08245

REVISIONS
LTR
DESCRIPTION
DATE (YR-MO-DA)
APPROVED
A
Updated drawing paragraphs. -sld
11-07-21
Charles F. Saffle
B
Sheet 17; added the " FIGURE 4. Read cycle timing diagram." under
the first timing diagram. -sld
12-05-01
Charles F. Saffle
REV
SHEET
REV
B
B
B
B
B
B
B
B
SHEET
15
16
17
18
19
20
21
22
REV STATUS
REV
B
B
B
B
B
B
B
B
B
B
B
B
B
B
OF SHEETS
SHEET
1
2
3
4
5
6
7
8
9
10
11
12
13
14
PMIC N/A
PREPARED BY
Steve Duncan
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
CHECKED BY
Greg Cecil
APPROVED BY
Robert M. Heber
DRAWING APPROVAL DATE
08-10-02
REVISION LEVEL
B
http://www.landandmaritime.dla.mil
MICROCIRCUIT, MEMORY, DIGITAL, 3.3
VOLT BOOT BLOCK FLASH EPROM, 2M X
32-BIT, MONOLITHIC SILICON
SIZE
CAGE CODE
A
67268
SHEET
DSCC FORM 2233
APR 97
1
OF
5962-08245
22
5962-E332-12
1. SCOPE
1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A
choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When
available, a choice of radiation hardness assurance levels are reflected in the PIN.
1.2 PIN. The PIN shall be as shown in the following example:
5962
½
½
½
Federal
stock class
designator
\
½
½
½
RHA
designator
(see 1.2.1)
08245
01
½
½
½
Device
type
(see 1.2.2)
/
H
½
½
½
Device
class
designator
(see 1.2.3)
X
½
½
½
Case
outline
(see 1.2.4)
X
½
½
½
Lead
finish
(see 1.2.5)
\/
Drawing number
1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHA
levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
02
03
04
Generic number
AS8FLC2M32BQT-120/Q
AS8FLC2M32BQT-100/Q
AS8FLC2M32BQT-90/Q
AS8FLC2M32BQT-70/Q
Circuit function
Access time
FLASH EPROM, 2M x 32-bit
FLASH EPROM, 2M x 32-bit
FLASH EPROM, 2M x 32-bit
FLASH EPROM, 2M x 32-bit
120 ns
100 ns
90 ns
70 ns
1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level.
All levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K,
and E) or QML Listing (Class G and D). The product assurance levels are as follows:
Device class
Device performance documentation
K
Highest reliability class available. This level is intended for use in space
applications.
H
Standard military quality class level. This level is intended for use in applications
where non-space high reliability devices are required.
G
Reduced testing version of the standard military quality class. This level uses the
Class H screening and In-Process Inspections with a possible limited temperature
range, manufacturer specified incoming flow, and the manufacturer guarantees (but
may not test) periodic and conformance inspections (Group A, B, C and D).
E
Designates devices which are based upon one of the other classes (K, H, or G)
with exception(s) taken to the requirements of that class. These exception(s) must
be specified in the device acquisition document; therefore the acquisition document
should be reviewed to ensure that the exception(s) taken will not adversely affect
system performance.
D
Manufacturer specified quality class. Quality level is defined by the manufacturers
internal, QML certified flow. This product may have a limited temperature range.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-08245
A
REVISION LEVEL
B
SHEET
2
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
X
Y
Descriptive designator
See figure 1
See figure 1
Terminals
Package style
68
66
Ceramic quad flatpack, lead formed
Pin-Grid-Array (66 HIP)
1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534.
1.3 Absolute maximum ratings. 1/
Supply voltage range (VCC) 2/ ............................................................
Signal voltage range (any pin except A9) 2/ ........................................
Power dissipation (PD).........................................................................
Storage temperature range .................................................................
Lead temperature (soldering, 10 seconds) ..........................................
Data retention ......................................................................................
Endurance (write/erase cycles) ...........................................................
