cross section example Package height 1.4 mm (MAX.)* 1.6 mm (MAX.)* Cu pattern Substrate Diameter : 0.45 mm 0.30 mm 24 Solder ball Terminal pitch : 0.8 mm 0.5 mm * At 0.8 mm terminal pitch Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. LSI SiP •Chip Stacked TSOP/QFP*/VQFN/HQFN ● Decreased mounting area By encapsulating two identical or different types of ICs into a single conventional plastic package, the mounting area of the package can be decreased. Features ● Multiple functions Thanks to the incorporation of different sizes and functions of multiple ICs, such as logic LSIs and memories, the functionality increases. ● Higher memory density When incorporating two identical memory ICs into a single package, memory density doubles on the same mounting area. (TSOP, QFP*) (Hamburger type) (Turtle stack type) Cross section example Gold wire IC Gold wire Packages IC (HQFN) (VQFN) Gold wire Mold resin Gold wire Package height 1.0 mm (MAX.) Mold resin Package height 1.0 mm (MAX.) * Including TQFP and LQFP. Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 25 LSI PACKAGE LINEUP ■ Package Lineup •Surface-Mount Type Package type Appearance (Package material) Package code No. of terminals Package depth & width Terminal pitch Nominal dimensions (D x W) x mm mm (seated height [MAX.]) mm P-LFBGA048-0606 P-TFBGA048-0608 48 P-TFBGA048-0808 P-TFBGA056-0808 56 P-TFBGA060-0811 60 (48)* P-TFBGA064-0811 64 P-TFBGA072-0811 P-LFBGA072-0811 81 P-LFBGA085-0811 85 P-LFBGA087-0811 87 P-LFBGA088-0912 FBGA (CSP) D W (Plastic) 6.0 x 6.0 x (1.4) 6x 8 6.0 x 8.0 x (1.2) 8x 8 8.0 x 8.0 x (1.2) 8 x 11 72 (64)* P-TFBGA081-0808 P-LFBGA088-0811 6x 6 8.0 x 11.0 x (1.2) 8.0 x 11.0 x (1.4) / (1.6) 88 8x 8 8.0 x 8.0 x (1.2) 8 x 11 8.0 x 11.0 x (1.4) / (1.6) 9 x 12 9.0 x 12.0 x (1.4) / (1.6) 8 x 11 8.0 x 11.0 x (1.4) / (1.6) P-LFBGA090-0811 90 P-TFBGA096-1010 96 P-LFBGA107-0912 107 P-TFBGA111-1010 111 P-TFBGA112-1010 112 P-LFBGA115-0914 115 9 x 14 9.0 x 14.0 x (1.4) / (1.6) P-LFBGA116-1010 116 10 x 10 10.0 x 10.0 x (1.4) / (1.6) P-LFBGA130-1013 130 10 x 13 10.0 x 13.0 x (1.4) / (1.6) P-TFBGA144-1111 144 11 x 11 11.0 x 11.0 x (1.2) P-TFBGA160-1212 160 12.0 x 12.0 x (1.2) P-LFBGA168-1212 168 12.0 x 12.0 x (1.4) / (1.6) P-TFBGA180-1212 180 P-TFBGA184-1212 184 P-TFBGA240-1414 240 P-LFBGA280-1616 280 P-LFBGA352-1616 352 0.8 10 x 10 10.0 x 10.0 x (1.2) 9 x 12 9.0 x 12.0 x (1.4) / (1.6) 10 x 10 10.0 x 10.0 x (1.2) 12 x 12 12.0 x 12.0 x (1.2) 14 x 14 14.0 x 14.0 x (1.2) 16 x 16 16.0 x 16.0 x (1.5) 6.0 x 6.0 x (1.2) P-TFBGA064-0606 64 6x 6 P-LFBGA140-0909 140 9x 9 9.0 x 9.0 x (1.4) P-LFBGA160-1010 160 10 x 10 10.0 x 10.0 x (1.4) / (1.6) P-TFBGA180-1313 180 P-LFBGA192-1010 192 P-LFBGA208-1212 208 P-LFBGA224-1313 224 P-TFBGA260-1313 260 0.65 13 x 13 13.0 x 13.0 x (1.2) 10 x 10 10.0 x 10.0 x (1.4) / (1.6) 12 x 12 12.0 x 12.0 x (1.4) / (1.6) 13 x 13 13.0 x 13.0 x (1.4) / (1.6) 13.0 x 13.0 x (1.2) * Figures in brackets indicate available terminal counts. 