Final Product/Process Change Notification Document # : FPCN20386XB Issue Date: 15 February 2016 Title of Change: Qualification of ON Semiconductor Vietnam (OSV) for the Assembly and Test of the listed SCR products in DPAK package. Proposed first ship date: 22 May 2016 Contact information: Contact your local ON Semiconductor Sales Office or <[email protected]> Samples: Contact your local ON Semiconductor Sales Office or <[email protected]> Additional Reliability Data: Contact your local ON Semiconductor Sales Office or <[email protected]> Type of notification: This is a Final Product/Process Change Notification (FPCN) sent to customers. FPCNs are issued 90 days prior to implementation of the change or earlier upon customer approval. ON Semiconductor will consider this change accepted, unless an inquiry is made in writing within 30 days of delivery of this notice. To do so, contact <[email protected]>. Change Part Identification: Products from ON Semiconductor Vietnam (OSV) will be marked with site code “VN” prior to date code. Change category: ☐ Wafer Fab Change ☒ Assembly Change ☒ Test Change Change Sub-Category(s): ☒ Manufacturing Site Change/Addition ☐ Manufacturing Process Change ☐ Other _______________ ☐ Material Change ☐ Product specific change ☐ Datasheet/Product Doc change ☐ Shipping/Packaging/Marking ☐ Other: _______________________ ☒ ON Semiconductor site(s) : ☐ External Foundry/Subcon site(s) Sites Affected: ☐ All site(s) ☐ not applicable ON Dong Nai Province, Vietnam ON Seremban, Malaysia Description and Purpose: This is an updated notification of FPCN 20386 issued on 20th Feb, 2014 to include additional SCR devices. This FPCN announces the planned capacity expansion of ON Semiconductor’s assembly and test operations of DPAK discrete packaged products, currently built at ON Semiconductor Seremban, Malaysia facility to ON Semiconductor Vietnam (OSV). Upon the expiration of this FPCN, SCR devices may be processed at either location. These products have been qualified to commodity/commercial requirements. These products will continue being Pb-free, Halide free and RoHS compliant. Reliability Data Summary: QV DEVICE NAME: MCR12DSNT4G PACKAGE: DPAK Test Specification Condition Interval Results HTRB JESD22-A108 Ta= 90°C, 80% max rated V 1008 hrs 0/84 HTSL JESD22-A103 Ta= 150°C 1008 hrs 0/84 IOL MIL-STD-750 (M1037) AEC-Q101 Ta= +25°C, delta Tj= 100°C On/off = 2min 15000 cyc 0/84 TC JESD22-A104 Ta= -65°C to +150°C 1000 cyc 0/84 H3TRB JESD22-A101 85°C, 85% RH, 18.8psig, bias 1008 hrs 0/84 AC JESD22-A102 121°C, 100% RH, 15psig, unbiased 96 hrs 0/84 PC J-STD-020 JESD-A113 MSL 1 @ 260°C 0/336 RSH JESD22- B106 Ta= 265°C, 10 sec 0/30 SD JSTD002 Ta= 245°C, 10 sec 0/15 TEM001092 Rev. F Page 1 of 2 Final Product/Process Change Notification Document # : FPCN20386XB Issue Date: 15 February 2016 Electrical Characteristic Summary: Electrical characteristics are not impacted. List of Affected Standard Parts: Part Number TEM001092 Rev. F Qualification Vehicle MCR12DCMT4G MCR12DSNT4G MCR8DCNT4G MCR12DSNT4G MCR8DSNT4G MCR12DSNT4G Page 2 of 2