RHD5927 5962H1220803

REVISIONS
LTR
DESCRIPTION
A
DATE (YR-MO-DA)
APPROVED
13-10-01
Charles F. Saffle
Table I: Corrected the max limit for the test +ICC, changed from "300
µA" to "800 µA". Table I: Added additional test conditions for the
Switch ON resistance test. Updated footnotes in section 1.5. Made
clarifications to table IIIA and table IV. Updated section 4.3.5. -sld
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REV STATUS
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OF SHEETS
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PMIC N/A
PREPARED BY
Steve L. Duncan
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
CHECKED BY
Greg Cecil
APPROVED BY
Charles F. Saffle
DRAWING APPROVAL DATE
13-03-27
REVISION LEVEL
A
http://www.landandmaritime.dla.mil/
MICROCIRCUIT, CMOS, LINEAR, ANALOG
MULTIPLEXER, 8 CHANNEL, +3.3 TO +5
VOLT, MONOLITHIC SILICON
SIZE
A
SHEET
DSCC FORM 2233
APR 97
CAGE CODE
5962-12208
67268
1 OF
19
5962-E573-13
1. SCOPE
1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A
choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When
available, a choice of radiation hardness assurance levels are reflected in the PIN.
1.2 PIN. The PIN shall be as shown in the following example:
5962



Federal
stock class
designator
\
H



RHA
designator
(see 1.2.1)
\/
Drawing number
12208
/
01



Device
type
(see 1.2.2)
K



Device
class
designator
(see 1.2.3)
X



Case
outline
(see 1.2.4)
C



Lead
finish
(see 1.2.5)
1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHA
levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
02
03
Generic number
RHD5928
RHD5929
RHD5927
Circuit function
Analog multiplexer, 8 channel
Analog voltage multiplexer, buffered, 8 channel
Analog multiplexer, sample-and-hold, 8 channel
1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level.
All levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K,
and E) or QML Listing (Class G and D). The product assurance levels are as follows:
Device class
Device performance documentation
K
Highest reliability class available. This level is intended for use in space
applications.
H
Standard military quality class level. This level is intended for use in applications
where non-space high reliability devices are required.
G
Reduced testing version of the standard military quality class. This level uses the
Class H screening and In-Process Inspections with a possible limited temperature
range, manufacturer specified incoming flow, and the manufacturer guarantees (but
may not test) periodic and conformance inspections (Group A, B, C, and D).
E
Designates devices which are based upon one of the other classes (K, H, or G)
with exception(s) taken to the requirements of that class. These exception(s) must
be specified in the device acquisition document; therefore the acquisition document
should be reviewed to ensure that the exception(s) taken will not adversely affect
system performance.
D
Manufacturer specified quality class. Quality level is defined by the manufacturers
internal, QML certified flow. This product may have a limited temperature range.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-12208
A
REVISION LEVEL
A
SHEET
2
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
Descriptive designator
Terminals
See figure 1
16
X
Package style
Flat package with formed leads
1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534.
1.3 Absolute maximum ratings. 1/
Supply voltage (VCC) ..................................................................
Digital input overvoltage range:
VEN , VA (device types 01 and 02) ...........................................
VSH� VA (device type 03) .........................................................
Analog input overvoltage range .................................................
Power dissipation (PD):
Device types 01, 02, and 03 ...................................................
Thermal resistance junction-to-case (θJC) ..................................
Storage temperature ..................................................................
Lead temperature (soldering, 10 seconds) ................................
+7.0 V dc
(< VCC + .4)V, (> GND - .4)V
(< VCC + .4)V, (> GND - .4)V
(< VCC + .4)V, (> GND - .4)V
200 mW
5 °C/W
-65°C to +150°C
+300°C
1.4 Recommended operating conditions.
Supply voltage range (VCC) .......................................................
Logic low level voltage :
VEN,VA (device types 01 and 02) ............................................
VSH� ,VA (device type 03) .........................................................
Logic high level voltage:
VEN,VA (device types 01 and 02) ............................................
VSH� ,VA (device type 03) .........................................................
Case operating temperature range (TC).....................................
