CY8C21334, CY8C21534 Automotive PSoC® Programmable System-on-Chip™ Features ■ ■ Automotive Electronics Council (AEC) Q100 qualified Powerful Harvard-architecture processor ❐ M8C processor speeds up to 24 MHz ❐ Low power at high speed ❐ Operating voltage: 3.0 V to 5.25 V ❐ Automotive temperature range: –40 C to +85 C ® ■ Advanced peripherals (PSoC blocks) ❐ Four analog Type E PSoC blocks provide: • Two comparators with digital-to-analog converter (DAC) references • Up to 10-bit single or dual, 24 channel analog-to-digital converters (ADC) ❐ Four digital PSoC blocks provide: • 8- to 32-bit timers, counters, and pulse width modulators (PWMs) • Cyclical redundancy check (CRC) and pseudo-random sequence (PRS) modules • Full- or half-duplex UART • SPI master or slave • Connectable to all general purpose I/O (GPIO) pins ❐ Complex peripherals by combining blocks • Capacitive sensing application capability ■ Flexible on-chip memory ❐ 8 KB flash program storage ❐ 512 bytes SRAM data storage ❐ In-system serial programming (ISSP) ❐ Partial flash updates ❐ Flexible protection modes ❐ EEPROM emulation in flash ■ Complete development tools ❐ Free development software (PSoC Designer™) ❐ Full-featured in-circuit emulator (ICE) and programmer ❐ Full-speed emulation ❐ Complex breakpoint structure ❐ 128 KB trace memory ■ Precision, programmable clocking ❐ Internal ±5% 24 MHz oscillator ❐ Internal low-speed, low-power oscillator for Watchdog and Sleep functionality ❐ Optional external oscillator, up to 24 MHz ■ Cypress Semiconductor Corporation Document Number: 001-12550 Rev. *J • ■ ■ Programmable pin configurations ❐ 25 mA sink, 10 mA drive on all GPIOs ❐ Pull-up, pull-down, high Z, strong, or open drain drive modes on all GPIOs ❐ Analog input on all GPIOs ❐ Configurable interrupt on all GPIOs Versatile analog mux ❐ Common internal analog bus ❐ Simultaneous connection of I/O combinations Additional system resources 2 ❐ Inter-Integrated Circuit (I C™) master, slave, or multi-master operation up to 400 kHz ❐ Watchdog and sleep timers ❐ User-configurable low-voltage detection (LVD) ❐ Integrated supervisory circuit ❐ On-chip precision voltage reference Logic Block Diagram 198 Champion Court • San Jose, CA 95134-1709 • 408-943-2600 Revised November 29, 2013 CY8C21334, CY8C21534 Contents PSoC Functional Overview .............................................. 3 The PSoC Core ........................................................... 3 The Digital System ...................................................... 3 The Analog System ..................................................... 4 Additional System Resources ..................................... 4 PSoC Device Characteristics ...................................... 5 Getting Started .................................................................. 5 Application Notes ........................................................ 5 Development Kits ........................................................ 5 Training ....................................................................... 5 CYPros Consultants .................................................... 5 Solutions Library .......................................................... 5 Technical Support ....................................................... 5 Development Tools .......................................................... 6 PSoC Designer Software Subsystems ........................ 6 Designing with PSoC Designer ....................................... 7 Select Components ..................................................... 7 Configure Components ............................................... 7 Organize and Connect ................................................ 7 Generate, Verify, and Debug ....................................... 7 Pinouts .............................................................................. 8 20-Pin Part Pinout ...................................................... 8 28-Pin Part Pinout ....................................................... 9 Registers ......................................................................... 10 Register Conventions ................................................ 10 Register Mapping Tables .......................................... 10 Electrical Specifications ................................................ 13 Absolute Maximum Ratings ....................................... 14 Operating Temperature ............................................. 14 Document Number: 001-12550 Rev. *J DC Electrical Characteristics ..................................... 15 AC Electrical Characteristics ..................................... 18 Packaging Information ................................................... 24 Packaging Dimensions .............................................. 24 Thermal Impedances ................................................. 25 Solder Reflow Specifications ..................................... 25 Tape and Reel Information ........................................ 26 Development Tool Selection ......................................... 28 Software .................................................................... 28 Development Kits ...................................................... 28 Evaluation Tools ........................................................ 28 Device Programmers ................................................. 29 Accessories (Emulation and Programming) .............. 29 Ordering Information ...................................................... 30 Ordering Code Definitions ......................................... 30 Acronyms ........................................................................ 