-0.5 V dc to +4.0 V dc
-0.5 V dc to VCC +0.5 V dc
0.33 W maximum at 5 MHz
-65°C to +150°C
+300°C
10 years minimum
100,000 cycles minimum
RESET , OE , and A9 voltage for auto select and sector protect (VID):
............................................................................................................ -0.5 V dc to +12.5 V dc 3/
1.4 Recommended operating conditions.
Supply voltage range (VCC) .................................................................
Input low voltage range (VIL) ...............................................................
Input high voltage range (VIH)..............................................................
Case operating temperature range (TC) ..............................................
+3.0 V dc to +3.6 V dc
-0.5 V dc to +0.8 V dc
+2.2 V dc to VCC + 0.3 V dc
-55°C to +125°C
RESET , OE , and A9 voltage for auto select and sector protect (VID),
(VCC = +3.3 V): ..................................................................................... +11.5 V dc to +12.5 V dc
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
MIL-PRF-38534 - Hybrid Microcircuits, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 - Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.
1/ Stresses above the absolute maximum ratings may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
2/ Minimum DC voltage in input or I/O pins is -0.5 V dc. During voltage transitions, inputs may overshoot VSS to -2.0 V dc for
periods up to 20 ns. Maximum DC voltage on output and I/O pins VCC +0.5 V dc. During voltage transitions, outputs may
overshoot to VCC +2.0 V dc for periods up to 20 ns.
3/ Minimum DC input voltage on RESET , OE , and A9 is -0.5 V dc. During voltage transitions, RESET , OE , and A9 may
overshoot VSS to -2.0 V dc for periods up to 20 ns. Maximum DC input voltage on A9 is +13.5 V which may overshoot
to +14.0 V dc for periods up to 20 ns.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-08245
A
REVISION LEVEL
B
SHEET
3
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 - List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Copies of these documents are available online at https://assist.daps.dla.mil/quicksearch/ or from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in
accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 shall include the performance of all tests herein or as
designated in the device manufacturer's Quality Management (QM) plan or as designated for the applicable device class. The
manufacturer may eliminate, modify or optimize the tests and inspections herein, however the performance requirements as
defined in MIL-PRF-38534 shall be met for the applicable device class. In addition, the modification in the QM plan shall not
affect the form, fit, or function of the device for the applicable device class.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38534 and herein.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Truth table(s). The truth table(s) shall be as specified on figure 3.
3.2.4 Timing diagrams. The timing diagram(s) shall be specified on figures 4, 5, and 6.
3.2.5 Block diagram. The block diagram shall be as specified on figure 7.
3.2.6 Output load circuit. The output load circuit shall be as specified on figure 8.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full specified operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are defined in table I.
3.5 Programming procedure. The programming procedure shall be as specified by the manufacturer and shall be available
upon request.
3.6 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with
the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked.
3.7 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described
herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample,
for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those
which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be
made available to the preparing activity (DLA Land and Maritime -VA) upon request.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-08245
A
REVISION LEVEL
B
SHEET
4
3.8 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this
drawing. The certificate of compliance (original copy) submitted to DLA Land and Maritime -VA shall affirm that the
manufacturer's product meets the performance requirements of MIL-PRF-38534 and herein.
3.9 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of
microcircuits delivered to this drawing.
3.10 Endurance. A reprogrammability test shall be completed as part of the vendor’s reliability monitors. This
reprogrammability test shall be done for the intial characterization and after any design process changes which may affect the
reprogrammability of the device. The methods and procedures may be vendor specific, but shall guarantee the number of
program/erase cycles listed in section 1.3 herein over the full military temperature range as specified herein. The vendors
procedure shall be kept under document control and shall be made available upon request of the acquiring or preparing activity.
3.11 Data retention. A data retention stress test shall be completed as part of the vendor’s reliabilty monitors. This test shall
be done for the intial characterization and after any design or process change which may affect data retention. The methods
and procedures may be vendor specific, but shall gurantee the number of years listed in section 1.3 herein over the full military
temperature range as specified herein. The vendor’s procedure shall be kept under document control and shall be made
available upon request of the acquiring or preparing activity.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-08245
A
REVISION LEVEL
B
SHEET
5
TABLE I. Electrical performance characteristics.