+3.0 V to +5.5 V dc
0.3 VCC
0.3 VCC
0.7 VCC
0.7 VCC
-55°C to +125°C
1.5 Radiation features. 2/
Maximum Total Ionizing Dose (TID) ..(dose rate = 50 - 300 rad(Si)/s):
In accordance with MIL-STD-883, method 1019, condition A.
Enhanced Low Dose Rate Sensitivity (ELDRS) .........................
Single Event Latchup (SEL) .......................................................
14
2
Neutron Displacement Damage (> 1 x 10 neutrons/cm ) ........
1/
2/
3/
4/
1 Mrad(Si)
3/
2
> 100 MeV-cm /mg
3/
4/
Stresses above the absolute maximum ratings may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
See section 4.3.5 for the manufacturer's radiation hardness assurance analysis and testing.
Not tested, Immune by 100 percent CMOS technology.
Single Event Latchup (SEL) immunity is accomplished by double, fully enclosing, guard rings in the CMOS design layout.
The guard rings eliminate the parasitic pnpn structure that is responsible for latchup in CMOS circuits. This limit is
guaranteed by design or process, but not tested.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-12208
A
REVISION LEVEL
A
SHEET
3
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
MIL-PRF-38534 - Hybrid Microcircuits, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 - Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 - List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Copies of these documents are available online at http://quicksearch.dla.mil or from the Standardization Document Order
Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in
accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 shall include the performance of all tests herein or as
designated in the device manufacturer's Quality Management (QM) plan or as designated for the applicable device class. The
manufacturer may eliminate, modify or optimize the tests and inspections herein, however the performance requirements as
defined in MIL-PRF-38534 shall be met for the applicable device class. In addition, the modification in the QM plan shall not
affect the form, fit, or function of the device for the applicable device class.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38534 and herein.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Truth table(s). The truth table(s) shall be as specified on figure 3.
3.2.4 Switching test waveform(s). The switching test waveform(s) shall be as specified on figure 4.
3.2.5 Block diagram. The block diagram(s) shall be as specified on figure 5.
3.2.6 Radiation exposure circuits. The radiation exposure circuits shall be maintained by the manufacturer under document
revision level control and shall be made available to the preparing and acquiring activity upon request.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full specified operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are defined in table I.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-12208
A
REVISION LEVEL
A
SHEET
4
3.5 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with
the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked.
3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described
herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample,
for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those
which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be
made available to the preparing activity (DLA Land and Maritime -VA) upon request.
3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this
drawing. The certificate of compliance (original copy) submitted to DLA Land and Maritime -VA shall affirm that the
manufacturer's product meets the performance requirements of MIL-PRF-38534 and herein.
3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of
microcircuits delivered to this drawing.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-12208
A
REVISION LEVEL
A
SHEET
5
TABLE I. Electrical performance characteristics.
Test
Symbol
Supply currents 1/
+ICC
+ISBY
Address input 1/
currents
IAL
IAH
Enable input 1/
current
IENL
Group A
subgroups
Conditions
-55°C ≤ TC ≤ +125°C
VCC = +5 V
unless otherwise specified
1,2,3
���� = 0.3 VCC
EN
Device
types
01
ISH�
IINLK5
Output leakage current
1/
IOUTLK
10
800
µA
0.5
5
03
10
100
µA
01
10
200
µA
02
10
500
1,2,3
VA = 0.3 VCC
1
All
-5
5
2
All
-50
50
1
All
-5
5
2
All
-50
50
1
01,02
-5
5
-50
50
-5
5
-50
50
-5
5
2
-50
50
1
-5
5
2
-50
50
-5
5
-50
50
-5
5
-50
50
-5
5
-50
50
-5
5
-50
50
-5
5
-50
50
VA = 0.7 VCC
VEN = 0.3 VCC
VEN = 0.7 VCC
1
1
VSH� = 0.3 VCC
1
VIN = +5 V, VEN = 0.7 VCC,
output and all unused MUX
inputs under test = 0 V
01,02
03
01,02
2
1
VIN = +5 V, VSH� = 0.7 VCC
IINLK0
Max
���� = 0.7 VCC
EN
VSH� = 0.7 VCC
Input leakage current
(CH0 - CH7) 1/
Min
02
2
Sample-and-Hold input
current
Unit
mA
2
IENH
Limits
03
2
1
VIN = 0 V, VEN = 0.7 VCC, output
and all unused MUX inputs
under test = +5 V
01
2
1
VOUT = +5 V, VEN = 0.7 VCC, All
inputs grounded except
channel being tested
01
2
1
Tri-state, VEN > 0.7 VCC
02
2
nA
nA
nA
nA
nA
nA
nA
nA
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
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COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
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REVISION LEVEL
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SHEET
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TABLE I. Electrical performance characteristics - Continued.
