UPDATE NOTIFICATION Generic Copy 06-DEC-2001 SUBJECT: ON Semiconductor Update Notification 12094 TITLE: Addendum To FPCN# 11734: Final Notification - Qualification of Assembly and Test Site for TO220FP (Case 221D-02) Products EFFECTIVE DATE: 06-Dec-2001 AFFECTED CHANGE CATEGORY: ON Semiconductor Assembly Site Subcontractor Assembly Site AFFECTED PRODUCT DIVISION: Bipolar Discretes Products Division ADDITIONAL RELIABILITY DATA: Available Contact your local ON Semiconductor Sales Office or Terry Franks <[email protected]> SAMPLES: Contact your local ON Semiconductor Sales Office or Jose Ramirez <[email protected]> FOR ANY QUESTIONS CONCERNING THIS NOTIFICATION: Contact Sales Office or Jose Ramirez <[email protected]> DISCLAIMER: Initial Product/Process Change Notification (IPCN) – First Notification distributed to customers. Distributed at least 120 days from the effective date of the change. Final Product/Process Change Notification (FPCN) - Final Notification completing the notification process. Distributed at least 60 days from the effective date of the change. ON Semiconductor will consider this change approved unless specific conditions of acceptance are provided in writing within 30 days of receipt of this notice. To do so, contact your local ON Semiconductor Sales Office. DESCRIPTION AND PURPOSE: This is in reference to FPCN#11734 in which ON Semiconductor will be qualifying PSI Technologies at Manila, Philippines to Assembly and Test all TO220FP (Case 221D-02) Products. In this addendum, the package dimensions of ON Semiconductor and PSI Technologies Products are listed here below. Issue Date 06 December, 2001 Page 1 of 2 Update Notification 12094 ON Semiconductor PSi Technologies Dim Min Max Min Max A 0.621 0.629 0.6245 0.6345 B 0.394 0.402 0.4084 0.4184 C 0.181 0.189 0.180 0.190 D 0.026 0.034 0.0256 0.0306 F 0.121 0.129 0.116 0.119 G 0.100BSC 0.100 BSC H 0.123 0.129 0.125 0.135 J 0.018 0.025 0.0177 0.0247 K 0.500 0.562 0.5304 0.5404 L 0.045 0.060 0.0484 0.0534 N 0.200 BSC 0.200 BSC Q 0.126 0.134 0.124 0.128 R 0.107 0.111 0.099 0.103 S 0.096 0.104 0.1013 0.113 U 0.259 0.267 0.2384 0.2584 DESCRIPTION: Dimension A = Plastic package body height Dimension B = Plastic package body width Dimension C = Plastic package body thickness Dimension D = Leads width Dimension F = Mounting hole diameter Dimension G = Center of lead to center of lead distance Dimension H = Upper body lead length Dimension J = Leads thickness Dimension K = Total lead length Dimension L = Upper body lead width Dimension N = Distance center to center outside leads Dimension Q = Distance center mounting hole to top tab Dimension R = Distance lead to package back surface (Seating Plane) Dimension S = Plastic isolated mounting tab body width Dimension U = Plastic isolated mounting tab body length RELATED NOTIFICATIONS: 11678 - INITIAL NOTIFICATION - QUALIFICATION OF ALTERNATE ASSEMB LY/TEST SITES FOR POWER PRODUCTS 11734 - FINAL NOTIFICATION - QUALIFICATION OF ASSEMBLY AND TEST SITE FOR TO220FP (CASE 221D-02)PRODUCTS. AFFECTED DEVICE LIST (WITHOUT SPECIALS) PART BUL146F, MBRF20100CT, MBRF20200CT, MBRF2060CT, MBRF2545CT, MJF122, MJF127, MJF15030, MJF15031, MJF18004, MJF18008, MJF2955, MJF3055, MJF31C, MJF32C, MJF44H11, MJF45H11, MJF47, MJF6388, MJF6668, MURF1620CT, MURF1660CT, MURHF860CT, Issue Date 06 December, 2001 Page 2 of 2