TC1306 DATA SHEET (02/15/2007) DOWNLOAD

Obsolete Device
TC1306
Dual 150mA CMOS LDO With Select Mode™ Operation,
Shutdown and RESET Output
Features
General Description
• Extremely Low Supply Current for Longer Battery
Life
• Select Mode™ Operation: Selectable Output
Voltages for High Design Flexibility
• Very Low Dropout Voltage
• 10μsec (Typ.) Wake-Up Time from SHDN
• Maximum 150mA Output Current per Output
• High Output Voltage Accuracy
• Power-Saving Shutdown Mode
• RESET Output Can Be Used as a Low Battery
Detector or Processor Reset Generator
• Over Current Protection and Over Temperature
Shutdown
• Space Saving 8-Pin MSOP Package
The TC1306 combines two CMOS Low Dropout Regulators and a Microprocessor Monitor in a space saving
8-Pin MSOP package. Designed specifically for battery
operated systems, total supply current is typically
120μA at full load, 20 to 60 times lower than in bipolar
regulators.
Applications
•
•
•
•
•
•
•
Load Partitioning
Battery Operated Systems
Portable Computers
Medical Instruments
Instrumentation
Pagers and Cellular/GSM/PHS Phones
Linear Post-Regulator for SMPS
Device Selection Table
Part Number
Junction
Temperature
Range
Package
TC1306R-BDVUA
8-Pin MSOP -40°C to +125°C
NOTE: “R” denotes the suffix for the 2.63V RESET threshold.
“B” indicates VOUT1 = 1.8V (fixed).
“D” indicates VOUT2 = 2.8V, 3.0V (selectable).
Other output voltages are available. Please contact Microchip
Technology Inc. for details.
The TC1306 features selectable output voltages for
higher design flexibility. The dual-state SELECT input
pin allows the user to select VOUT2 from 2 different
values (2.8V and 3.0V). VOUT1 supplies a fixed 1.8V
voltage.
An active low RESET is asserted when the output
voltage VOUT2 falls below the 2.63V reset voltage
threshold. The RESET output remains low for 300msec
(typical) after VOUT2 rises above reset threshold. When
the shutdown control (SHDN1) is low, the regulator
output voltage VOUT1 falls to zero and RESET output
remains valid. When the shutdown control (SHDN2) is
low, the regulator output voltage VOUT2 falls to zero and
RESET output is low.
Other key features for the device include ultra low noise
operation, fast response to step changes in load and
very low dropout voltage (typically 125mV at full load).
The device also incorporates both over temperature
and over current protection. Each regulator is stable
with an output capacitor of only 1μF and has a
maximum output current of 150mA.
Typical Application
VIN
8
2
GND
3
RESET
7
TC1306
SELECT
VOUT2
3.3µF
6
VOUT1
3.3µF
SHDN1
Package Type
1
4
5
SHDN2
8-Pin MSOP
VIN 1
8 RESET
7 VOUT2
GND 2
SELECT 3
TC1306
SHDN1 4
© 2007 Microchip Technology Inc.
6 VOUT1
5
SHDN2
DS21527C-page 1
TC1306
1.0
ELECTRICAL
CHARACTERISTICS
ABSOLUTE MAXIMUM RATINGS*
Input Voltage .........................................................6.5V
Output Voltage........................... (-0.3V) to (VIN + 0.3V)
Power Dissipation................Internally Limited (Note 7)
Maximum Voltage on Any Pin ......... VIN +0.3V to -0.3V
Operating Temperature Range.... -40°C < TJ < +125°C
Storage Temperature Range ..............-65°C to +150°C
*Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
TC1306 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: VIN = VR + 1V, IL = 100μA, CL = 3.3μF, SHDN1 > VIH, SHDN2 > VIH, TA = 25°C, unless otherwise noted.
Boldface type specifications apply for junction temperature of -40°C to +125°C. Applies to both VOUT1 and VOUT2.
