MUX8500 5962-0050201

REVISIONS
LTR
DESCRIPTION
DATE (YR-MO-DA)
APPROVED
A
Add device type 02. -gjc.
03-03-13
Raymond Monnin
B
Update drawing to the latest requirements. -sld
07-03-27
Robert M. Heber
C
Made changes to paragraphs 1.3 and 1.4 along with footnote 3, sheet
3. Table I, made corrections to Supply currents test, Address input
currents test, Enable input current tests, Output leakage current tests,
and the Switching tests. Changed footnote 1 to add power supply turn
on sequence. Made corrections to Figures 2, 3, 4, and 5. -sld
10-05-05
Charles F. Saffle
D
Added radiation hardness assurance requirements. Table I: sheet 6,
under the Group A subgroups column added footnote 4 for the
Address input currents and Enable input current tests. Table I: sheet
7, under the Group A subgroups column added footnote 4 for all
current tests. Updated drawing paragraphs. -sld
13-05-06
Charles F. Saffle
REV
SHEET
REV
D
D
D
D
D
D
D
SHEET
15
16
17
18
19
20
21
REV STATUS
REV
D
D
D
D
D
D
D
D
D
D
D
D
D
D
OF SHEETS
SHEET
1
2
3
4
5
6
7
8
9
10
11
12
13
14
PMIC N/A
PREPARED BY
Gary Zahn
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
CHECKED BY
Greg Cecil
APPROVED BY
Raymond Monnin
http://www.landandmaritime.dla.mil/
MICROCIRCUIT, HYBRID, LINEAR,
64 CHANNEL, ANALOG MULTIPLEXER
DRAWING APPROVAL DATE
02-11-14
REVISION LEVEL
D
SIZE
CAGE CODE
A
67268
SHEET
DSCC FORM 2233
APR 97
1 OF
5962-00502
21
5962-E397-13
1. SCOPE
1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A
choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When
available, a choice of radiation hardness assurance levels are reflected in the PIN.
1.2 PIN. The PIN shall be as shown in the following example:
5962



Federal
stock class
designator
\
F



RHA
designator
(see 1.2.1)
00502
01



Device
type
(see 1.2.2)
/
K



Device
class
designator
(see 1.2.3)
X



Case
outline
(see 1.2.4)
X



Lead
finish
(see 1.2.5)
\/
Drawing number
1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHA
levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
Generic number
01
ACT8500
02
ACT8501
Circuit function
64 channel analog multiplexer, high impedance analog
input with ESD protection, 32 channels Voltage, 32
channels Voltage and Current
64 channel analog multiplexer, high impedance analog
input with ESD protection
1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level.
All levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K,
and E) or QML Listing (Class G and D). The product assurance levels are as follows:
Device class
Device performance documentation
K
Highest reliability class available. This level is intended for use in space
applications.
H
Standard military quality class level. This level is intended for use in applications
where non-space high reliability devices are required.
G
Reduced testing version of the standard military quality class. This level uses the
Class H screening and In-Process Inspections with a possible limited temperature
range, manufacturer specified incoming flow, and the manufacturer guarantees (but
may not test) periodic and conformance inspections (Group A, B, C, and D).
E
Designates devices which are based upon one of the other classes (K, H, or G)
with exception(s) taken to the requirements of that class. These exception(s) must
be specified in the device acquisition document; therefore the acquisition document
should be reviewed to ensure that the exception(s) taken will not adversely affect
system performance.
D
Manufacturer specified quality class. Quality level is defined by the manufacturers
internal, QML certified flow. This product may have a limited temperature range.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-00502
A
REVISION LEVEL
D
SHEET
2
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
Descriptive designator
X
Terminals
See figure 1
96
Package style
Ceramic quad flat pack
1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534.
1.3 Absolute maximum ratings. 1/
Positive supply voltage between +VEE and GND ......................................
Negative supply voltage between -VEE and GND......................................
VREF to GND..............................................................................................
Digital input overvoltage range:
VEN (pins 5, 6, 91, and 92) .....................................................................
VA (pins 1, 3, 93, and 95).......................................................................