26 Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. LSI PACKAGE LINEUP •Surface-Mount Type (cont’d) Appearance (Package material) Package code No. of terminals P-VFBGA057-0505 57 P-VFBGA075-0505 75 P-TFBGA064-0606 64 P-TFBGA068-0606 68 P-VFBGA081-0606 81 P-TFBGA084-0606 84 Package depth & width Terminal pitch Nominal dimensions (D x W) x mm mm (seated height [MAX.]) mm 5x 5 6.0 x 6.0 x (1.1) 6x 6 6.0 x 6.0 x (0.9) 7.0 x 7.0 x (0.9) 100 P-TFBGA100-0707 P-VFBGA108-0707 P-TFBGA108-0707 P-VFBGA120-0707 P-TFBGA120-0707 7.0 x 7.0 x (1.1) 7.0 x 7.0 x (0.9) 108 7x 7 132 P-TFBGA133-0808 133 7.0 x 7.0 x (1.1) 8.0 x 8.0 x (1.1) 8x 8 P-VFBGA144-0808 FBGA (CSP) 144 D W P-VFBGA171-0811 P-LFBGA171-0811 P-VFBGA176-0909 P-TFBGA176-0909 P-TFBGA180-0909 P-TFBGA188-0909 P-VFBGA188-1111 P-VFBGA208-1010 P-TFBGA208-1010 P-TFBGA245-1010 P-LFBGA245-1010 (Plastic) 8.0 x 8.0 x (0.9) 8.0 x 8.0 x (1.3) / (1.5) 0.5 8 x 11 8.0 x 11.0 x (1.3) 152 8x 8 8.0 x 8.0 x (1.1) 171 8 x 11 P-LFBGA144-0811 P-TFBGA152-0808 7.0 x 7.0 x (1.1) 7.0 x 7.0 x (0.9) 120 P-TFBGA132-0707 P-LFBGA144-0808 6.0 x 6.0 x (0.9) 6.0 x 6.0 x (1.1) P-VFBGA100-0606 P-VFBGA100-0707 5.0 x 5.0 x (0.9) 9x 9 180 188 11 x 11 10 x 10 245 P-WFBGA144-0606 144 P-WFBGA121-0606 121 P-WFBGA145-0606 145 P-TFBGA168-0707 168 P-TFBGA204-0808 204 P-WFBGA205-0808 205 P-WFBGA261-0808 261 9.0 x 9.0 x (1.1) 11.0 x 11.0 x (0.9) 10.0 x 10.0 x (0.9) 208 424 8.0 x 11.0 x (0.9) 8.0 x 11.0 x (1.3) / (1.5) 9.0 x 9.0 x (0.9) 176 P-FBGA424-1414 Packages Package type 10.0 x 10.0 x (1.1) 10.0 x 10.0 x (1.3) 14 x 14 14.0 x 14.0 x (1.8) 6.0 x 6.0 x (0.75) 6x 6 0.4 7x 7 6.0 x 6.0 x (0.8) 7.0 x 7.0 x (1.0) 8.0 x 8.0 x (1.0) 8x 8 8.0 x 8.0 x (0.8) Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 27 LSI PACKAGE LINEUP •Surface-Mount Type (cont’d) Package type Appearance (Package material) No. of terminals P-TFBGAXXX-0606 to 36 6x 6 6.0 x 6.0 x (1.2) P-TFBGAXXX-0707 to 49 7x 7 7.0 x 7.0 x (1.2) P-TFBGAXXX-0808 to 81 8x 8 8.0 x 8.0 x (1.2) P-TFBGAXXX-0909 to 100 9x 9 9.0 x 9.0 x (1.2) P-TFBGAXXX-1010 to 121 10 x 10 10.0 x 10.0 x (1.2) P-TFBGAXXX-1111 to 144 11 x 11 11.0 x 11.0 x (1.2) P-TFBGAXXX-1212 to 196 12 x 12 12.0 x 12.0 x (1.2) P-TFBGAXXX-1313 to 216 13 x 13 13.0 