Test
Symbol
Conditions 1/ 2/
-55°C £ TC £+125°C
unless otherwise specified
Group A
subgroups
Device
types
Limits
Min
Unit
Max
DC parameters
Input leakage current
ILI
VCC = 3.6 V dc, VIN = GND
to VCC
1,2,3
All
5
mA
Output leakage current
ILO
VCC = 3.6 V dc, VIN = GND
to VCC
1,2,3
All
5
mA
VCC active current for
read
ICC1
CS = VIL, OE = VIH,
f = 8 MHz, VCC = 3.6 V dc
1,2,3
All
70
mA
120
mA
CS = VIL, OE = VIH,
f = 14 MHz, VCC = 3.6 V dc
VCC active current for
Program or erase 3/
ICC2
CS = VIL, OE = VIH,
VCC = 3.6 V dc
1,2,3
All
140
mA
VCC standby current
ICC3
VCC = 3.6 V dc, CS = VIH,
f = 5 MHz,
1,2,3
All
0.25
mA
RESET = VCC ± 0.3 V
Input low level 3/
VIL
1,2,3
All
-0.5
0.8
V
Input high level 3/
VIH
1,2,3
All
2.2
VCC +
0.3 V
V
Output low voltage
VOL
VCC = 4.5 V dc, IOL = 12.0 mA
1,2,3
All
0.45
V
Output high voltage
VOH
VCC = 4.5 V dc, IOH = -2.0 mA
1,2,3
All
2.4
Low VCC , lockout voltage
VLKO
1,2,3
All
2.3
V
2.5
V
Dynamic characteristics
Address capacitance 3/
CAD
VIN = 0 V dc, f = 1.0 MHz,
TA = +25°C
4
All
40
pF
Output enable
Capacitance
COE
VIN = 0 V dc, f = 1.0 MHz,
TA = +25°C
4
All
40
pF
3/
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-08245
A
REVISION LEVEL
B
SHEET
6
TABLE I. Electrical performance characteristics - Continued.
Test
Symbol
Conditions 1/ 2/
-55°C £ TC £+125°C
unless otherwise specified
Group A
subgroups
Device
types
Limits
Min
Unit
Max
Dynamic characterisitics - continued
Write enable 3/
Capacitance
CWE
VIN = 0 V dc, f = 1.0 MHz,
TA = +25°C
4
All
15
pF
Chip select capacitance 3/
CCS
VIN = 0 V dc, f = 1.0 MHz,
TA = +25°C
4
All
15
pF
Data I/O capacitance 3/
CI/O
VIN = 0 V dc, f = 1.0 MHz,
TA = +25°C
4
All
15
pF
See 4.3.1c
7,8A,8B
All
Functional testing
Functional tests
Read cycle AC timing characteristics
Read cycle time 3/
tRC
See figure 4
9,10,11
01
02
03
04
Address access time
tACC
See figure 4
9,10,11
01
02
03
04
120
100
90
70
ns
Chip select access time
tCE
See figure 4
9,10,11
01
02
03
04
120
100
90
70
ns
Output enable to output valid
tOE
See figure 4
9,10,11
01
02
03
04
40
35
35
30
ns
Output hold from address,
tOH
See figure 4
9,10,11
All
0
ns
tSR/W
See figure 4
9,10,11
All
20
ns
CS or OE change,
Whichever is first
120
100
90
70
ns
3/
Latency between read and
write operations
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-08245
A
REVISION LEVEL
B
SHEET
7
TABLE I. Electrical performance characteristics - Continued.