VB (pins 2, 4, 94, and 96).......................................................................
Analog input overvoltage range ................................................................
Power dissipation (PD), TC = -55°C to +125°C:
Device type 01.......................................................................................
Device type 02.......................................................................................
Thermal resistance junction-to-case (θJC) .................................................
Storage temperature .................................................................................
Lead temperature (soldering, 10 seconds) ...............................................
+16.5 V dc
-16.5 V dc
+16.5 V dc
(< VREF + 4)V, (> GND - 4)V
(< VREF + 4)V, (> GND - 4)V
(< VREF + 4)V, (> GND - 4)V
-18 V dc ≤ VS ≤ +18 V dc
99 mW
66 mW
5.5°C/W 2/
-65°C to +150°C
+300°C
1.4 Recommended operating conditions.
Positive supply voltage (+VEE) ..................................................................
Negative supply voltage (-VEE)..................................................................
VREF...........................................................................................................
Logic low level voltage (VAL) .....................................................................
Logic high level voltage (VAH) ...................................................................
Case operating temperature range (TC)....................................................
+15 V dc 3/
-15 V dc 3/
+5 V dc 3/
+0.8 V dc
+4.0 V dc
-55°C to +125°C
1.5 Radiation features. 4/
Maximum Total Ionizing Dose (TID) (dose rate = 50 - 300 rad(Si)/s) .......
Enhanced Low Dose Rate Sensitvity (ELDRS) ........................................
Single Event Phenomenon (SEP) effective linear energy transfer (LET):
Single Event Latchup (SEL) ..................................................................
Single Event Upset (SEU) .....................................................................
Single Event Transient (SET)................................................................
1/
2/
3/
4/
5/
6/
7/
300 krad(Si) 5/ 6/
150 krad(Si) 5/
Immune 5/
≤ 86 MeV-cm2/mg 7/
≤ 86 MeV-cm2/mg 7/
Stresses above the absolute maximum ratings may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
Based on the maximum power dissipation spread over all six die.
Recommended power supply turn on sequence : +VEE, -VEE, followed by VREF.
See section 4.3.5 for the manufacturer's radiation hardness assurance analysis and testing.
The only active element in these devices are purchased as SMD 5962F9563002V9A which assures TID, ELDRS, and SEL.
The package in this drawing is a larger version of the same type (flat package) as the one in SMD 5962-95630, the lid
underside is nickel plate (no gold), and RGA data shows negligible amounts of hydrogen.
SEU and SET testing performed at 86 MeV-cm2/m with no upsets or single event transients. These devices will be retested after design or process changes that can affect RHA response of these devices.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-00502
A
REVISION LEVEL
D
SHEET
3
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
MIL-PRF-38534 - Hybrid Microcircuits, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 - Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 - List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Copies of these documents are available online at http://quicksearch.dla.mil or from the Standardization Document Order
Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in
accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 shall include the performance of all tests herein or as
designated in the device manufacturer's Quality Management (QM) plan or as designated for the applicable device class. The
manufacturer may eliminate, modify or optimize the tests and inspections herein, however the performance requirements as
defined in MIL-PRF-38534 shall be met for the applicable device class. In addition, the modification in the QM plan shall not
affect the form, fit, or function of the device for the applicable device class.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38534 and herein.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Truth table(s). The truth table(s) shall be as specified on figure 3.
3.2.4 Switching waveform(s). The switching waveform(s) shall be as specified on figure 4.
3.2.5 Block diagram. The block diagram shall be as specified on figure 5.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full specified operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are defined in table I.
3.5 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with
the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-00502
A
REVISION LEVEL
D
SHEET
4
3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described
herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample,
for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those
which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be
made available to the preparing activity (DLA Land and Maritime -VA) upon request.
3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this
drawing. The certificate of compliance (original copy) submitted to DLA Land and Maritime -VA shall affirm that the
manufacturer's product meets the performance requirements of MIL-PRF-38534 and herein.
3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of
microcircuits delivered to this drawing.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-00502
A
REVISION LEVEL
D
SHEET
5
TABLE I. Electrical performance characteristics.