Test
Symbol
Output on voltage
VON1
VON2
VON3
Input load capacitance
CIN
Switch ON 1/
resistance
RDSON
Conditions
-55°C ≤ TC ≤ +125°C
VCC = +5 V
unless otherwise specified
VIN = +5 V, RL = 10 kΩ
VIN = +5 V, RL = 1 kΩ
VIN = +3.3 V, RL = 10 kΩ
Group A
subgroups
VIN = +2.5 V, VEN = 0.3 VCC,
IOUT = -0.6 mA
VIN = +5 V, VEN = 0.3 VCC,
IOUT = -1 mA
Address to output delay
tAHL
tALH
tONEN
tOFFEN
1,2,3
02,03
1,2,3
03
1
2
3
1
2
3
1
2
3
VIN = 0 V, VEN = 0.3 VCC,
IOUT = +1 mA
Device
types
Limits
Unit
Min
Max
4.8
4.35
3.2
5.1
4.65
3.4
V
35
pF
750
1000
500
750
1000
500
750
1000
500
01
Ω
9,11
10
01
10
10
150
200
ns
9,10,11
02,03
1
3
µs
RL = 10 kΩ, CL = 50 pF,
See figure 4
9,11
10
9,10,11
01
10
10
1
150
200
3
ns
RL = 1 kΩ, CL = 50 pF,
See figure 4
9,11
10
9,10,11
01
02
10
10
.8
150
200
2.5
RL = 1 kΩ, CL = 50 pF,
See figure 4
9,10,11
01
10
200
02
100
350
RL = 10 kΩ, CL = 50 pF,
See figure 4
02,03
µs
ns
µs
ns
Droop rate
DR
RL = 1 kΩ, CL = 50 pF,
See figure 4
9,10,11
03
Data setup time
tDS
RL = 1 kΩ, CL = 50 pF,
See figure 4
9,10,11
03
150
ns
Data hold time
tDH
RL = 1 kΩ, CL = 50 pF,
See figure 4
9,10,11
03
150
ns
Output slew rate
tS
9,10,11
02
1.8
1/
0.1
V/s
4
V/µs
These devices have been tested to (2 Mrad(Si)) to Method 1019, condition A of MIL-STD-883 at +25°C for these
parameters to assure the requirements of RHA designator level ‘H” (1Mrad(Si)) are met.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-12208
A
REVISION LEVEL
A
SHEET
7
Case outline X.
Symbol
A
A1
A2
A3
b
c
D
e
e1
E
E1
E2
Inches
Min
Max
.105
.030 REF
.017
.027
.012
.015
.019
.007
.009
.417
.050 BSC
.350 BSC
.300
.394
.419
.346 REF
Millimeters
Min
Max
2.67
0.76 REF
0.43
0.69
0.30
0.38
0.48
0.18
0.23
10.59
1.27 BSC
8.90 BSC
7.62
10.01
10.64
8.79 REF
NOTE:
1. Location of the pin 1 marking. The ESD symbol may be used as the pin 1 marking.
2. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of
measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound
units shall rule.
3. Package and lid are electrically isolated from signal pads.
4. It is recommended that the lid and NC_GND (pin 15) be grounded to prevent ESD or static buildup.
FIGURE 1. Case outline(s).