Test
Symbol
Conditions 1/ 2/
-55°C £ TC £ +125°C
unless otherwise specified
Group A
subgroups
Device
types
Limits
Min
Unit
Max
Write/Erase/ Program AC timing characteristics WE controlled
Write cycle time 3/
tWC
See figure 5
9,10,11
01
02
03
04
120
100
90
70
ns
Chip select setup time
tCS
See figure 5
9,10,11
All
0
ns
Write enable pulse width
tWP
See figure 5
9,10,11
All
35
ns
Address setup time
tAS
See figure 5
9,10,11
All
0
ns
Data setup time
tDS
See figure 5
9,10,11
01,02
45
ns
03
40
04
35
Data hold time
tDH
See figure 5
9,10,11
All
0
ns
Address hold time
tAH
See figure 5
9,10,11
All
45
ns
Write enable pulse width 3/
High
tWPH
See figure 5
9,10,11
All
30
ns
Write/Erase/Program AC timing characteristics CS controlled
Write cycle time 3/
tWC
See figure 6
9,10,11
01
02
03
04
120
100
90
70
ns
Write enable setup time
tWS
See figure 6
9,10,11
All
0
ns
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-08245
A
REVISION LEVEL
B
SHEET
8
TABLE I. Electrical performance characteristics - Continued.
Test
Symbol
Conditions 1/ 2/
-55°C £ TC £ +125°C
unless otherwise specified
Group A
subgroups
Device
types
Limits
Min
Unit
Max
Write/Erase/ Program AC timing characteristics CS controlled - continued
Chip select pulse width
tCP
See figure 6
9,10,11
All
35
ns
Address setup time
tAS
See figure 6
9,10,11
All
0
ns
Data hold time
tDH
See figure 6
9,10,11
All
0
ns
Data setup time
tDS
See figure 6
9,10,11
01,02
45
ns
03
40
04
35
Address hold time
tAH
See figure 6
9,10,11
All
45
ns
Chip select pulse width 3/
High
tCPH
See figure 6
9,10,11
All
30
ns
1/
Unless otherwise specified, 3.0 V dc £ VCC £ 3.6 V dc and VSS = 0 V.
2/
Unless otherwise specified, the DC test conditions are as follows:
Input pulse levels: VIH = VCC - 0.3 V and VIL = 0.3 V.
Unless otherwise specified, the AC test conditions are as follows:
Input pulse levels: VIL = 0 V and VIH = 3.0 V.
Input rise and fall times: 5 nanoseconds.
Input and output timing reference levels: 1.5 V.
3/
Parameters shall be tested as part of device characterization and after design and process changes. Parameters shall
be guaranteed to the limits specified in table I for all lots not specifically tested.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-08245
A
REVISION LEVEL
B
SHEET
9
Case X.
FIGURE 1. Case outline.
FIGURE 1. Case outline(s).
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-08245
A
REVISION LEVEL
B
SHEET
10
Case X - Continued.
Symbol
Millimeters
Inches
Min
Max
Min
Max
A
3.05
3.56
.120
.140
A2
0.13
0.38
.005
.015
B
b
.25 REF
.010 REF
0.15
D/E
0.25
.006
20.32 BSC
.010
.800 BSC
D1/E1
22.10
22.61
.870
.890
D2/E2
24.89
25.40
.980
1.000
e
L
1.27 BSC
0.89
R
.050 BSC
1.14
.035
0.25 TYP
.045
.010 TYP
NOTES:
1. The U.S preferred system of measurement is the metric SI. This item was designed using inch-pound units of
measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound units
shall rule.
FIGURE 1. Case outline(s) – continued.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-08245
A
REVISION LEVEL
B
SHEET
11
Case outline Y.
FIGURE 1. Case outline(s) - Continued.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-08245
A
REVISION LEVEL
B
SHEET
12
Case outline Y - Continued.
Symbol
Millimeters
Inches
Min
Max
Min
Max
A
5.33
6.22
.210
.245
A1
0.64
0.89
.025
.035
qb
0.41
0.51
.016
.020
qb1
1.14
1.40
.045
.055
qb2
1.65
1.91
.065
.075
D/E
29.72
30.48
1.170
1.200
D1/E1
25.40 BSC
1.000 BSC
D2
15.24 BSC
.600 BSC
D3
28.96
e
L
29.21
1.140
2.54 BSC
3.68
1.150
.100 BSC
3.94
.145
.155
NOTES:
1. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of
measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound
units shall rule.