31 Reference Documents .................................................... 31 Document Conventions ................................................. 32 Units of Measure ....................................................... 32 Numeric Conventions .................................................... 32 Glossary .......................................................................... 32 Document History Page ................................................. 37 Sales, Solutions, and Legal Information ...................... 39 Worldwide Sales and Design Support ....................... 39 Products .................................................................... 39 PSoC® Solutions ...................................................... 39 Cypress Developer Community ................................. 39 Technical Support ..................................................... 39 Page 2 of 39 CY8C21334, CY8C21534 PSoC Functional Overview The PSoC family consists of many devices with on-chip controllers. These devices are designed to replace multiple traditional microcontroller unit (MCU)-based system components with one, low-cost single-chip programmable component. A PSoC device includes configurable blocks of analog and digital logic, and programmable interconnect. This architecture makes it possible for you to create customized peripheral configurations, to match the requirements of each individual application. Additionally, a fast CPU, flash program memory, SRAM data memory, and configurable I/O are included in a range of convenient pinouts. The PSoC architecture, as illustrated in the “Logic Block Diagram” on page 1, comprises of four main areas: the core, the system resources, the digital system, and the analog system. Configurable global bus resources allow all the device resources to be combined into a complete custom system. Each CY8C21x34 PSoC device includes four digital blocks and four analog blocks. Depending on the PSoC package, up to 24 GPIOs are also included. The GPIOs provide access to the global digital and analog interconnects. The PSoC Core The PSoC core is a powerful engine that supports a rich instruction set. It encompasses SRAM for data storage, an interrupt controller, sleep, and watchdog timers, and an internal main oscillator (IMO) and internal low-speed oscillator (ILO). The CPU core, called the M8C, is a powerful processor with speeds up to 24 MHz. The M8C is a four-million instructions per second (MIPS) 8-bit Harvard-architecture microprocessor. which are called user modules. Digital peripheral configurations include those listed. ■ PWMs (8- to 32-bit) ■ PWMs with dead band (8- to 24-bit) ■ Counters (8- to 32-bit) ■ Timers (8- to 32-bit) ■ Full or half-duplex 8-bit UART with selectable parity ■ SPI master and slave ■ I2C master, slave, or multi-master (implemented in a dedicated I2C block) ■ Cyclical redundancy checker/generator (16-bit) ■ Infrared Data Association (IrDA) ■ PRS generators (8- to 32-bit) The digital blocks can be connected to any GPIO through a series of global buses that can route any signal to any pin. The buses also allow for signal multiplexing and for performing logic operations. This configurability frees your designs from the constraints of a fixed peripheral controller. Figure 1. Digital System Block Diagram Port 3 Port 1 Port 2 Digital Clocks From Core System Resources provide additional capability, such as digital clocks for increased flexibility, I2C functionality for implementing an I2C master, slave, or multi-master, an internal voltage reference that provides an absolute value of 1.3 V to a number of PSoC subsystems, and various system resets supported by the M8C. The Analog System is composed of four analog PSoC blocks, supporting comparators and analog-to-digital conversion with up to 10 bits of precision. The Digital System The digital system is composed of four digital PSoC blocks. Each block is an 8-bit resource that can be used alone or combined with other blocks to form 8-, 16-, 24-, and 32-bit peripherals, Document Number: 001-12550 Rev. *J To Analog System To System Bus DIGITAL SYSTEM Row Input Configuration Digital PSoC Block Array Row 0 DBB00 DBB01 DCB02 4 Row Output Configuration The Digital System is composed of an array of digital PSoC blocks, which can be configured into any number of digital peripherals. The digital blocks can be connected to the GPIO through a series of global buses that can route any signal to any pin. This frees designs from the constraints of a fixed peripheral controller. Port 0 DCB03 4 8 8 8 8 GIE[7:0] GIO[7:0] Global Digital Interconnect GOE[7:0] GOO[7:0] Digital blocks are provided in rows of four, where the number of blocks varies by PSoC device family. This allows you the optimum choice of system resources for your application. Family resources are shown in Table 1 on page 5. Page 3 of 39 CY8C21334, CY8C21534 The Analog System The Analog System is composed of four configurable blocks, allowing the creation of complex analog signal flows. Analog peripherals are very flexible and can be customized to support specific application requirements. Some of the common PSoC analog functions for this device (most available as user modules) are listed. ■ ADCs (single or dual, with up to 10-bit resolution) ■ Pin-to-pin comparator ■ Single-ended comparators (up to two) with absolute (1.3 V) reference or 8-bit DAC reference ■ 1.3 V reference (as a system resource) In most PSoC devices, analog blocks are provided in columns of three, which includes one continuous time (CT) and two switched capacitor (SC) blocks. The CY8C21x34 devices provide limited functionality Type E analog blocks. Each column contains one CT Type E