x 13.0 x (1.2) 14 x 14 14.0 x 14.0 x (1.2) 15 x 15 15.0 x 15.0 x (1.2) P-TFBGAXXX-1414 P-TFBGAXXX-1515 FBGA (CSP) D W (Plastic) PBGA (BGA) D W (Plastic) Package depth & width Terminal pitch Nominal dimensions (D x W) x mm mm (seated height [MAX.]) mm Package code 0.8 to 240 P-TFBGAXXX-1616 to 352 16 x 16 16.0 x 16.0 x (1.2) P-TFBGAXXX-0606 to 49 6x 6 6.0 x 6.0 x (1.2) P-TFBGAXXX-0707 to 81 7x 7 7.0 x 7.0 x (1.2) P-TFBGAXXX-0808 to 121 8x 8 8.0 x 8.0 x (1.2) P-TFBGAXXX-0909 to 144 9x 9 9.0 x 9.0 x (1.2) P-TFBGAXXX-1010 to 196 10 x 10 10.0 x 10.0 x (1.2) P-TFBGAXXX-1111 to 224 11 x 11 11.0 x 11.0 x (1.2) P-TFBGAXXX-1212 to 256 12 x 12 12.0 x 12.0 x (1.2) P-TFBGAXXX-1313 to 272 13 x 13 13.0 x 13.0 x (1.2) P-TFBGAXXX-1414 to 304 14 x 14 14.0 x 14.0 x (1.2) P-TFBGAXXX-1515 to 320 15 x 15 15.0 x 15.0 x (1.2) P-TFBGAXXX-1616 to 352 16 x 16 16.0 x 16.0 x (1.2) P-TFBGAXXX-0606 to 100 6x 6 6.0 x 6.0 x (1.1) P-TFBGAXXX-0707 to 132 7x 7 7.0 x 7.0 x (1.1) P-TFBGAXXX-0808 to 164 8x 8 8.0 x 8.0 x (1.1) P-TFBGAXXX-0909 to 192 9x 9 9.0 x 9.0 x (1.1) P-TFBGAXXX-1010 to 216 10 x 10 10.0 x 10.0 x (1.1) P-TFBGAXXX-1111 to 244 11 x 11 11.0 x 11.0 x (1.1) P-TFBGAXXX-1212 to 268 12 x 12 12.0 x 12.0 x (1.1) P-TFBGAXXX-1313 to 296 13 x 13 13.0 x 13.0 x (1.1) P-TFBGAXXX-1414 to 320 14 x 14 14.0 x 14.0 x (1.1) P-TFBGAXXX-1515 to 348 15 x 15 15.0 x 15.0 x (1.1) P-TFBGAXXX-1616 to 372 16 x 16 16.0 x 16.0 x (1.1) P-TFBGAXXX-0505 to 100 5x 5 5.0 x 5.0 x (1.0) P-TFBGAXXX-0606 to 144 6x 6 6.0 x 6.0 x (1.0) P-TFBGAXXX-0707 to 168 7x 7 7.0 x 7.0 x (1.0) P-TFBGAXXX-0808 to 204 8x 8 8.0 x 8.0 x (1.0) P-TFBGAXXX-0909 to 228 9x 9 9.0 x 9.0 x (1.0) P-TFBGAXXX-1010 to 264 10 x 10 10.0 x 10.0 x (1.0) 1.0 21 x 21 21.0 x 21.0 x (2.2) 1.27 35 x 35 35.0 x 35.0 x (2.63) P-BGA0356-2121 356 P-BGA0476-3535 476 P-BGA0528-3535 528 0.65 0.5 0.4 XXX: Terminal counts BGA is a trademark of Motorola Nippon Ltd. 28 Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. LSI PACKAGE LINEUP Package type Appearance (Package material) W Package code P-TSOP048-1220 No. of terminals 48 TSOP Package depth & width Lead frame material (D x W) x Alloy42 Copper alloy (seated height [MAX.]) mm 12 x 20 12.0 x 18.4 x (1.2) 14.0 x 18.4 x (1.2) 0.5 (Plastic) D QFP W LQFP D TQFP (Plastic) VQFN Terminal pitch Nominal dimensions mm (mil) mm (mil) W D HQFN* (Plastic) P-TSOP056-1420 56 14 x 20 P-QFP048-0707 48 7x 7 P-QFP072-1010 72 P-LQFP080-1212 80 P-LQFP100-1414 100 P-TQFP048-0707 48 P-TQFP100-1414 100 P-TQFP128-1414 128 P-VQFN020-0404 20 P-VQFN024-0404 24 P-VQFN028-0505 28 P-VQFN032-0505 32 P-VQFN036-0606 0.5 0.5 0.5 