Symbol
Parameter
Min
Typ
Max
Units
VIN
Input Operating Voltage
2.7
—
6.0
V
IOUTMAX
Maximum Output Current
150
—
—
mA
VOUT
Output Voltage (VOUT1 and VOUT2)
TCVOUT
VOUT Temperature Coefficient
ΔVOUT/ΔVIN
Line Regulation
VR – 2.5%
VR ± 0.5% VR + 2.5%
—
—
20
40
—
—
V
Test Conditions
Note 1
Per Channel
Note 2
ppm/°C Note 3
—
0.05
0.35
%
(VR + 1V) < VIN < 6V
ΔVOUT/VOUT Load Regulation
—
0.3
2
%
IL = 0.1mA to IOUTMAX
(Note 4)
VIN – VOUT
Dropout Voltage
—
2
45
85
125
—
120
240
360
mV
IL = 100μA
IL = 50mA
IL = 100mA
IL = 150mA, (Note 5)
IIN
Supply Current
—
120
200
μA
SHDN1, SHDN2 = VIH, IL = 0
IINSD
Shutdown Supply Current
—
0.05
0.5
μA
SHDN1, SHDN2 = 0V
PSRR
Power Supply Rejection Ratio
—
55
—
dB
FRE ≤ 120Hz
IOUTSC
Output Short Circuit Current
—
450
—
mA
VOUT = 0V
ΔVOUTΔPD
Thermal Regulation
—
0.04
—
V/W
Notes 6, 7
tWK
Wake Up Time
—
10
—
μsec
VIN = 5V
CIN = 1μF, COUT = 4.7μF
IL = 30mA, (See Figure 4-1)
—
40
—
μsec
VIN = 5V
CIN = 1μF, COUT = 4.7μF
IL = 30mA, (See Figure 4-1)
(from Shutdown Mode)
ts
Settling Time
(from Shutdown Mode)
Note 1:
2:
3:
4:
5:
6:
7:
The minimum VIN has to meet two conditions: VIN ≥ 2.7 and VIN = VR + VDROPOUT.
VR is the regulator output voltage setting. For example: VR = 2.8V, 3.0V.
TC VOUT = (VOUTMAX – VOUTMIN) x 106
VOUT x ΔT
Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from
0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation
specification.
Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a 1V
differential.
Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or
line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 msec.
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the
thermal resistance from junction-to-air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate
thermal shutdown. Please see Section 5.0 Thermal Considerations section of this data sheet for more details.
DS21527C-page 2
© 2007 Microchip Technology Inc.
TC1306
TC1306 ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Characteristics: VIN = VR + 1V, IL = 100μA, CL = 3.3μF, SHDN1 > VIH, SHDN2 > VIH, TA = 25°C, unless otherwise
noted. Boldface type specifications apply for junction temperature of -40°C to +125°C. Applies to both VOUT1 and VOUT2.
Symbol
Parameter
Min
Typ
Max
Units
Thermal Shutdown Die
Temperature
—
160
—
°C
ΔTSD
Thermal Shutdown Hysteresis
—
15
—
°C
eN
Output Noise
—
200
—
nV√Hz
VIH
SHDN Input High Threshold
65
—
—
%VIN
VIN = 2.7V to 6.0V
VIL
SHDN Input Low Threshold
—
—
15
%VIN
VIN = 2.7V to 6.0V
TSD
Test Conditions
F = 10kHz
SHDN Input
SELECT Input
VSELH
SELECT Input HIgh Threshold
65
—
—
%VIN
VIN = 2.7V to 6.0V
VSELL
SELECT Input Low Threshold
—
—
15
%VIN
VIN = 2.7V to 6.0V
RESET Output
VINMIN
Minimum VIN Operating Voltage
1.0
1.2
—
—
6.0
6.0
V
TA = 0°C to +70°C
TA = -40°C to +125°C
VTH
Reset Threshold
2.59
2.55
2.63
—
2.66
2.70
V
TA = +25°C
TA = -40°C to +125°C
ppm/°C
Reset Threshold Tempco
—
30
—
VOUT2 to Reset Delay
—
100
—
μsec
140
300
560
msec
Reset Active Time-out Period
VOUT2 = VTH to (VTH – 100mV)
VOL
RESET Output Voltage Low
—
—
—
—
—
—
0.3
0.4
0.3
V
VOUT2 = VTHMIN, ISINK = 1.2mA
VOUT2 = VTHMIN, ISINK = 3.2mA
VOUT2 > 1.0V, ISINK = 50μA
VOH
RESET Output Voltage High
0.8 VOUT2
—
—
V
VOUT2 – 1.5
—
—
VOUT2 > VTHMAX,
ISOURCE = 500μA
VOUT2 > VTHMAX,
ISOURCE = 800μA
Note 1:
2:
3:
4:
5:
6:
7:
The minimum VIN has to meet two conditions: VIN ≥ 2.7 and VIN = VR + VDROPOUT.
