PRODUCT BULLETIN Generic Copy 17 Dec 2007 SUBJECT: ON Semiconductor Product Bulletin # 16076 TITLE: Discontinuance of Dry Pack for NCP1606xDR2G Products PROPOSED FIRST SHIP DATE: 01 Jan 2008 AFFECTED PRODUCT DIVISION: Automotive and Power Regulation Group (APRG) FOR ANY QUESTIONS CONCERNING THIS NOTIFICATION: Contact your local ON Semiconductor sales office or Scott Brow <[email protected]> NOTIFICATION TYPE: ON Semiconductor considers this change approved unless specific conditions of acceptance are provided in writing. To do so, contact your local ON Semiconductor sales office. DESCRIPTION AND PURPOSE: The NCP1606xDR2G has recently been qualified at MSL 1 @ 260C level. 1 Production lot has passed MSL 1 @ 260C Preconditioning and reliability testing. Results are shown here: Pre-Conditioned AutoClave – 121C/100%RH/15psig Pre-Conditioned Temp Cycle - -65C to +150C Pre-Conditioned UHAST – 130C/85%RH/18.8psig High Temperature Storage – 150C High Temp Operating Life – Ta = 125C, Vcc = 18V 0/80 at 96hrs 0/80 at 500cycles 0/80 at 96hrs 0/80 at 504hrs 0/80 at 504hrs These devices were previously qualified to MSL 3 which required the use of Dry Packaging Techniques. Effective Jan 1, 2008, dry packing will be discontinued for these devices and the products will be shipped per MSL 1 packaging. AFFECTED DEVICE LIST NCP1606ADR2G NCP1606BDR2G Issue Date: 17 Dec 2007 Rev.07-02-06 Page 1 of 1