0.4 7.0 x 7.0 x (1.65) ○ ○ ○ ○ ○ ○ 10 x 10 10.0 x 10.0 x (1.8) ○ – 12 x 12 12.0 x 12.0 x (1.7) ○ – 14 x 14 14.0 x 14.0 x (1.7) ○ – 7x 7 7.0 x 7.0 x (1.2) ○ – ○ – 14 x 14 4x 4 14.0 x 14.0 x (1.2) 4.2 x 4.2 x (1.0) ○ – – ○ – ○ – ○ – ○ 5x 5 5.2 x 5.2 x (1.0) 36 6x 6 6.2 x 6.2 x (1.0) – ○ P-VQFN048-0707 48 7x 7 7.2 x 7.2 x (1.0) – ○ P-VQFN036-0505 36 5x 5 5.2 x 5.2 x (1.0) – ○ P-VQFN052-0707 52 7x 7 7.2 x 7.2 x (1.0) – ○ P-HQFN020-0404 20 4.0 x 4.0 x (1.0) – ○ 4.0 x 4.0 x (0.85) – ○ 4.2 x 4.2 x (1.0) – ○ 5x 5 5.0 x 5.0 x (1.0) – ○ 7x 7 7.2 x 7.2 x (1.0) – ○ P-HQFN024-0404 24 P-HQFN028-0505 28 P-HQFN052-0707 52 * HQFN is a higher heat dissipation package of VQFN. 0.5 0.4 0.5 0.4 4x 4 Packages •Surface-Mount Type (cont’d) 100 mil = 2.54 mm Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 29 Imaging PACKAGE LINEUP • For CCDs Package type Appearance (Package material) W DIP D Package code No. of terminals Terminal pitch mm Nominal dimensions mm (mil) Package depth & width (D x W) x (seated height [TYP.]) mm P-DIP014-0400A 14 1.27 10.16 (400) 10.0 x 10.0 P-DIP016-0450 16 1.27 11.43 (450) 11.4 x 12.2 P-DIP020-0500 20 1.27 12.2 (500) 12.0 x 13.8 P-DIP024-0400 24 0.80 10.16 (400) 10.0 x 10.0 P-DIP028-0566 28 1.11 14.4 (566) 14.2 x 16.0 64 1.00 25.48 (1 000) 36.1 x 25.4 P-SOP014-0400A 14 1.27 12 (470) 10.0 x 10.0 x (4.1) P-SOP028-0400 28 0.69 10.16 (400) 10.0 x 10.0 x (3.5) P-SOP032-0525 32 0.78 13.3 (525) 12.0 x 13.8 x (3.92) 0.65 8.9 (350) 8.3 x 8.9 x (1.52) 0.80 11.0 (433) 11.0 x 11.0 x (1.62) P-DIP064-1000 (Plastic) W SOP D (Plastic) W P-DIP064-1000B N-LCC040-R350 (B) LCC 40 D N-LCC040-S433A (Ceramic) 100 mil = 2.54 mm • For CMOSs Package type Appearance (Package material) W LCC Package code No. of terminals Terminal pitch mm Nominal dimensions mm (mil) Package depth & width (D x W) x (seated height [TYP.]) mm 120 0.65 22.8 (898) 20.0 x 22.8 x (2.67) N-LCC120-R898 D (Ceramic) N-LCC120-R898A 100 mil = 2.54 mm Nominal dimensions FBGA (CSP) PBGA (BGA) VQFN HQFN SOP SSOP MFP TSOP DIP LCC QFP LQFP TQFP FBGA : fine-pitch ball grid array package MFP PBGA : plastic ball grid array package TSOP : thin small outline package VQFN : very thin quad flat non-leaded package SOP QFP HQFN : heat sink quad flat non-leaded package : small outline package SSOP : shrink small outline package : mini flat package : quad flat package LQFP : low profile quad flat package TQFP : thin quad flat package DIP : dual inline package LCC : leadless chip carrier Ball Grid Array and BGA are trademarks of Motorola Nippon Ltd. 30 Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.