Test
Symbol
Supply currents
Address input
currents
Enable input
current
Conditions 1/ 2/
-55°C ≤ TC ≤ +125°C
unless otherwise specified
Group A
subgroups
Device
type
Limits
Unit
Min
0.3
0.2
-3
-2
0.3
0.2
-3
-2
Max
3
2
-0.3
-0.2
3
2
-0.3
-0.2
+IEE
VEN(0-63) = VA(0-3) = V B(0-3) = 0
1,2,3
-IEE
VEN(0-63) = VA(0-3) = V B(0-3) = 0
1,2,3
+ISBY
VEN(0-63) = 4 V, VA(0-3) = V B(0-3) = 0 3/
1,2,3
-ISBY
VEN(0-63) = 4 V, VA(0-3) = V B(0-3) = 0 3/
1,2,3
01
02
01
02
01
02
01
02
IAL(0-3)B
VB = 0 V 2/
1,2,3 4/
01,02
-2
2
µA
IAH(0-3)B
VB = 5 V 2/
1,2,3 4/
01,02
-2
2
µA
01
-4
4
IAL(0-3)A
VA = 0 V 2/
1,2,3 4/
02
-2
2
01
-4
4
IAH(0-3)A
VA = 5 V 2/
1,2,3 4/
02
-2
2
µA
IENL(0-15)
VEN(0-15) = 0 V
1,2,3 4/
01,02
-1
1
µA
IENH(0-15)
VEN(0-15) = 5 V
1,2,3 4/
01,02
-1
1
µA
IENL(16-31)
VEN(16-31)= 0 V
1,2,3 4/
01,02
-1
1
µA
IENH(16-31)
VEN(16-31) = 5 V
1,2,3 4/
VEN(32-47) = 0 V
1,2,3 4/
IENH(32-47)
VEN(32-47) = 5 V
1,2,3 4/
IENL(48-63)
VEN(48-63) = 0 V
1,2,3 4/
IENH(48-63)
VEN(48-63) = 5 V
1,2,3 4/
-1
-2
-1
-2
-1
-2
-1
-2
-1
1
2
1
2
1
2
1
2
1
µA
IENL(32-47)
01,02
01
02
01
02
01
02
01
02
mA
mA
mA
mA
µA
µA
µA
µA
µA
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-00502
A
REVISION LEVEL
D
SHEET
6
TABLE I. Electrical performance characteristics - Continued.
Test
Symbol
Positive input
leakage current
(CH0-CH63)
Negative input
leakage current
(CH0-CH63)
Output leakage
current outputs
(pins 25, 26,
68, and 70)
Currents (pins
67 and 69
Device Type 01
only)
Input clamped
voltage
(CH0-CH63)
Conditions 1/ 2/
-55°C ≤ TC ≤ +125°C
unless otherwise specified
Group A
subgroups
Device
type
Limits
Unit
Min
Max
+ISOFFOUTPUT(ALL)
VIN = +10 V, VEN = 4 V, output
and all unused inputs = -10 V
5/ 6/
1,2,3 4/
01,02
-100
+700
nA
+ISOFFCURRENT(ALL)
VIN = +10 V, VEN = 4 V, output
and all unused inputs = -10 V
5/ 6/
1,2,3 4/
01,02
-100
+700
nA
-ISOFFOUTPUT(ALL)
VIN = -10 V, VEN = 4 V, output
and all unused inputs = +10 V
5/ 6/
1,2,3 4/
01,02
-100
+700
nA
-ISOFFCURRENT(ALL)
VIN = -10 V, VEN = 4 V, output
and all unused inputs = +10 V
5/ 6/
1,2,3 4/
01,02
-100
+700
nA
+IDOFFOUTPUT(ALL)
VOUT = +10 V, VEN = 4 V, output
and all unused inputs = -10 V
6/ 7/
1,2,3 4/
01,02
-100
+100
nA
+IDOFFCURRENT(ALL)
VOUT = +10 V, VEN = 4 V, output
and all unused inputs = -10 V
6/ 7/
1,2,3 4/
01,02
-100
+100
nA
-IDOFFOUTPUT(ALL)
VOUT = -10 V, VEN = 4 V, output
and all unused inputs = +10 V
6/ 7/
1,2,3 4/
01,02
-100
+100
nA
-IDOFFCURRENT(ALL)
VOUT = -10 V, VEN = 4 V, output
and all unused inputs = +10 V
6/ 7/
1,2,3 4/
01,02
-100
+100
nA
+VCLMP(0-63)
VEN = 4 V, all unused inputs are
open 6/
1
01,02
-VCLMP(0-63)
VEN = 4 V, all unused inputs are
open 6/
18.0
23.0
2
18.0
23.5
3
17.5
22.5
-23.0
-18.0
2
-23.5
-18.0
3
-22.5
-17.5
1
01,02
V
V
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-00502
A
REVISION LEVEL
D
SHEET
7
TABLE I. Electrical performance characteristics - Continued.