2. Pin 1 is identified by a .070 square pad.
3. Pin numbers are for reference only.
FIGURE 1. Case outlines - Continued.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-08245
A
REVISION LEVEL
B
SHEET
13
Device
types
All
Device
types
All
Device
types
All
Device
types
All
Case
outline
X
Case
outline
X
Case
outline
X
Case
outline
X
Terminal
number
Terminal
symbol
Terminal
number
Terminal
symbol
Terminal
number
Terminal
symbol
Terminal
number
Terminal
symbol
1
GND
18
GND
35
OE
52
GND
2
CS3
19
DQ8
36
CS2
53
DQ23
3
A5
20
DQ9
37
A17
54
DQ22
4
A4
21
DQ10
38
WE 2
55
DQ21
5
A3
22
DQ11
39
WE 3
56
DQ20
6
A2
23
DQ12
40
WE 4
57
DQ19
7
A1
24
DQ13
41
A18
58
DQ18
8
A0
25
DQ14
42
A19
59
DQ17
9
RESET
26
DQ15
43
A20
60
DQ16
10
DQ0
27
VCC
44
DQ31
61
VCC
11
DQ1
28
A11
45
DQ30
62
A10
12
DQ2
29
A12
46
DQ29
63
A9
13
DQ3
30
A13
47
DQ28
64
A8
14
DQ4
31
A14
48
DQ27
65
A7
15
DQ5
32
A15
49
DQ26
66
A6
16
DQ6
33
A16
50
DQ25
67
WE1
17
DQ7
34
CS1
51
DQ24
68
CS4
FIGURE 2. Terminal connections.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
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REVISION LEVEL
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SHEET
14
Device
type
All
Device
type
All
Device
type
All
Device
type
All
Case
outline
4
Case
outline
4
Case
outline
4
Case
outline
4
Terminal
number
Terminal
symbol
Terminal
number
Terminal
symbol
Terminal
number
Terminal
symbol
Terminal
number
Terminal
symbol
1
DQ8
18
A15
35
DQ25
52
NC
2
DQ9
19
VCC
36
DQ26
53
CS3
3
DQ10
20
CS1
37
A7
54
GND
4
A14
21
A19
38
A12
55
DQ19
5
A16
22
DQ3
39
A20
56
DQ31
6
A11
23
DQ15
40
A13
57
DQ30
7
A0
24
DQ14
41
A8
58
DQ29
8
A18
25
DQ13
42
DQ16
59
DQ28
9
DQ0
26
DQ12
43
DQ17
60
A1
10
DQ1
27
OE
44
DQ18
61
A2
11
DQ2
28
A17
45
VCC
62
A3
12
RESET
29
WE1
46
CS4
63
DQ23
13
CS2
30
DQ7
47
NC
64
DQ22
14
GND
31
DQ6
48
DQ27
65
DQ21
15
DQ11
32
DQ5
49
A4
66
DQ20
16
A10
33
DQ4
50
A5
17
A9
34
DQ24
51
A6
NOTE: NC is a no connection
FIGURE 2. Terminal connections. - Continued.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-08245
A
REVISION LEVEL
B
SHEET
15
RESET
CS1
CS2
CS3
L
H
H
H
L
L
H
H
H
L
vcc ±
0.3 v
H
L
H
H
L
H
L
H
H
L
vcc ±
0.3 v
H
H
L
H
L
H
H
L
H
L
vcc ±
0.3 v
X
L
L
L
L
X
X
VID
L
VID
VID
H
H
vcc ±
0.3 v
CS4
H
H
H
L
L
H
H
H
L
L
vcc ±
0.3 v
WE1
WE 2
WE 3
WE 4
OE
OPERATION
ADRESSES
H
H
H
H
L
READ
A0-Ax In
L
H
H
H
L
H
L
H
H
L
H
H
L
H
L
H
H
H
L
L
H
WRITE
A0-Ax In
X
X
X
X
X
X
L
H
H
H
H
H
Standby
Output
Disable
X
X
X
X
X
X
X
Reset
L
L
L
L
L
L
L
H
Sector Protect
L
L
L
L
L
L
L
L
H
Sector
Unprotect
X
X
X
X
X
X
X
X
X
DATA BUS
DQ0-DQ7 Out
DQ8-DQ15 Out
DQ16-DQ31Out
DQ24-DQ31 Out
DQ0-DQ31 Out
DQ0-DQ7 In
DQ8-DQ15 In
DQ16-DQ31 In
DQ24-DQ31In
DQ0-DQ31In
X
X
Sector
Address
A7=L,A2=H,
A1=L
Sector
Address
A7=L,A2=H,
A1=L
Temporary
Sector
Unprotect
DIN, DOUT
DIN, DOUT
AIN
DIN
NOTE: L = logic low = VIL, H = logic high = VIH, VID = 12.0 ±0.5 V, X = Don't Care, AIN = Address In, DOUT = Data Out.
