MSD2N60

MSD2N60
N-Channel MOSFET
Description
The MSD2N60 is a N-channel enhancement-mode
MOSFET , providing the designer with the best
combination of fast switching, ruggedized device design,
low on-resistance and cost effectiveness. The TO-252
package is universally preferred for all
commercial-industrial applications
Features
• Originative New Design
• Very Low Intrinsic Capacitances
• Excellent Switching Characteristics
• Unrivalled Gate Charge : 9.5nC (Typ.)
• Extended Safe Operating Area
• Lower RDS(ON) : 4.0 Ω (Typ.) @VGS=10V
• 100% Avalanche Tested
• RoHS compliant package
Packing & Order Information
Part No./ R:2,500/Reel
Part No./ T:80/Tube , 4,000/Box
Graphic symbol
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings (Tc=25°C unless otherwise noted)
Symbol
Parameter
Value
Unit
VDSS
Drain-Source Voltage
600
V
VGS
Gate-Source Voltage
±30
V
Continuous Drain Current @ TC=25°C
2
A
Continuous Drain Current @ TC=100°C
1.3
A
ID
Publication Order Number: [MSD2N60]
© Bruckewell Technology Corporation Rev. A -2016
MSD2N60
N-Channel MOSFET
Absolute Maximum Ratings (Tc=25°C unless otherwise noted)
Symbol
Parameter
Value
Unit
IDM
Pulsed Drain Current
8.0
A
dv/dt
Peak Diode Recovery dv/dt
4.5
V/ns
EAS
Single Pulsed Avalanche Energy
120
mJ
EAR
Repetitive Avalanche Energy
5.4
mJ
Power Dissipation (TC=25°C)
23
W
0.18
W
-55 to +150
°C
PD
TJ/TSTG
TL
- Derate above 25°C
Operating Junction and Storage Temperature
Maximum lead temperature for soldering purposes, 1/8'' from
300
case for 5 seconds
• Drain current limited by maximum junction temperature
Thermal Resistance Characteristics
Symbol
Parameter
RθJc
Junction-to-Case
RθJA
Junction-to-Ambient
On Characteristics
Symbol
Test Conditions
Maximum
Units
2.87
°C/W
50
Min
Typ.
Max.
Units
VGS
VDS = VGS, ID = 250μA
2.0
--
4.0
V
RDS(ON)
VGS = 10 V , ID = 3.5 A
--
4.0
4.7
Ω
Min
Typ.
Max.
Units
600
--
--
V
--
0.6
--
V/°C
--
--
10
μA
Off Characteristics
Symbol
Test Conditions
BVDSS
VGS = 0 V , ID = 250 μA
△BVDSS /△TJ
ID = 250μA, Referenced to 25°C
IDSS
VDS = 600 V , VGS = 0 V
VDS = 480 V , TC = 125°C
100
IGSSF
VGS = 30 V, VDS = 0 V
--
--
100
nA
IGSSR
VGS = -30 V, VDS = 0 V
--
--
-100
nA
Min
Typ.
Max.
Units
--
320
420
pF
--
35
46
pF
--
4.5
6.0
pF
Dynamic Characteristics
Symbol
Test Conditions
CISS
COSS
VDS = 15 V, VGS = 0 V,
F = 1.0MHz
CRSS
Publication Order Number: [MSD2N60]
© Bruckewell Technology Corporation Rev. A -2016
MSD2N60
N-Channel MOSFET
Switching Characteristics
Symbol
Test Conditions
td(on)
Min
Typ.
Max.
Units
--
8
30
ns
tr
VDS = 300 V, ID = 2 A,
--
23
60
ns
td(off)
RG = 25 Ω
--
25
60
ns
--
28
70
ns
--
9.5
13
nC
--
1.6
--
nC
--
4.0
--
nC
Min
Typ.
Max.
Units
IS
--
--
2.0
ISM
--
--
6.0
--
--
1.4
V
--
230
--
ns
--
1.0
--
nC
tf
Qg
Qgs
VDS = -480 V , ID = 2 A,
VGS = 10 V
Qgd
Source-Drain Diode Maximum Ratings and Characteristics
Symbol
Test Conditions
VSD
trr
Qrr
A
IS = 2 A , VGS = 0 V
IS = 2 A , VGS = 0 V , dIF/dt=100A/μs
Notes:
1. Repetitive Rating : Pulse width limited by maximum junction temperature
2. IAS=2.0A, VDD=50V, RG=25Ω, Starting TJ =25°C
3. ISD≤2.0A, di/dt≤300A/μs, VDD≤BVDSS , Starting TJ =25 °C
4. Pulse Test : Pulse Width ≤ 300μs, Duty Cycle ≤ 2%
5. Essentially Independent of Operating Temperature
■Characteristics Curve
Publication Order Number: [MSD2N60]
© Bruckewell Technology Corporation Rev. A -2016
MSD2N60
N-Channel MOSFET
FIG.1-ON REGION CHARACTERISTICS
FIG.2-TRANSFER CHARACTERISTICS
FIG.3-ON RESISTANCE VARIATION VS DRAIN
FIG.4-BODY DIODE FORWARD VOLTAGE VARIATION
CURRENT AND GATE VOLTAGE
WITH SOURCE CURRENT AND TEMPERATURE
FIG.5-CAPACITANCE CHARACTERISTICS
FIG.6-GATE CHARGE CHARACTERISTICS
Publication Order Number: [MSD2N60]
© Bruckewell Technology Corporation Rev. A -2016
MSD2N60
N-Channel MOSFET
■Characteristics Curve
FIG.7-BREAKDOWN VOLTAGE
VARIATION VS TEMPERATURE
FIG.8-ON-RESISTANCE VARIATION VS
TEMPERATURE
FIG.9-MAXIMUM SAFE OPERATING AREA
FIG.10-MAXIMUM DRAIN CURRENT VS CASE
TEMPERATURE
FIG.11-TRANSIENT THERMAL RESPONSE CURVE
Publication Order Number: [MSD2N60]
© Bruckewell Technology Corporation Rev. A -2016
MSD2N60
N-Channel MOSFET
■Characteristics Test Circuit & Waveform
FIG.12-RESISTIVE SWITCHING TEST CIRCUIT & WAVEFORMS
FIG.13-GATE CHARGE TEST CIRCUIT & WAVEFORM
FIG.14-UNCLAMPED LINDUCTIVE SWITCHING TEST CIRCUIT & WAVEFORMS
Publication Order Number: [MSD2N60]
© Bruckewell Technology Corporation Rev. A -2016
MSD2N60
N-Channel MOSFET
Fig 15. Peak Diode Recovery dv/dt Test Circuit & Waveforms
Publication Order Number: [MSD2N60]
© Bruckewell Technology Corporation Rev. A -2016
MSD2N60
N-Channel MOSFET
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE
WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Bruckewell Technology Inc., its affiliates, agents, and employees, and all persons acting on its or
their behalf (collectively, “Bruckewell”), disclaim any and all liability for any errors, inaccuracies or
incompleteness contained in any datasheet or in any other disclosure relating to any product.
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Bruckewell’s knowledge of typical requirements that are often placed on Bruckewell products in
generic applications.
Such statements are not binding statements about the suitability of products for a particular
application. It is the customer’s responsibility to validate that a particular product with the properties
described in the product specification is suitable for use in a particular application. Parameters
provided in datasheets and/or specifications may vary in different applications and performance
may vary over time.
Product specifications do not expand or otherwise modify Bruckewell’s terms and conditions of
purchase, including but not limited to the warranty expressed therein.
Publication Order Number: [MSD2N60]
© Bruckewell Technology Corporation Rev. A -2016