Test
Symbol
Switch ON
resistance outputs
(pins 25, 26, 68,
and 70)
Switch ON
resistance outputs
(pins 67 and 69
Device type 01
only)
Switching tests
Conditions 1/ 2/
-55°C ≤ TC ≤ +125°C
unless otherwise specified
Group A
subgroups
Device
type
2/
3/
4/
5/
6/
7/
8/
Unit
Min
Max
RDS(ON)(0-63)A
VIN = +15 V, VEN = 0.8 V,
IOUT = -1 mA 5/ 6/ 8/
1,2,3
01,02
500
3000
Ω
RDS(ON)(0-63)B
VIN = +5 V, VEN = 0.8 V,
IOUT = -1 mA 5/ 6/ 8/
1,2,3
01,02
500
3000
Ω
RDS(ON)(0-63)C
VIN = -5 V, VEN = 0.8 V,
IOUT = +1 mA 5/ 6/ 8/
1,2,3
01,02
500
3000
Ω
RDS(ON)(32-63)A
VIN = +15 V, VEN = 0.8 V,
IOUT = -1 mA 5/ 6/ 8/
1,2,3
01
500
3000
Ω
RDS(ON)(32-63)B
VIN = +5 V, VEN = 0.8 V,
IOUT = -1 mA 5/ 6/ 8/
1,2,3
01
500
3000
Ω
RDS(ON)(32-63)C
VIN = -5 V, VEN = 0.8 V,
IOUT = +1 mA 5/ 6/ 8/
1,2,3
01
500
3000
Ω
tAHL
RL = 10 kΩ, CL = 50 pF,
see figure 4.
9,10,11
01,02
10
1500
ns
tALH
RL = 10 kΩ, CL = 50 pF,
see figure 4.
9,10
01,02
10
2000
ns
10
5000
11
1/
Limits
tONEN
RL = 1 kΩ, CL = 50 pF,
see figure 4.
9,10,11
01,02
10
1500
ns
tOFFEN
RL = 1 kΩ, CL = 50 pF,
see figure 4.
9,10,11
01,02
10
1000
ns
+VEE = +15 V dc, -VEE = -15 V dc, and VREF = +5 V dc, unless otherwise specified. Recommended power supply turn
on sequence : +VEE, -VEE, followed by VREF.
Measure inputs sequentially. Ground all unused inputs. VA is the applied input voltage to the address lines A(0-3).
VB is the applied input voltage to the address lines B(0-3).
If not tested, shall be guaranteed to the limits specified in table I.
Subgroup 3 for these parameters is guaranteed, but not production tested.
VIN is the applied input voltage to the input channels (CH0-CH63).
VEN is the applied input voltage to the enable lines EN(0-15), EN(16-31), EN(32-47), and EN(48-63).
VOUT is the applied input voltage to the output lines (OUTPUT(1-15), OUTPUT(16-31), OUTPUT(32-47), OUTPUT(48-63),
CURRENT(32-47), and CURRENT(48-63). (Current outputs for device type 01 only).
Negative current is the current flowing out of each of the pins. Positive current is the current flowing into each of the
pins.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-00502
A
REVISION LEVEL
D
SHEET
8
Case outline X.
FIGURE 1. Case outline(s).
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-00502
A
REVISION LEVEL
D
SHEET
9
Case outline X - Continued.
FIGURE 1. Case outline(s) - Continued.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-00502
A
REVISION LEVEL
D
SHEET
10
Case outline X - Continued.
