LTM9011-BGA-PBF 140LD 11.25mm X 9mm X 2.72mm (TABLE OF MATERIAL DECLARATION) The LTM9011 is RoHS compliant per EU RoHS Directive 2003/95/EC. It contains less than 100ppm cadmium (Cd) and less than 1,000ppm of each - lead (Pb), mercury (Hg), hexavalent chromium (Cr+), polybrominated biphenyl (PBB) and polybrominated diphenyl ether (PBDE) Material Mass Component Materials Analysis (element) CAS Number No. Part Name Material Name (gram) Weight (gram) Barium Compounds 7727-43-7 0.00259 0.0954 1 Substrate Circuit Board Bismaleimide/Triazine/Resin/Filler Substance(Silica 105391-33-1,1156-51-0/9003-36-5/21645-510.01746 Crystalline) 2 Copper Metal 7440-50-8 0.06308 Copper Compounds 1328-53-6 0.00002 Ecotoxic substances 7440-38-2, 7440-28-0 0.00001 Gold metal or alloy 7440-57-5 0.00030 Nickel 7440-02-0 0.00191 Zinc 7440-66-6 0.00015 Continuous Filament Fiber Glass 65997-17-3 0.00948 Chromium(III) Oxide 1308-38-9 0.00000 Silica amorphous 7631-86-9 0.00005 Talc;not containing fibers like asbestos 14807-96-9 0.00030 Cyanoguanidine 461-58-5 0.00001 Calcium caobonate 471-34-1 0.00000 Solder Paste 2 Alloy 0.0045 Sn 7440-31-5 0.00425 Sb 7440-36-0 0.00022 0.0002 3 Epoxy I Di-ester resin non-disclosure 0.00002 Functionalized ester non-disclosure 0.00002 Silver 7440-22-4 0.00014 Epoxy II 0.0010 4 Ethyl acetate 112-15-2 0.00029 Phenol bis polymer 25036-25-3 0.00029 Bisphenol-A 25068-38-6 0.00019 epoxy resin Aromatic amine Proprietary non-disclosure 0.00019 5 Passive/Active 0.0308 7440-50-8 0.00986 Copper (Cu) Components 7440-02-0 0.00246 Nickel (Ni) 7440-31-5 0.00074 Tin (Sn) 12047-27-7 0.01774 Ceramic (Ba) Compounds 6 Active Ics Silicon 0.0106 Silicon 7440-21-3 0.01062 7 Wire Gold 0.0064 Au 7440-57-5 0.00636 Sn SAC305 0.0674 8 Solder Ball 7440-31-5 0.06502 Ag 7440-22-4 0.00202 Cu 7440-50-8 0.00034 Epoxy Resin 0.3786 9 Encapsulation Fused Silica 60676-86-0 0.29230 Epoxy Resin non-disclosure 0.03370 Phenol Resin non-disclosure 0.03370 Crytalline Silica 14808-60-7 0.01136 Carbon Black 1333-86-4 0.00189 Metal Hydroxide non-disclosure 0.00568 Total Package Weight 0.5948 Note: Composition derived from MSDS and material C of C from Vendors Component Weight based on assembly of generic parts Materials Analysis (weight %) 2.72 18.31 66.14 0.02 0.02 0.31 2.00 0.16 9.94 0.01 0.06 0.31 0.01 0.00 95.00 5.00 10.00 10.00 80.00 30.00 30.00 20.00 20.00 32.00 8.00 2.40 57.60 100.00 99.99 96.50 3.00 0.50 77.20 8.90 8.90 3.00 0.50 1.50