STANDARD
MICROCIRCUIT DRAWING
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DSCC FORM 2234
APR 97
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REVISION LEVEL
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SHEET
8
Device types
Case outlines
Terminal
number
01 and 02
03
X
Terminal
symbol
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
Terminal
symbol
VOUT
CH7
CH6
CH5
CH4
A2
A1
GND
A0
����
EN
CH0
CH1
CH2
CH3
NC_GND
VCC
VOUT
CH7
CH6
CH5
CH4
A2
A1
GND
A0
�
S/H
CH0
CH1
CH2
CH3
NC_GND
VCC
NOTE: NC_GND should be grounded to prevent ESD or static buildup.
FIGURE 2. Terminal connections.
Truth table (CH0-CH7)
A2
A1
A0
EN 1/
"ON" Channel 2/
X
X
X
H
None 1/
L
L
L
L
L
H
L
L
CH0
CH1
L
L
H
H
L
H
L
L
CH2
CH3
H
H
L
L
L
H
L
L
CH4
CH5
H
H
H
H
L
H
L
L
CH6
CH7
1/ For device types 01 and 02 only.
2/ Between (CH0-CH7) and Vout.
FIGURE 3. Truth table.
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MICROCIRCUIT DRAWING
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DSCC FORM 2234
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FIGURE 4. Switching test waveform(s).
STANDARD
MICROCIRCUIT DRAWING
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FIGURE 4. Switching test waveform(s) - Continued.
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MICROCIRCUIT DRAWING
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DSCC FORM 2234
APR 97
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REVISION LEVEL
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FIGURE 4. Switching test waveform(s) - Continued.
STANDARD
MICROCIRCUIT DRAWING
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DSCC FORM 2234
APR 97
SIZE
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REVISION LEVEL
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FIGURE 5. Block Diagram.
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MICROCIRCUIT DRAWING
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FIGURE 5. Block diagram - Continued.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
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DSCC FORM 2234
APR 97
SIZE
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A
REVISION LEVEL
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TABLE II. Electrical test requirements.
MIL-PRF-38534 test requirements
Subgroups
(in accordance with
MIL-PRF-38534, group A
test table)
Interim electrical parameters
1,9
Final electrical parameters
1*,2,3,9,10,11
Group A test requirements
1,2,3,9,10,11
Group C end-point electrical
parameters
1,2,3,9,10,11
End-point electrical parameters
for radiation hardness assurance
(RHA) devices
1
* PDA applies to subgroup 1.
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as
modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form,
fit, or function as described herein.
4.2 Screening. Screening shall be in accordance with MIL-PRF-38534. The following additional criteria shall apply:
a.
b.
Burn-in test, method 1015 of MIL-STD-883.
(1)
Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to either DLA Land and Maritime -VA or the acquiring activity upon request.
Also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance
with the intent specified in test method 1015 of MIL-STD-883.
(2)
TA as specified in accordance with table I of method 1015 of MIL-STD-883.
Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter
tests prior to burn-in are optional at the discretion of the manufacturer.
4.3 Conformance and periodic inspections. Conformance inspection (CI) and periodic inspection (PI) shall be in accordance
with MIL-PRF-38534 and as specified herein.
4.3.1 Group A inspection (CI). Group A inspection shall be in accordance with MIL-PRF-38534 and as follows:
a.
Tests shall be as specified in table II herein.
b.
Subgroups 4, 5, 6, 7, and 8 shall be omitted.
4.3.2 Group B inspection (PI). Group B inspection shall be in accordance with MIL-PRF-38534.
STANDARD
MICROCIRCUIT DRAWING
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COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
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A
REVISION LEVEL
A
SHEET
15
4.3.3 Group C inspection (PI). Group C inspection shall be in accordance with MIL-PRF-38534 and as follows:
a.
End-point electrical parameters shall be as specified in table II herein.
b.
Steady-state life test, method 1005 of MIL-STD-883.
(1)
Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to either DLA Land and Maritime -VA or the acquiring activity upon request.
Also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance
with the intent specified in test method 1005 of MIL-STD-883.
(2)
TA as specified in accordance with table I of method 1005 of MIL-STD-883.
(3)
Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
4.3.4 Group D inspection (PI). Group D inspection shall be in accordance with MIL-PRF-38534.
4.3.5. Radiation hardness assurance (RHA). RHA qualification is required only for those devices with the RHA designator as
specified herein. See table IIIA and table IIIB.
Table IIIA. Radiation Hardness Assurance Method Table.