Inches
Symbol
Min
Millimeters
Max
Min
Max
A
.200
5.08
A1
.180
4.57
A2
.005
.011
0.13
0.28
b
.0135
.0195
0.34
0.50
c
.005
.008
0.13
0.20
D/E
1.287
1.313
32.69
33.35
D1
1.145
1.155
29.08
29.34
e
.050 BSC
1.27 BSC
F
.200 TYP
5.08 TYP
J
.035 TYP
0.89 TYP
L
2.490
2.510
L1
63.25
63.75
2.580
65.53
L2
1.700
1.740
43.18
44.20
L3
2.090
2.110
53.09
53.59
L4
.400 TYP
10.16 TYP
N
96
96
S1
.030 TYP
0.76 TYP
S2
.015 TYP
0.38 TYP
NOTES:
1. Pin 1 is indicated by an ESD triangle on top of the package and by an index on the bottom of the package.
2. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of
measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound
units shall rule.
3. N equals 96, the total number of leads on the package.
4. Pin numbers are for reference only.
FIGURE 1. Case outline(s) - Continued.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-00502
A
REVISION LEVEL
D
SHEET
11
Device type
01
Case outline
Terminal
number
Terminal symbol
Terminal
number
1
A2
33
2
B2
3
A3
4
X
Terminal symbol
Terminal
number
Terminal symbol
CH11
65
CH49
34
CH27
66
CH48
35
CH12
67
OUTPUT I(48-63)
B3
36
CH28
68
OUTPUT V(48-63)
5
EN (0-15)
37
CH13
69
OUTPUT I(32-47)
6
EN (16-31)
38
CH29
70
OUTPUT V(32-47)
7
CH0
39
CH14
71
GND
8
CH16
40
CH30
72
GND
9
CH1
41
CH15
73
CH47
10
CH17
42
CH31
74
CH46
11
CH2
43
NC
75
CH45
12
CH18
44
+VEE
76
CH44
13
CH3
45
NC
77
CH43
14
CH19
46
-VEE
78
CH42
15
CH4
47
NC
79
CH41
16
CH20
48
VREF
80
CH40
17
CH5
49
NC
81
CH39
18
CH21
50
Case GND
82
CH38
19
CH6
51
CH63
83
CH37
20
CH22
52
CH62
84
CH36
21
CH7
53
CH61
85
CH35
22
CH23
54
CH60
86
CH34
23
GND
55
CH59
87
CH33
24
GND
56
CH58
88
CH32
25
OUTPUT V(0-15)
57
CH57
89
GND
26
OUTPUT V(16-31)
58
CH56
90
GND
27
CH8
59
CH55
91
EN (48-63)
28
CH24
60
CH54
92
EN (32-47)
29
30
CH9
CH25
61
62
CH53
CH52
93
94
A0
B0
31
32
CH10
CH26
63
64
CH51
CH50
95
96
A1
B1
NOTE: NC is a no connect pin. NC pins should be grounded to eliminate or minimize electrostatic
discharge (ESD) or static buildup.
FIGURE 2. Terminal connections.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-00502
A
REVISION LEVEL
D
SHEET
12
Device type
02
Case outline
Terminal
number
Terminal symbol
Terminal
number
1
A2
33
2
B2
3
A3
4
X
Terminal symbol
Terminal
number
Terminal symbol
CH11
65
CH49
34
CH27
66
CH48
35
CH12
67
NC
B3
36
CH28
68
OUTPUT V(48-63)
5
EN (0-15)
37
CH13
69
NC
6
EN (16-31)
38
CH29
70
OUTPUT V(32-47)
7
CH0
39
CH14
71
GND
8
CH16
40
CH30
72
GND
9
CH1
41
CH15
73
CH47
10
CH17
42
CH31
74
CH46
11
CH2
43
NC
75
CH45
12
CH18
44
+VEE
76
CH44
13
CH3
45
NC
77
CH43
14
CH19
46
-VEE
78
CH42
15
CH4
47
NC
79
CH41
16
CH20
48
VREF
80
CH40
17
CH5
49
NC
81
CH39
18
CH21
50
Case GND
82
CH38
19
CH6
51
CH63
83
CH37
20
CH22
52
CH62
84
CH36
21
CH7
53
CH61
85
CH35
22
CH23
54
CH60
86
CH34
23
GND
55
CH59
87
CH33
24
GND
56
CH58
88
CH32
25
OUTPUT V(0-15)
57
CH57
89
GND
26
OUTPUT V(16-31)
58
CH56
90
GND
27
CH8
59
CH55
91
EN (48-63)
28
CH24
60
CH54
92
29
30
CH9
CH25
61
62
CH53
CH52
93
94
31
32
CH10
CH26
63
64
CH51
CH50
95
96
EN (32-47)
A0
B0
A1
B1
NOTE: NC is a no connect pin. NC pins should be grounded to eliminate or minimize electrostatic
discharge (ESD) or static buildup.
