9TX 048 TFBGA8x10x12 SAC

Compliant with IEC 62474/ D9.00
Compliant to IEC 61249-2-21:2003
Termination Base Alloy:
Copper Alloy (Cu)
Semiconductor Device Type: B1KE / CC
JEDEC 97
Product Marking
and/or Pkg.
Labeling
e1
Package Homogeneous Materials:
8.1 Electronics (e.g. pc boards, displays)
(9TX) 048 TFBGA 8x10x1.2mm SAC
Basic Substance
CAS Number
"Contained In"
Sub-Component
% Total
Weight
mg/part
ppm
FUSED SILICA
60676-86-0
Mold Compound
38.981
55.509
389,810
EPOXY RESINS, CURED
Trade Secret
Mold Compound
4.905
6.984
49,048
HIGH CROSS-LINKED HIGH MOLECULAR EPOXY / EPOXY PHENOL RESIN
Trade Secret
Mold Compound
4.905
6.984
49,048
CRYSTALLINE SILICA
CARBON BLACK
Copper
Glass fibers
Phenol, formaldehyde, (chloromethyl)oxirane polymer
Silica, chemically prepared
14808-60-7
1333-86-4
7440-50-8
65997-17-3
9003-36-5
7631-86-9
Mold Compound
Mold Compound
Lead Frame
Lead Frame
Lead Frame
Lead Frame
1.258
0.252
8.052
4.800
4.800
1.794
1.791
0.358
11.467
6.835
6.835
2.555
12,580
2,515
80,524
48,000
48,000
17,944
Nickel
7440-02-0
Lead Frame
0.875
1.246
8,748
Barite
7727-43-7
Lead Frame
0.561
0.799
5,608
Magnesium silicate
Araldite GY 250
(2-Methoxymethylethoxy)propanol
Misc.
14807-96-6
25068-38-6
34590-94-8
system
Lead Frame
Lead Frame
Lead Frame
Lead Frame
0.449
0.449
0.179
0.336
0.639
0.639
0.256
0.479
4,486
4,486
1,794
3,365
Aluminium-hydroxide-oxide
24623-77-6
Lead Frame
0.112
0.160
1,122
Gold
7440-57-5
Lead Frame
0.022
0.032
224
Silver
7440-22-4
Die Attach
0.552
0.786
5,520
Basic Duromer:Phenolic resin (Compound of polymeric network)
Silicon
Doped Gold
Tin
26834-02-6
7440-21-3
7440-57-5
7440-31-5
Die Attach
Chip (Die)
Wire Bond
Plating on external leads (pins)
0.138
7.650
0.860
17.257
0.197
10.894
1.225
24.574
1,380
76,500
8,600
172,569
Silver
7440-22-4
Plating on external leads (pins)
0.723
1.029
7,228
Copper
7440-50-8
Plating on external leads (pins)
0.090
100.000
0.129
142.400
904
1,000,000
TOTALS:
71.63
(mg) Total
Mold Compound
FUSED SILICA
EPOXY RESINS,
CURED
HIGH CROSS-LINKED
HIGH MOLECULAR
EPOXY / EPOXY
PHENOL RESIN
CRYSTALLINE SILICA
CARBON BLACK
77.50
Trade Secret
9.75
Trade Secret
9.75
14808-60-7
1333-86-4
(mg) Total
Copper
Glass fibers
Phenol, formaldehyde,
(chloromethyl)oxirane
polymer
Silica, chemically
prepared
Nickel
Barite
Magnesium silicate
Araldite GY 250
(2-Methoxymethylethoxy)
propanol
Misc.
Aluminium-hydroxideoxide
Gold
Lead Frame
7440-50-8
65997-17-3
(mg) Total
Silver
Basic Duromer:Phenolic
resin (Compound of
polymeric network)
21.40
7631-86-9
7440-02-0
7727-43-7
14807-96-6
25068-38-6
8.00
3.90
2.50
2.00
2.00
34590-94-8
system
0.80
1.50
24623-77-6
7440-57-5
0.1424 g Total Mass
(mg) Total
Die Attach
7440-22-4
26834-02-6
7440-21-3
1.22
(mg) Total
If a chemical substance is absent from the list above, the chemical substance is NOT an intentional ingredient in the semiconductor device and, to the best of Microchip Technology
Incorporated's knowledge and belief as of the date of this document, there is no credible reason to believe that the unavoidable impurity concentration of the chemical substance, if any, is
not below the threshold of regulatory concern for any regulatory scheme world-wide.
Doped Gold
% of Total Weight
7440-57-5
100.00
Plating on external
leads (pins)
Microchip Technology Incorporated believes the information in this form concerning substances restricted by RoHS in Microchip Technology Incorporated’s semiconductor devices in their
original packing materials is true and correct to the best of its knowledge and belief, as of the date listed in this form. Microchip Technology Incorporated cannot guarantee the
completeness and accuracy of data in this form because it has been compiled based on the ranges provided in Material Safety Data Sheets provided by raw material suppliers. Supplier
information is often protected from disclosure as trade secrets and some information may not have been provided by subcontract assemblers and raw material suppliers. Information is
provided only as estimates of the average weight of these parts and the average weight of anticipated significant toxic metals components. These estimates do not include trace levels of
dopants, metals, and non-metal materials contained within silicon devices (silicon IC) in the finished parts.
Tin
7440-31-5
95.50
Microchip Technology Incorporated does not provide any warranty, express or implied, with respect to the information provided in this declaration. The exclusive, limited product warranties
provided by Microchip Technology Incorporated and its subsidiaries are contained in Microchip’s standard terms and conditions of sale. These are provided in Microchip’s quotations, sales
order acknowledgement, and invoices.
Silver
7440-22-4
4.00
Copper
7440-50-8
0.50
Total
Assembled package referenced above is EU REACH compliant based on the latest SVHC candidate list of ECHA which can be found at
http://echa.europa.eu/web/guest/candidate-list-table
0.86
100.00
(mg) Total
Microchip disclaims any duty to notify users of updates or changes to Material Content Declarations and shall not be liable for any damages, direct or indirect, consequential or otherwise,
suffered by users or third parties as a result of the users’ reliance on the information in Material Content Declarations (MCD) or independent third party test reports (SGS) or of this
Certificate of Compliance for semiconductor products.
7.65
100.00
Total
25.73
0.69
100
Wire Bond
Molding compounds used by Microchip meet the UL94 V0 flammability standard for plastics. You can access the UL iQTM family of databases to obtain a test report at
http://ul.com/global/eng/pages/offerings/industries/chemicals/plastics/
The protective “tubes” in which the specific product is shipped are made from polyvinyl chloride (PVC) plastic. “Window envelopes” used to hold the packing slip on the outer box and
certain “reels” may be made from PVC plastic.
100.00
% of Total Weight
Total
This semiconductor device and its homogenous materials comply with EU Directives: 2002/95/EC (27 January 2003) & Directive 2011/65/EU (08 June 2011) and 2015/863/EU (31 March 2015)
and 2002/53/EC (End-of-Life Vehicles (ELV) without exemption (zero)
Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
100.00
% of Total Weight
80.00
20.00
Chip (Die)
Doped Silicon
22.43
0.50
0.10
Total
10.89
100.00
% of Total Weight
35.90
21.40
9003-36-5
Total
0.98
50.3
2.50
0.50
Total
31.94
% ot Total Weight
60676-86-0
% of Total Weight
18.07
100.00
142.40
Au
100.00
10:31 AM : 8/17/2015
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