RHA
method
employed
NOTES:
X =
G =
(N) =
N/A =
Total Dose Testing
RHA level "H"
(1 Mrad)
Worst Case Analysis Performed
No
End point electricals after
total dose
Element
Level
Hybrid Device
Includes
Combines
Combines End-of-life Element Level
Level
temperature temperature
total dose
and radiation
and
effects
displacement
effects
effects
(2 Mrad)
(2 Mrad)
(See 4.3.5.1.1)
N/A
N/A
N/A
N/A
TC = +25°C
Hybrid device
level
TC = +25°C
Radiation testing done (Level)
Guaranteed by design or process
Not yet tested
Not applicable for this SMD
Table IIIB. Hybrid level and element level test table.
Total Dose
Low Dose Rate High Dose Rate ELDRS
(LDR)
(HDR)
CMOS IC
NOTES:
X =
G =
(N) =
N/A =
G
X
(2 Mrad)
(See 4.3.5.1.1)
G
Radiation Test
Heavy Ion
SET
SEL
(transient) (latch-up)
(N)
G
Proton
Low
High
Energy Energy
(N)
(N)
SEE
(upset)
Neutron
Displacement
Damage (DD)
(N)
G
Radiation testing done (Level)
Guaranteed by design or process.
Not yet tested
Not applicable for this SMD
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-12208
A
REVISION LEVEL
A
SHEET
16
4.3.5.1 Radiation Hardness Assurance (RHA) inspection. RHA qualification is required for those devices with the RHA
designator as specified herein. End-point electrical parameters for radiation hardness assurance (RHA) devices shall be
specified in table II. Radiation testing will be in accordance with the qualifying activity (DLA Land and Maritime -VQ) approved
plan and with MIL-PRF-38534, Appendix G.
a.
The hybrid device manufacturer shall establish procedures controlling component radiation testing, and shall establish
radiation test plans used to implement component lot qualification during procurement. Test plans and test reports
shall be filed and controlled in accordance with the manufacturer's configuration management system.
b.
The hybrid device manufacturer shall designate a RHA program manager to oversee component lot qualification, and
to monitor design changes for continued compliance to RHA requirements.
4.3.5.1.1 Hybrid level RHA qualification. Hybrid level and element level testing are the same for the devices on this Standard
Microcircuit Drawing (SMD) since the active element is accessible to the device leads for test.
4.3.5.1.1.1 Qualification by similarity. The devices on this (SMD) are considered similar for the purpose of RHA testing due to
the device type 5962H1024301KXC being RHA tested for both of these (SMD's), therefore these device types on this SMD are
qualified by similarity.
4.3.5.1.2 Element level qualification.
4.3.5.1.2.1 Total ionizing dose irradiation testing. A minimum of 5 biased devices of the active element used will be tested
every wafer lot. These active elements will be tested at HDR in accordance with condition A of method 1019 of MIL-STD-883 to
2 Mrad(Si) to assure 1 Mrad(Si) for the device parameters as specified in table I herein.
4.3.5.1.2.1.1 Accelerated annealing test. Accelerated annealing tests shall be performed on all devices requiring a RHA level
greater than 5k rads (Si). The post-anneal end-point electrical parameter limits shall be as specified in table I herein and shall be
the pre-irradiation end-point electrical parameter limit at 25°C ±5°C. Testing shall be performed at initial qualification and after
any design or process changes which may affect the RHA response of the device.
4.3.5.2 RHA Lot Acceptance. Each wafer lot of the active element shall be evaluated for acceptance in accordance with MILPRF-38534 and herein.
4.3.5.2.1 Total Ionizing Dose (TID). See paragraph 4.3.5.1.2.1 and 4.3.5.1.2.1.1 herein.
4.3.5.2.2 Enhanced Element Evaluation. Enhanced Element Evaluation per Table IV herein including 45 devices subjected to
Group C2, 1000 hours life testing, is required only for those devices with the RHA designator as specified herein.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-12208
A
REVISION LEVEL
A
SHEET
17
Table IV. Enhanced Element Evaluation For Microcircuit Die.
Subgroup
Class
K
2
X
1
3
4
Test
MIL-STD-883
Method
Condition
2010
X
X
X
Element visual
Assembled into package
as specified in 1.2.4
herein.