FIGURE 2. Terminal connections - Continued.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-00502
A
REVISION LEVEL
D
SHEET
13
Truth table (CH0-CH15) and (CH16-CH31)
B3
X
L
L
L
L
L
L
L
L
H
H
H
H
H
H
H
H
1/
2/
B2
X
L
L
L
L
H
H
H
H
L
L
L
L
H
H
H
H
B1
X
L
L
H
H
L
L
H
H
L
L
H
H
L
L
H
H
B0
X
L
H
L
H
L
H
L
H
L
H
L
H
L
H
L
H
EN (0-15)
H
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
"ON" Channel 1/
None
CH0
CH1
CH2
CH3
CH4
CH5
CH6
CH7
CH8
CH9
CH10
CH11
CH12
CH13
CH14
CH15
EN (16-31)
H
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
"ON" Channel 2/
None
CH16
CH17
CH18
CH19
CH20
CH21
CH22
CH23
CH24
CH25
CH26
CH27
CH28
CH29
CH30
CH31
Between (CH0-CH15) and OUTPUT(0-15).
Between (CH16-CH31) and OUTPUT(16-31).
Truth table (CH32-CH47) and (CH48-CH63)
1/
2/
A3
A2
A1
A0
EN (32-47)
"ON" Channel 1/
EN (48-63)
"ON" Channel 2/
X
L
L
L
L
L
L
L
L
H
H
H
H
H
H
H
H
X
L
L
L
L
H
H
H
H
L
L
L
L
H
H
H
H
X
L
L
H
H
L
L
H
H
L
L
H
H
L
L
H
H
X
L
H
L
H
L
H
L
H
L
H
L
H
L
H
L
H
H
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
None
CH32
CH33
CH34
CH35
CH36
CH37
CH38
CH39
CH40
CH41
CH42
CH43
CH44
CH45
CH46
CH47
H
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
None
CH48
CH49
CH50
CH51
CH52
CH53
CH54
CH55
CH56
CH57
CH58
CH59
CH60
CH61
CH62
CH63
Between (CH32-CH47) and OUTPUT(32-47) and CURRENT(32-47).
Between (CH48-CH63) and OUTPUT(48-63) and CURRENT(48-63).
FIGURE 3. Truth table(s). (Device type 01).
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-00502
A
REVISION LEVEL
D
SHEET
14
Truth table (CH0-CH15) and (CH16-CH31)
B3
X
L
L
L
L
L
L
L
L
H
H
H
H
H
H
H
H
1/
2/
B2
X
L
L
L
L
H
H
H
H
L
L
L
L
H
H
H
H
B1
X
L
L
H
H
L
L
H
H
L
L
H
H
L
L
H
H
B0
X
L
H
L
H
L
H
L
H
L
H
L
H
L
H
L
H
EN (0-15)
H
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
"ON" Channel 1/
None
CH0
CH1
CH2
CH3
CH4
CH5
CH6
CH7
CH8
CH9
CH10
CH11
CH12
CH13
CH14
CH15
EN (16-31)
H
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
"ON" Channel 2/
None
CH16
CH17
CH18
CH19
CH20
CH21
CH22
CH23
CH24
CH25
CH26
CH27
CH28
CH29
CH30
CH31
Between (CH0-CH15) and OUTPUT(0-15).
Between (CH16-CH31) and OUTPUT(16-31).