VR is the regulator output voltage setting. For example: VR = 2.8V, 3.0V.
TC VOUT = (VOUTMAX – VOUTMIN) x 106
VOUT x ΔT
Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from
0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation
specification.
Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a 1V
differential.
Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or
line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 msec.
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the
thermal resistance from junction-to-air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate
thermal shutdown. Please see Section 5.0 Thermal Considerations section of this data sheet for more details.
© 2007 Microchip Technology Inc.
DS21527C-page 3
TC1306
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
PIN FUNCTION TABLE
Pin No.
(8-Pin MSOP)
Symbol
1
VIN
3.0
Description
Power supply input.
2
GND
3
SELECT
SELECT control for setting VOUT2. SELECT = Low for VOUT2 = 2.8V, SELECT = High for
VOUT2 = 3.0V.
Ground terminal.
4
SHDN1
Shutdown control input for VOUT1. Regulator 1 is fully enabled when a logic high is applied to
this input. Regulator 1 enters shutdown when a logic low is applied to this input. During
shutdown, regulator output voltage falls to zero, RESET output remains valid.
5
SHDN2
Shutdown control input for VOUT2. Regulator 2 is fully enabled when a logic high is applied to
this input. Regulator 2 enters shutdown when a logic low is applied to this input. During
shutdown, regulator output voltage falls to zero, RESET output is low.
6
VOUT1
Regulated voltage output 1.
7
VOUT2
Regulated voltage output 2.
8
RESET
RESET Output. RESET = Low when VOUT2 is below the Reset Threshold Voltage.
RESET = High when VOUT2 is above the Reset Threshold Voltage.
DETAILED DESCRIPTION
The TC1306 is a precision fixed output voltage
regulator that contains two fully independent 150mA
outputs. The device also features separate shutdown
modes for low-power operation. The Select Mode™
operation allows the user to select VOUT2 from two
different values (2.8V, 3.0V), therefore providing high
design flexibility. VOUT1 supplies a fixed 1.8V output
voltage. The CMOS construction of the TC1306 results
in a very low supply current, which does not increase
with load changes. In addition, VOUT remains stable
and within regulation at no load currents.
DS21527C-page 4
The TC1306 also features an integrated microprocessor supervisor that monitors the VOUT2 output. The
active low RESET signal is asserted when the voltage
of VOUT2 falls below the reset voltage threshold
(2.63V). The RESET output remains low for 300msec
(typical) after VOUT2 rises above the reset threshold.
The RESET output of the TC1306 is optimized to reject
fast transient glitches on the monitored output line.
© 2007 Microchip Technology Inc.
TC1306
4.0
TYPICAL APPLICATIONS
4.3
4.1
Input and Output Capacitor
The Select Mode™ operation is a dual-state input that
allows the user to select VOUT2 from two different
values. By applying a logic low to the SELECT pin,
VOUT2 is set to supply a 2.8V output voltage. A logic
high signal at the SELECT pin sets VOUT2 to 3.0V. This
output voltage functionality provides high design
flexibility and minimizes cost associated with inventory,
time-to-market and new device qualifications.
The TC1306 is stable with a wide range of capacitor
values and types. A capacitor with a minimum value of
1μF from VOUT to Ground is required. The output
capacitor should have an effective series resistance
(ESR) of 0.1Ω to 10Ω for a 1μF capacitor and 0.01Ω to
10Ω for a 10μF capacitor. A 1μF capacitor should be
connected from the VIN to GND if there is more than 10
inches of wire between the regulator and the AC filter
capacitor, or if a battery is used as the power source.