FIGURE 3. Truth table.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-08245
A
REVISION LEVEL
B
SHEET
16
FIGURE 4. Read cycle timing diagram.
FIGURE 4. Read cycle timing diagram.
NOTE: DQ7 of each die including DQ15, DQ23, and DQ31.
FIGURE 5. Write cycle timing diagram, WE controlled.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-08245
A
REVISION LEVEL
B
SHEET
17
NOTE: DQ7 of each die including DQ15, DQ23, and DQ31.
FIGURE 6. Write cycle timing diagram, CS controlled.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-08245
A
REVISION LEVEL
B
SHEET
18
FIGURE 7. Block diagram.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-08245
A
REVISION LEVEL
B
SHEET
19
Parameter
Typ.
Unit
Input pulse level
VIL = 0 V,
VIH = 3.0 V
V
Input rise and fall
5
ns
Input and output reference level
1.5
V
Timing reference level
1.5
V
NOTES:
1. V is programmable from -2 V to +7 V.
Z
2. I
OL
and I
OH
are programmable from 0 to 16 mA.
3. Tester impedance is Z = 50 ohms.
0
4. V is typically the midpoint of V
Z
5. I
OL
OL
and I
OH
and V
.
OH
are adjusted to simulate a typical resistive load circuit.
6. ATE tester includes jig capacitance.
FIGURE 8. Output load circuit.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-08245
A
REVISION LEVEL
B
SHEET
20
TABLE II. Electrical test requirements.
MIL-PRF-38534 test requirements
Subgroups
(in accordance with
MIL-PRF-38534, group A test
table)
Interim electrical parameters
1,4,7,9
Final electrical parameters
1*, 2,3,4,7,8A,8B,9,10,11
Group A test requirements
1,2,3,4,7,8A,8B,9,10,11
Group C end-point electrical
parameters
1,2,3,4,7,8A,8B,9,10,11
End-point electrical parameters
for Radiation Hardness Assurance
(RHA) devices
Not applicable
* PDA applies to subgroup 1.
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as
modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form,
fit, or function as described herein.
4.2 Screening. Screening shall be in accordance with MIL-PRF-38534. The following additional criteria shall apply:
a. Burn-in test, method 1015 of MIL-STD-883.
(1)
(2)
Test condition B. The test circuit shall be maintained by the manufacturer under document revision level control and
shall be made available to either DLA Land and Maritime -VA or the acquiring activity upon request. Also, the test
circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent
specified in test method 1015 of MIL-STD-883.
TA as specified in accordance with table I of method 1015 of MIL-STD-883.
b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests
prior to burn-in are optional at the discretion of the manufacturer.
4.3 Conformance and periodic inspections. Conformance inspection (CI) and periodic inspection (PI) shall be in accordance
with MIL-PRF-38534 and as specified herein.
4.3.1 Group A inspection (CI). Group A inspection shall be in accordance with MIL-PRF-38534 and as follows:
a. Tests shall be as specified in table II herein.
b. Subgroups 5 and 6 shall be omitted.
c. Subgroups 7 and 8 shall include verification of the truth table on figure 3.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-08245
A
REVISION LEVEL
B
SHEET
21
4.3.2 Group B inspection (PI). Group B inspection shall be in accordance with MIL-PRF-38534.
4.3.3 Group C inspection (PI). Group C inspection shall be in accordance with MIL-PRF-38534 and as follows:
a. End-point electrical parameters shall be as specified in table II herein.
b. Steady-state life test, method 1005 of MIL-STD-883.
