SIGC101T170R3 3 IGBT Chip FEATURES: • 1700V Trench + Field Stop technology • low turn-off losses • short tail current • positive temperature coefficient • easy paralleling Chip Type SIGC101T170R3 VCE ICn 1700V 75A This chip is used for: • power module C Applications: • drives G Die Size Package 10.03 x 10.03 mm2 sawn on foil E Ordering Code Q67050A4188-A001 MECHANICAL PARAMETER: Raster size Emitter pad size 10.03 x 10.03 mm 8 x ( 3.82 x 1.75 ) Gate pad size 1.18 x 1.09 Area total / active 100.6 / 75.3 mm Thickness 190 µm Wafer size 150 mm Flat position 90 grd Max.possible chips per wafer 136 pcs Passivation frontside Photoimide Emitter metalization 3200 nm AlSiCu Collector metalization Die bond Wire bond Reject Ink Dot Size Recommended Storage Environment 1400 nm Ni Ag –system suitable for epoxy and soft solder die bonding electrically conductive glue or solder Al, <500µm ∅ 0.65mm ; max 1.2mm store in original container, in dry nitrogen, < 6 month at an ambient temperature of 23°C Edited by INFINEON Technologies AI PS DD HV3, L 7771-A, Edition 2, 04.09.03 2 SIGC101T170R3 MAXIMUM RATINGS: Parameter Symbol Value Unit 1700 V 1) A Collector-emitter voltage, Tj=25 °C V CE DC collector current, limited by Tjmax IC Pulsed collector current, tp limited by Tjmax Icpuls 225 A Gate emitter voltage V GE ±20 V Operating junction and storage temperature Tj, Ts t g -55 ... +150 °C 1) depending on thermal properties of assembly STATIC CHARACTERISTICS (tested on chip), Tj=25 °C, unless otherwise specified: Parameter Symbol Value Conditions min. Unit typ. max. Collector-emitter breakdown voltage V(BR)CES VGE=0V , IC= 3mA 1700 Collector-emitter saturation voltage VCE(sat) VGE=15V, IC =75A 1.6 2 2.4 Gate-emitter threshold voltage VGE(th) IC =3mA , VGE=VCE 5.2 5.8 6.4 Zero gate voltage collector current ICES VCE=1700V , VGE=0V 4.33 µA Gate-emitter leakage current IGES VCE=0V , VGE=20V 600 nA Integrated gate resistor RGint V Ω 8.5 ELECTRICAL CHARACTERISTICS (tested at component): Parameter Symbol Conditions Value min. typ. Input capacitance Ci s s V C E= 2 5 V , Output capacitance Co s s V GE= 0 V , 277 Reverse transfer capacitance Cr s s f =1MHz 220 max. 6638 Unit pF SWITCHING CHARACTERISTICS (tested at component), Inductive Load Parameter Symbol Conditions 1) Value min. typ. Turn-on delay time t d(on) Tj= 1 2 5 ° C 0.40 Rise time tr V C C = 90 0 V , 0.05 IC=75A, Turn-off delay time td(off) V GE= - 1 5 / 1 5 V , 0.80 Fall time tf R G = 6 . 8Ω 0.30 1) values also influenced by parasitic L- and C- in measurement and package. Edited by INFINEON Technologies AI PS DD HV3, L 7771-A, Edition 2, 04.09.03 max. Unit µs SIGC101T170R3 CHIP DRAWING: Edited by INFINEON Technologies AI PS DD HV3, L 7771-A, Edition 2, 04.09.03 SIGC101T170R3 FURTHER ELECTRICAL CHARACTERISTICS: This chip data sheet refers to the device data sheet tbd DESCRIPTION: AQL 0,65 for visual inspection according to failure catalog Electrostatic Discharge Sensitive Device according to MIL-STD 883 Test-Normen Villach/Prüffeld Published by Infineon Technologies AG, Bereich Kommunikation St.-Martin-Strasse 53, D-81541 München © Infineon Technologies AG 2002 All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as warranted characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Representatives world-wide (see address list). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and / or maintain and sustain and / or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Edited by INFINEON Technologies AI PS DD HV3, L 7771-A, Edition 2, 04.09.03