Aluminum electrolytic or tantalum capacitor types can
be used. (Since many aluminum electrolytic capacitors
freeze at approximately -30°C, solid tantalums are
recommended for applications operating below -20°C).
When operating from sources other than batteries,
supply-noise rejection and transient response can be
improved by increasing the value of the input and
output capacitors and employing passive filtering
techniques.
4.2
Shutdown Mode
Applying a logic high to each of the shutdown pins turns
on the corresponding output. Each regulator enters
shutdown mode when a logic low is applied to the
corresponding input. During shutdown mode, output
voltage falls to zero, and regulator supply current is
reduced to 0.5μA (max). If shutdown mode is not
necessary, the pins should be connected to VIN.
4.4
Select Mode™ Operation
Turn On Response
The turn on response is defined as two separate
response categories, Wake Up Time (tWK) and Settling
Time (tS).
The TC1306 has a fast Wake Up Time (10μsec typical)
when released from shutdown. See Figure 4-1 for the
Wake Up Time designated as tWK. The Wake Up Time
is defined as the time it takes for the output to rise to 2%
of the VOUT value after being released from shutdown.
The total turn on response is defined as the Settling
Time (tS), see Figure 4-1. Settling Time (inclusive with
tWK) is defined as the condition when the output is
within 2% of its fully enabled value (40μsec typical)
when released from shutdown. The settling time of the
output voltage is dependent on load conditions, output
voltage and VOUT (RC response).
FIGURE 4-1:
WAKE-UP RESPONSE
TIME
VIH
SHDN
VIL
tS
98%
VOUT
2%
tWK
© 2007 Microchip Technology Inc.
DS21527C-page 5
TC1306
5.0
THERMAL CONSIDERATIONS
5.1
Thermal Shutdown
Integrated thermal protection circuitry shuts the
regulator off when die exceeds approximately 160°C.
The regulator remains off until the die temperature
drops to approximately 145°C.
Thermal shutdown is intended to protect the device
under transient accidental (fault) overload conditions.
Thermal Shutdown may not protect the LDO while
operating above junction temperatures of 125°C
continuously. Sufficient thermal evaluation of the
design needs to be conducted to ensure that the
junction temperature does not exceed 125°C.
5.2
Power Dissipation
The amount of power the regulator dissipates is
primarily a function of input and output voltage, and
output current. The following equation is used to
calculate worst case actual power dissipation.
EQUATION 5-1:
PD ≈ (VINMAX – VOUT1MIN)ILOAD1MAX +
(VINMAX – VOUT2MIN)ILOAD2MAX
Where:
PD = Worst case actual power dissipation
VINMAX = Maximum voltage on VIN
VOUT1MIN = Minimum regulator output voltage1
ILOAD1MAX = Maximum output (load) current1
VOUT2MIN = Minimum regulator output voltage2
ILOAD2MAX = Maximum output (load) current2
The
maximum
allowable
power
dissipation
(Equation 5-2) is a function of the maximum ambient
temperature (TAMAX), the maximum allowable die
temperature (125°C), and the thermal resistance from
junction-to-air (θJA). The MSOP-8 package has a θJA of
approximately 200°C/W when mounted on a four layer
FR4 dielectric copper clad PC board.
EQUATION 5-2:
PDMAX = (TJMAX – TAMAX)
θJA
Where all terms are previously defined.
DS21527C-page 6
Equation 5-1 can be used in conjunction with
Equation 5-2 to ensure regulator thermal operation is
within limits. For example:
Given:
VINMAX
= 3.8V ± 5%
VOUT1MIN
= 1.8V ± 2.5%
VOUT2MIN = 3.0V ± 2.5%
ILOAD1MAX = 60mA
ILOAD2MAX = 120mA
TJMAX
= 125°C
TAMAX
= 55°C
θJA
= 200°C/W
Find: 1. Actual power dissipation
2. Maximum allowable dissipation
Actual power dissipation:
PD ≈ [(VINMAX – VOUT1MIN)] x ILOAD1MAX
+ [(VINMAX – VOUT2MIN)] x ILOAD2MAX
[(3.8 x 1.05) – (1.8 x .975)] x 60 x 10-3
+ [(3.8 x 1.05) – (3.0 x .975)] x 120 x 10-3
= 256mW
Maximum allowable power dissipation:
PD = (TJMAX – TAMAX)
θJA
= (125 – 55)
200
= 350mW
In this example, the TC1306 dissipates a maximum of
262mW; below the allowable limit of 350mW. In a
similar manner, Equation 5-1 and Equation 5-2 can be
used to calculate maximum current and/or input
voltage limits. For example, the maximum allowable
VIN is found by substituting the maximum allowable
power dissipation of 350mW into Equation 5-1, from
which VINMAX = 4.5V.