Truth table (CH32-CH47) and (CH48-CH63)
1/
2/
A3
A2
A1
A0
EN (32-47)
"ON" Channel 1/
EN (48-63)
"ON" Channel 2/
X
L
L
L
L
L
L
L
L
H
H
H
H
H
H
H
H
X
L
L
L
L
H
H
H
H
L
L
L
L
H
H
H
H
X
L
L
H
H
L
L
H
H
L
L
H
H
L
L
H
H
X
L
H
L
H
L
H
L
H
L
H
L
H
L
H
L
H
H
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
None
CH32
CH33
CH34
CH35
CH36
CH37
CH38
CH39
CH40
CH41
CH42
CH43
CH44
CH45
CH46
CH47
H
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
None
CH48
CH49
CH50
CH51
CH52
CH53
CH54
CH55
CH56
CH57
CH58
CH59
CH60
CH61
CH62
CH63
Between (CH32-CH47) and OUTPUT(32-47).
Between (CH48-CH63) and OUTPUT(48-63).
FIGURE 3. Truth table(s) - Continued. (Device type 02)
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-00502
A
REVISION LEVEL
D
SHEET
15
NOTE: f = 10 kHz, duty cycle = 50%.
FIGURE 4. Switching test waveform(s).
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-00502
A
REVISION LEVEL
D
SHEET
16
FIGURE 5. Block diagram. (Device Type 01)
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-00502
A
REVISION LEVEL
D
SHEET
17
FIGURE 5. Block diagram - Continued. (Device Type 02)
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-00502
A
REVISION LEVEL
D
SHEET
18
TABLE II. Electrical test requirements.
MIL-PRF-38534 test requirements
Subgroups
(in accordance with
MIL-PRF-38534, group A
test table)
Interim electrical parameters
1, 9
Final electrical parameters
1*, 2, 3, 9, 10, 11
Group A test requirements
1, 2, 3, 9, 10, 11
Group C end-point electrical
parameters
1, 2, 3, 9, 10, 11
End-point electrical parameters
for radiation hardness assurance
(RHA) devices
Not applicable
* PDA applies to subgroup 1.
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as
modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form,
fit, or function as described herein.
4.2 Screening. Screening shall be in accordance with MIL-PRF-38534. The following additional criteria shall apply:
a.
b.
Burn-in test, method 1015 of MIL-STD-883.
(1)
Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to either DLA Land and Maritime -VA or the acquiring activity upon request.
Also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance
with the intent specified in test method 1015 of MIL-STD-883.
(2)
TA as specified in accordance with table I of method 1015 of MIL-STD-883.
Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter
tests prior to burn-in are optional at the discretion of the manufacturer.
4.3 Conformance and periodic inspections. Conformance inspection (CI) and periodic inspection (PI) shall be in accordance
with MIL-PRF-38534 and as specified herein.
4.3.1 Group A inspection (CI). Group A inspection shall be in accordance with MIL-PRF-38534 and as follows:
a.
Tests shall be as specified in table II herein.
b.
Subgroups 4, 5, 6, 7, and 8 shall be omitted.
4.3.2 Group B inspection (PI). Group B inspection shall be in accordance with MIL-PRF-38534.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-00502
A
REVISION LEVEL
D
SHEET
19
4.3.3 Group C inspection (PI). Group C inspection shall be in accordance with MIL-PRF-38534 and as follows:
a.
End-point electrical parameters shall be as specified in table II herein.
b.
Steady-state life test, method 1005 of MIL-STD-883.
(1)
Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to either DLA Land and Maritime -VA or the acquiring activity upon request.
Also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance
with the intent specified in test method 1005 of MIL-STD-883.
(2)
TA as specified in accordance with table I of method 1005 of MIL-STD-883.
(3)
Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
4.3.4 Group D inspection (PI). Group D inspection shall be in accordance with MIL-PRF-38534.
4.3.5. Radiation hardness assurance (RHA). RHA qualification is required only for those devices with the RHA designator as
specified herein.
4.3.5.1 Radiation Hardness Assurance (RHA) inspection. RHA qualification is required for those devices with the RHA
designator as specified herein. End-point electrical parameters for radiation hardness assurance (RHA) devices shall be
specified in table II. Radiation testing will be in accordance with the qualifying activity (DLA Land and Maritime -VQ) approved
plan and with MIL-PRF-38534, Appendix G.
a.
