Silicon Spreading Resistance Temperature Sensor in Robust Threaded Metal Housing KTY 19-6 M/Z Features • Temperature dependent Resistor with Positive Temperature Coefficient • Selected at 25 ˚C, R25 = 2000 Ω ± 1% • Corrosion resistant stainless steel housing with connector socket • Fast response • High long-term stability • excellent linearity • Robust threaded housing • Mating splash-proof connector set available Test voltage: Isolation voltage: Test duration: Insertion torque: Type Marking 1000 V ~ 100 V ~ 1s max. 30 Nm Thread Ordering Code KTY 19-6M KTY 19M ISO M10x1 KTY 19-6Z KTY 19Z NPTF Q627051/8" × 27 K272 Connector Set – (Splash-proof) – Q62705K271 Q62901B80 Pin Configuration 1 Package 2 electrical electrical BSS303 contact contact DIN 1.4305 electrical electrical stainless contact contact steel – – housing: potential free Absolute Maximum Ratings Parameter Symbol Limit Values Unit Maximum operating voltage 1) TA ≤ 25 ˚C, t ≤ 10 ms Vopmax 25 V Maximum operating current Iopmax Iopp 5 mA 7 mA Top Tstg − 50 … + 150 ˚C − 50 … + 150 ˚C Peak operating current TA ≤ 25 ˚C, t ≤ 10 ms Operating temperature range Storage temperature range 1) ESD Class 1. When the temperature sensor is operated with long supply leads, it should be protected through the parallel connection of a > 10 nF capacitor to prevent damage to the sensor through induced voltage peaks. Semiconductor Group 1 1997-10-01 KTY 19-6 M/Z Electrical Characteristics at TA = 25 ˚C unless otherwise specified Parameter Symbol Limit Values min. typ. Unit max. Ω R25 Temperature sensor resistance IB = 1 mA KTY 19-6M/Z 1980 Thermal time constant (63 % of ∆TA) in still air in still oil (Freon FC40/PP7) 2020 s τair τoil − − − − 40 4 Package Outline Stainless Steel Housing, BSS303 (equiv. DIN 1.4305) 48.6 ±0.5 9 SW17 6 12 12 5 17 b 45˚ No undercut Plug-in socket connects with AMP Junior Timer a 13.5 5 30 M10x1 or NPTF 1/8x27 Ø3.8 SW17 Spade terminals A2.8x0.8 DIN 46244 without hole GMX05639 Dimensions in mm Weight approx. 20 g Exterior Packaging I.e. tubes, trays, boxes are shown in our Data Book “Package Information”. Semiconductor Group 2 1997-10-01