5.3
Layout Considerations
The primary path of heat conduction out of the package
is via the package leads. Therefore, layouts having a
ground plane, wide traces at the pads, and wide power
supply bus lines combine to lower θJA and therefore
increase the maximum allowable power dissipation
limit.
© 2007 Microchip Technology Inc.
TC1306
6.0
TYPICAL CHARACTERISTICS
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein are
not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
VOUT2 at Various VDD /
Load Current vs. Temperature
(Select = GND)
VOUT1 at Various VDD and
Load vs. Temperature
1.81
2.505
VDD = 6.0V, IL = 100µA Load
1.80
VOUT2 (V)
1.78 VDD = 2.8V,
IL = 150mA Load
VDD = 6.0V, IL = 100mA Load
1.77
2.995
2.495
2.990
2.490
2.985
2.485
VDD = 3.8V, IL = 150mA
2.480
VDD = 3.8V, IL = 100mA
2.475
1.76
2.470
VDD = 3.8V, IL = 50mA
2.465
1.74
-40
2.460
-40
5
30
55
80 105 125
LOAD REG (%)
IDD (µA)
120
-40°C
60
40
20
0
3
3.5
4
4.5
5
VDD (V)
5.5
-20
5
30
55
6
0.50
0.45
0.45
0.40
0.40
0.35
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0.00
-40
Dropout Voltage vs.
Load Current (Select = GND)
0.20
0.15
0.10
DROPOUT VOLTAGE (V)
IL = 0.1 to 150mA
0.12
125°C
0.08
-40°C
0.06
0.04
0.05
0.02
0.00
-40
0.00
5
30 55 80 105 125
TEMPERATURE (°C)
25°C
0.10
-20
5
30 55 80 105 125
TEMPERATURE (°C)
Dropout Voltage vs.
Load Current (Select = VDD)
0.18
0.30
IL = 0.1 to 150mA
0.15
0.05 % Load Reg #1, IL = 0.1 to 150mA
0.00
-40 -20 5
30 55 80 105 125
TEMPERATURE (°C)
0.14
80 105 125
0.20
0.20
0.35
55
0.25
0.10
0.16
30
0.30
0.18
0.40
5
Load Regulation 2 vs.
Temperature (Select = GND)
0.20
© 2007 Microchip Technology Inc.
-20
TEMPERATURE (°C)
0.45
-20
VDD = 4.0V, IL = 150mA
2.950
-40
80 105 125
0.50
0.25
VDD = 3.8V, IL = 50mA
VDD = 3.8V, IL = 100mA
2.955
0.50
Load Regulation 2 vs.
Temperature (Select = VDD)
LOAD REGULATION (%)
2.970
LOAD REG (%)
25°C
125°C
2.975
Load Regulation 1 vs.