The hybrid device manufacturer shall establish procedures controlling component radiation testing, and shall establish
radiation test plans used to implement component lot qualification during procurement. Test plans and test reports
shall be filed and controlled in accordance with the manufacturer's configuration management system.
b.
The hybrid device manufacturer shall designate a RHA program manager to oversee component lot qualification, and
to monitor design changes for continued compliance to RHA requirements.
4.3.5.1.1 Hybrid level RHA qualification. Hybrid level testing is not performed since the only active element other than
diodes is a QML class V RHA-Radhard to level F (300 krad(Si) ELDRS and SEL free device. The hybrid package is a
larger version of the class V flat package on 5962-95630 with a nickel underside lid, seam-sealed and with residual gas
analysis data supporting negligible amounts of hydrogen in the package.
4.3.5.2 Qualification by similarity. The devices on this SMD are considered similar differing only in the number of
5962F9563002V9A die and the supporting diodes, capacitors, and resistors that go with each one.
4.3.5.3 Element level qualification.
4.3.5.3.1 Total ionizing dose irradiation. See SMD 5962-95630.
4.3.5.3.1.1 Single Event Phenomena (SEP). See SMD 5962-95630.
4.3.5.3.1.2 Radiation Lot Acceptance Testing (RLAT). The only active element other than diodes in these devices are
purchased as 5962F9563002V9A. The radiation performance and post radiation electrical specifications in table I of
this drawing are reflective of those specified in 5962-95630 device type 02.
4.3.5.4 Technologies not tested. Testing is not performed on device technologies including diodes, that the
manufacturer considers to be radiation hardened.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-00502
A
REVISION LEVEL
D
SHEET
20
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38534.
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications
(original equipment), design applications, and logistics purposes.
6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractorprepared specification or drawing.
6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated as specified in MIL-PRF38534.
6.4 Record of users. Military and industrial users shall inform DLA Land and Maritime when a system application requires
configuration control and the applicable SMD to that system. DLA Land and Maritime will maintain a record of users and this list
will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices
(FSC 5962) should contact DLA Land and Maritime-VA, telephone (614) 692-8108.
6.5 Comments. Comments on this drawing should be directed to DLA Land and Maritime-VA, Columbus, Ohio 43218-3990,
or telephone (614) 692-1081.
6.6 Sources of supply. Sources of supply are listed in MIL-HDBK-103 and QML-38534. The vendors listed in MIL-HDBK-103
and QML-38534 have submitted a certificate of compliance (see 3.7 herein) to DLA Land and Maritime-VA and have agreed to
this drawing.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-00502
A
REVISION LEVEL
D
SHEET
21
STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 13-05-06
Approved sources of supply for SMD 5962-00502 are listed below for immediate acquisition information only and
shall be added to MIL-HDBK-103 and QML-38534 during the next revisions. MIL-HDBK-103 and QML-38534 will be
revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a
certificate of compliance has been submitted to and accepted by DLA Land and Maritime -VA. This information
bulletin is superseded by the next dated revisions of MIL-HDBK-103 and QML-38534. DLA Land and Maritime
maintains an online database of all current sources of supply at http://www.landandmaritime.dla.mil/Programs/Smcr/.
1/
2/
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
similar
PIN 2/
5962-0050201KXC
5962F0050201KXC
88379
88379
ACT8500-S
ACT8500-901-1S
5962-0050202KXC
5962F0050202KXC
88379
88379
ACT8501-S
ACT8501-901-1S
The lead finish shown for each PIN representing a hermetic package is the most readily available from the
manufacturer listed for that part. If the desired lead finish is not listed contact the Vendor to determine its
availability.
Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the
performance requirements of this drawing.
Vendor CAGE
number
88379
Vendor name
and address
Aeroflex Plainview Incorporated,
(Aeroflex Microelectronic Solutions)
35 South Service Road
Plainview, NY 11803-4193
The information contained herein is disseminated for convenience only and the
Government assumes no liability whatsoever for any inaccuracies in the
information bulletin.