(1)
Test condition B. The test circuit shall be maintained by the manufacturer under document revision level control and
shall be made available to either DLA Land and Maritime -VA or the acquiring activity upon request. Also, the test
circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent
specified in test method 1005 of MIL-STD-883.
(2)
TA as specified in accordance with table I of method 1005 of MIL-STD-883.
(3)
Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
4.3.4 Group D inspection (PI). Group D inspection shall be in accordance with MIL-PRF-38534.
4.3.5 Radiation Hardness Assurance (RHA) inspection. RHA inspection is not currently applicable to this drawing.
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38534.
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications
(original equipment), design applications, and logistics purposes.
6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractorprepared specification or drawing.
6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated as specified in MIL-PRF38534.
6.4 Record of users. Military and industrial users shall inform DLA Land and Maritime when a system application requires
configuration control and the applicable SMD. DLA Land and Maritime will maintain a record of users and this list will be used
for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962)
should contact DLA Land and Maritime -VA, telephone (614) 692-0544.
6.5 Comments. Comments on this drawing should be directed to DLA Land and Maritime -VA, Columbus, Ohio 43218-3990,
or telephone (614) 692-1081.
6.6 Sources of supply. Sources of supply are listed in MIL-HDBK-103 and QML-38534. The vendors listed in MIL-HDBK-103
and QML-38534 have submitted a certificate of compliance (see 3.7 herein) to DLA Land and Maritime -VA and have agreed to
this drawing.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-08245
A
REVISION LEVEL
B
SHEET
22
STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 12-05-01
Approved sources of supply for SMD 5962-08245 are listed below for immediate acquisition information only and
shall be added to MIL-HDBK-103 and QML-38534 during the next revisions. MIL-HDBK-103 and QML-38534 will be
revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a
certificate of compliance has been submitted to and accepted by DLA Land and Maritime -VA. This bulletin is
superseded by the next dated revisions of MIL-HDBK-103 and QML-38534. DLA Land and Maritime maintains an
online database of all current sources of supply at http://www.landandmaritime.dla.mil/Programs/Smcr.
1/
2/
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-0824501HXA
5962-0824501HXC
5962-0824501HYA
5962-0824501HYC
0EU86
0EU86
0EU86
0EU86
AS8FLC2M32BQ-120/Q
AS8FLC2M32BQ-120/Q
AS8FLC2M32BP-120/Q
AS8FLC2M32BP-120/Q
5962-0824502HXA
5962-0824502HXC
5962-0824502HYA
5962-0824502HYC
0EU86
0EU86
0EU86
0EU86
AS8FLC2M32BQ-100/Q
AS8FLC2M32BQ-100/Q
AS8FLC2M32BP-100/Q
AS8FLC2M32BP-100/Q
5962-0824503HXA
5962-0824503HXC
5962-0824503HYA
5962-0824503HYC
0EU86
0EU86
0EU86
0EU86
AS8FLC2M32BQ-90/Q
AS8FLC2M32BQ-90/Q
AS8FLC2M32BP-90/Q
AS8FLC2M32BP-90/Q
5962-0824504HXA
5962-0824504HXC
5962-0824504HYA
5962-0824504HYC
0EU86
0EU86
0EU86
0EU86
AS8FLC2M32BQ-70/Q
AS8FLC2M32BQ-70/Q
AS8FLC2M32BP-70/Q
AS8FLC2M32BP-70/Q
The lead finish shown for each PIN representing a hermetic package
is the most readily available from the manufacturer listed for that part.
If the desired lead finish is not listed contact the Vendor to determine
its availability.
Caution. Do not use this number for item acquisition. Items acquired to this
number may not satisfy the performance requirements of this drawing.
Vendor CAGE
Number
0EU86
Vendor name
and address
Austin Semiconductor, Incorporated
DBA Micross Components
8701 Cross Park Drive
Suite 105
Austin, TX 78754
The information contained herein is disseminated for convenience only and the
Government assumes no liability whatsoever for any inaccuracies in the
information bulletin.