Temperature
160
80
2.980
TEMPERATURE (°C)
IDD vs. VDD (Select = GND)
100
VDD = 4.0V, IL = 100µA
2.960
VDD = 3.8V, IL = 100µA
TEMPERATURE (°C)
140
VDD = 6.0V, IL = 100µA
2.965
1.75
-20
3.000
VDD = 6.0V, IL = 100µA
2.500
DROPOUT VOLTAGE (V)
VOUT (V)
1.79
VOUT2 at Various VDD /
Load Current vs. Temperature
(Select = VDD)
VOUT2 (V)
Note:
0.16
0.14
0.12
25°C
0.10
0.08
125°C
0.06
-40°C
0.04
0.02
0.00
0
25
50
75 100 125 150
LOAD CURRENT (mA)
0
25
50
75 100 125 150
LOAD CURRENT (mA)
DS21527C-page 7
TC1306
6.0
TYPICAL CHARACTERISTICS (CONTINUED)
Power Supply Rejection Ratio vs. Frequency
Power Supply Rejection Ratio vs. Frequency
0
-40
-60
-80
IOUT = 100µA
COUT = 10µF Tantalum
VINDC = 4V
VINAC = 100mVP-P
VOUTDC = 3V
-20
PSRR (dB)
PSRR (dB)
-20
0
IOUT = 150mA
COUT = 10µF Ceramic
VINDC = 4V
VINAC = 100mVP-P
VOUTDC = 3V
-40
-60
-80
-100
10
100
1k
10k
100
-100
1M
10
100
1k
f (Hz)
100
1M
Output Noise
Power Supply Rejection Ratio vs. Frequency
10
0
IOUT = 150mA
COUT = 10µF Tantalum
VINDC = 4V
VINAC = 100mVP-P
VOUTDC = 3V
-20
1
Noise (μV/√HZ)
PSRR (dB)
10k
f (Hz)
-40
-60
VOUT1
VOUT2
0.1
0.01
-80
COUT1 = COUT2 = 4.7mF,
ILOAD = 100mA, VIN = 4.0V
VOUT1 = VOUT2 = 3.0V
-100
10
100
1k
10k
f (Hz)
DS21527C-page 8
100
1M
0.001
0.01
0.1
1
10
100
1000
f (Hz)
© 2007 Microchip Technology Inc.
TC1306
6.0
TYPICAL CHARACTERISTICS (CONTINUED)
Shutdown Response
Output Voltage
(1V / div)
Thermal Shutdown Response
VOUT
VIN = 6.0V
VOUT = 1.8V
CIN = 1μF
COUT = 1μF
SHDN
(5V / div)
VIN = 4.0V
VOUT = 3.0V
COUT = 10μF
ILOAD = 100μA
Time (200ms / div)
Time (500ms / div)
Thermal Shutdown Response
Thermal Shutdown Response
VOUT
VOUT
VIN = 6.0V
VOUT = 2.8V
CIN = 1μF
COUT = 1μF
VIN = 6.0V
VOUT = 3.0V
CIN = 1μF
COUT = 1μF
Time (500ms / div)
VOUT2
VOUT1
VIN
4.6V
Output Voltage Output Voltage
(50mV / div)
(50mV / div)
Line Transient Response
Line Transient Response
VOUT2
VOUT1
3.6V
COUT1 = COUT2 = 1μF Tantalum
RLOAD = 30kΩ
Input Voltage
(2V / div)
Input Voltage
(2V / div)
Output Voltage Output Voltage
(50mV / div)
(50mV / div)
Time (500ms / div)
VIN
4.6V
3.6V
COUT1 = COUT2 = 10μF Ceramic
RLOAD = 30kΩ
Time (500ms / div)
Time (500ms / div)
© 2007 Microchip Technology Inc.
DS21527C-page 9
TC1306
TYPICAL CHARACTERISTICS (CONTINUED)
Output Voltage Output Voltage
(20mV / div)
(20mV / div)
Load Transient Response
VOUT2
VOUT1
COUT1 = COUT2 = 10μF Ceramic
100mA
VIN = 5.5V
RLOAD = 30kΩ
RL = 30Ω
100μA
Output Current
Output Current
Output Voltage Output Voltage
(20mV / div)
(20mV / div)
6.0
Thermal Shutdown Response
VOUT2
VOUT1
COUT1 = COUT2 = 1μF Tantalum
100μA
Time (500ms / div)
Output Voltage 1 Output Voltage 2
(20mV / div)
(50mV / div)
Load Transient Response
VOUT2
VOUT1
COUT1 = COUT2 = 10μF Ceramic
100mA
VIN = 5.5V
RLOAD = 30kΩ
RL = 30Ω
100μA
Output Current
Output Voltage 1 Output Voltage 2
(20mV / div)
(50mV / div)
Time (500ms / div)
Output Current
100mA
VIN = 5.5V
RLOAD = 30kΩ
RL = 30Ω
Thermal Shutdown Response
VOUT2
VOUT1
COUT1 = COUT2 = 1μF Tantalum
100mA
VIN = 5.5V
RLOAD = 30kΩ
RL = 30Ω
100μA
Time (500ms / div)
Time (500ms / div)
Output Voltage 2
(1V / div)
Wake-Up Response
3.0V
VOUT2
1.8V
Output Voltage 1
(1V / div)
VOUT1
/Shdn1 = /Shdn2
COUT1 = COUT2 = 1μF Tantalum
VIN = 5.5V
RLOAD = 30kΩ
Time (20ms / div)
DS21527C-page 10
© 2007 Microchip Technology Inc.