Element electrical
Internal visual
Temperature cycling
X
Constant acceleration
2001
X
Burn-in
1015
X
X
Interim electrical
Burn-in
1015
X
X
Post burn-in Final
Electrical, Group A
Steady-state life
1005
5
X
X
Final electrical
Wire bond evaluation
2011
6
X
SEM
2018
Quantity
(accept number)
100 percent
100 percent
2017
1010
100 percent
45(0)
45(0) 2/
C
3000g’s, Y1
direction
160 hours
minimum at
+125°C
Reference
Paragraph
1/
C.3.3.2
C.3.3.1
C.5.5
C.3.3.3
C.5.6
C.3.3.4.3
160 hours
minimum at
+125°C
C.5.10
1000 hours
minimum at
+125°C
10(0) wires or
20(1) wires
See method 2018
of MIL-STD-883
C.3.3.4.3
C.3.3.3
C.3.3.5
C.3.3.6
1/ See MIL-PRF-38534.
2/ Die shall be traceable to the wafer and wafer lot. The sample size shall consist of a minimum of 3 die from each wafer
and a minimum of 45 die from each wafer lot.
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38534.
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications
(original equipment), design applications, and logistics purposes.
6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractorprepared specification or drawing.
6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated as specified in MIL-PRF38534.
6.4 Record of users. Military and industrial users shall inform DLA Land and Maritime when a system application requires
configuration control and the applicable SMD. DLA Land and Maritime will maintain a record of users and this list will be used
for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962)
should contact DLA Land and Maritime -VA, telephone (614) 692-8108.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-12208
A
REVISION LEVEL
A
SHEET
18
6.5 Comments. Comments on this drawing should be directed to DLA Land and Maritime -VA, Columbus, Ohio 43218-3990,
or telephone (614) 692-1081.
6.6 Sources of supply. Sources of supply are listed in MIL-HDBK-103 and QML-38534. The vendors listed in MIL-HDBK-103
and QML-38534 have submitted a certificate of compliance (see 3.7 herein) to DLA Land and Maritime -VA and have agreed to
this drawing.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-12208
A
REVISION LEVEL
A
SHEET
19
STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 13-10-01
Approved sources of supply for SMD 5962-12208 are listed below for immediate acquisition information only and
shall be added to MIL-HDBK-103 and QML-38534 during the next revisions. MIL-HDBK-103 and QML-38534 will be
revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a
certificate of compliance has been submitted to and accepted by DLA Land and Maritime -VA. This information
bulletin is superseded by the next dated revisions of MIL-HDBK-103 and QML-38534. DLA Land and Maritime
maintains an online database of all current sources of supply at http://www.landandmaritime.dla.mil/Programs/Smcr/.
Standard
microcircuit drawing
PIN 1/
1/
2/
Vendor
CAGE
Vendor
similar
PIN 2/
5962-1220801KXA
5962H1220801KXA
5962-1220801KXC
5962H1220801KXC
88379
88379
88379
88379
RHD5928-201-2S
RHD5928-901-2S
RHD5928-201-1S
RHD5928-901-1S
5962-1220802KXA
5962H1220802KXA
5962-1220802KXC
5962H1220802KXC
88379
88379
88379
88379
RHD5929-201-2S
RHD5929-901-2S
RHD5929-201-1S
RHD5929-901-1S
5962-1220803KXA
5962H1220803KXA
5962-1220803KXC
5962H1220803KXC
88379
88379
88379
88379
RHD5927-201-2S
RHD5927-901-2S
RHD5927-201-1S
RHD5927-901-1S
The lead finish shown for each PIN representing a hermetic package is the most readily available from the
manufacturer listed for that part. If the desired lead finish is not listed contact the Vendor to determine its
availability.
Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the
performance requirements of this drawing.
Vendor CAGE
number
88379
Vendor name
and address
Aeroflex Plainview Incorporated,
(Aeroflex Microelectronic Solutions)
35 South Service Road
Plainview, NY 11803-4193
The information contained herein is disseminated for convenience only and the
Government assumes no liability whatsoever for any inaccuracies in the
information bulletin.