TC1306
7.0
PACKAGING INFORMATION
7.1
Package Marking Information
Package marking data not available at this time.
7.2
Taping Form
Component Taping Orientation for 8-Pin MSOP Devices
User Direction of Feed
PIN 1
W
P
Standard Reel Component Orientation
for TR Suffix Device
Carrier Tape, Number of Components Per Reel and Reel Size
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
12 mm
8 mm
2500
13 in
8-Pin MSOP
7.3
Package Dimensions
8-Pin MSOP
PIN 1
.122 (3.10)
.114 (2.90)
.197 (5.00)
.189 (4.80)
.026 (0.65) TYP.
.122 (3.10)
.114 (2.90)
.043 (1.10)
MAX.
.016 (0.40)
.010 (0.25)
.006 (0.15)
.002 (0.05)
.008 (0.20)
.005 (0.13)
6° MAX.
.028 (0.70)
.016 (0.40)
Dimensions: inches (mm)
© 2007 Microchip Technology Inc.
DS21527C-page 11
TC1306
NOTES:
DS21527C-page 12
© 2007 Microchip Technology Inc.
TC1306
APPENDIX A:
REVISION HISTORY
Revision C (February 2007)
• Changed device status to “Obsolete” on data
sheet
• Corrected Figure 6-4 Output Noise
Revision B (May 2002)
• Undocumented changes
Revision A (March 2001)
• Original Release of this Document.
© 2007 Microchip Technology Inc.
DS21527C-page 13
TC1306
NOTES:
DS21527C-page 14
© 2007 Microchip Technology Inc.
TC1306
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1.
2.
3.
Your local Microchip sales office
The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
© 2007 Microchip Technology Inc.
DS21527C-page15
TC1306
NOTES:
DS21527C-page16
© 2007 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC,
PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and
SmartShunt are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
AmpLab, FilterLab, Linear Active Thermistor, Migratable
Memory, MXDEV, MXLAB, PS logo, SEEVAL, SmartSensor
and The Embedded Control Solutions Company are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, ECAN,
ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi,
MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit,
PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal,
PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB,
rfPICDEM, Select Mode, Smart Serial, SmartTel, Total
Endurance, UNI/O, WiperLock and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2007, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona, Gresham, Oregon and Mountain View, California. The
Company’s quality system processes and procedures are for its PIC®
MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial
EEPROMs, microperipherals, nonvolatile memory and analog
products. In addition, Microchip’s quality system for the design and
manufacture of development systems is ISO 9001:2000 certified.
© 2007 Microchip Technology Inc.
DS21527C-page 17
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://support.microchip.com
Web Address:
www.microchip.com
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Habour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-4182-8400
Fax: 91-80-4182-8422
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
Kokomo
Kokomo, IN
Tel: 765-864-8360
Fax: 765-864-8387
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8528-2100
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Korea - Gumi
Tel: 82-54-473-4301
Fax: 82-54-473-4302
China - Fuzhou
Tel: 86-591-8750-3506
Fax: 86-591-8750-3521
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
Malaysia - Penang
Tel: 60-4-646-8870
Fax: 60-4-646-5086
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-572-9526
Fax: 886-3-572-6459
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-536-4803
China - Shunde
Tel: 86-757-2839-5507
Fax: 86-757-2839-5571
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Xian
Tel: 86-29-8833-7250
Fax: 86-29-8833-7256
12/08/06
DS21527C-page 18
© 2007 Microchip Technology Inc.