block and one SC Type E block. Refer to the PSoC Programmable System-on-Chip Technical Reference Manual for detailed information on the CY8C21x34’s Type E analog blocks. Figure 2. Analog System Block Diagram From Port 0 The Analog Multiplexer System The Analog Mux Bus can connect to every GPIO pin. Pins can be connected to the bus individually or in any combination. The bus also connects to the analog system for analysis with comparators and ADCs. An additional 8:1 analog input multiplexer provides a second path to bring Port 0 pins to the analog array. Switch-control logic enables selected pins to precharge continuously under hardware control. This enables capacitive measurement for applications such as touch sensing. Other multiplexer applications include: ■ Track pad, finger sensing. ■ Chip-wide mux that allows analog input from any I/O pin. ■ Crosspoint connection between any I/O pin combination. Additional System Resources System resources, some of which have been previously listed, provide additional capability useful for complete systems. Brief statements describing the merits of each system resource are presented. ■ Digital clock dividers provide three customizable clock frequencies for use in applications. The clocks can be routed to both the digital and analog systems. Additional clocks can be generated using digital PSoC blocks as clock dividers. ■ The I2C module provides communication up to 400 kHz over two wires. Slave, master, and multi-master modes are all supported. ■ LVD interrupts can signal the application of falling voltage levels, while the advanced power-on reset (POR) circuit eliminates the need for a system supervisor. ■ An internal 1.3 V voltage reference provides an absolute reference for the analog system, including ADCs and DACs. ■ Versatile analog multiplexer system. Array Input Configuration ACI0[1:0] ACI1[1:0] All IO ACOL1MUX Analog Mux Bus Array ACE00 ACE01 ASE10 ASE11 Document Number: 001-12550 Rev. *J Page 4 of 39 CY8C21334, CY8C21534 PSoC Device Characteristics Depending on your PSoC device characteristics, the digital and analog systems can have a varying number of digital and analog blocks. Table 1 lists the resources available for specific PSoC device groups. The PSoC device covered by this datasheet is highlighted in Table 1 Table 1. PSoC Device Characteristics PSoC Part Number Digital I/O Digital Rows Digital Blocks Analog Inputs Analog Outputs Analog Columns Analog Blocks SRAM Size Flash Size CY8C29x66 up to 64 4 16 up to 12 4 4 12 2K 32 K CY8C28xxx up to 44 up to 3 up to 12 up to 44 up to 4 up to 6 up to 12 + 4 1K 16 K CY8C27x43 up to 44 2 8 up to 12 4 4 12 256 16 K CY8C24x94 up to 56 1 4 up to 48 2 2 6 1K 16 K CY8C24x23A up to 24 1 4 up to 12 2 2 6 256 4K CY8C23x33 up to 26 1 4 up to 12 2 2 4 256 8K CY8C22x45 up to 38 2 8 up to 38 0 4 6 1K 16 K  up to 24 1 4 up to 24 0 4 6 512 8K CY8C21x34 up to 28 1 4 up to 28 0 2 4 512 8K CY8C21x23 up to 16 1 4 up to 8 0 2 4 256 4K 24 0 0 1 512 8K CY8C21x45 CY8C21x12 up to 24 1 1 CY8C20x34 up to 28 0 0 up to 28 0 0 3[2,3] 512 8K CY8C20xx6 up to 36 0 0 up to 36 0 0 3[2,3] up to 2 K up to 32 K Getting Started For in-depth information, along with detailed programming details, see the PSoC® Technical Reference Manual. CYPros Consultants For up-to-date ordering, packaging, and electrical specification information, see the latest PSoC device datasheets on the web. Certified PSoC consultants offer everything from technical assistance to completed PSoC designs. To contact or become a PSoC consultant go to the CYPros Consultants web site. Application Notes Solutions Library Cypress application notes are an excellent introduction to the wide variety of possible PSoC designs. Visit our growing library of solution focused designs. Here you can find various application designs that include firmware and hardware design files that enable you to complete your designs quickly. Development Kits PSoC Development Kits are available online from and through a growing number of regional and global distributors, which include Arrow, Avnet, Digi-Key, Farnell, Future Electronics, and Newark. Training Technical Support Technical support – including a searchable Knowledge Base articles and technical forums – is also available online. If you cannot find an answer to your question, call our Technical Support hotline at 1-800-541-4736. Free PSoC technical training (on demand, webinars, and workshops), which is available online via www.cypress.com, covers a wide variety of topics and skill levels to assist you in your designs. Notes 1. Automotive qualified devices available in this group. 2. Limited analog functionality. 3. Two analog blocks and one CapSense® block. Document Number: 001-12550 Rev. *J Page 5 of 39 CY8C21334, CY8C21534 Development Tools PSoC Designer™ is the revolutionary integrated design environment (IDE) that you can use to customize PSoC to meet your specific application requirements. PSoC Designer software accelerates system design and time to market. Develop your applications using a library of precharacterized analog and digital peripherals (called user modules) in a drag-and-drop design environment. Then, customize your design by leveraging the dynamically generated application programming interface (API) libraries of code. Finally, debug and test your designs with the integrated debug environment, including in-circuit emulation and standard software debug features. PSoC Designer includes: ■ Application editor graphical user interface (GUI) for device and user module configuration and dynamic reconfiguration ■ Extensive user module catalog ■ Integrated source-code editor (C and assembly) ■ Free C compiler with no size restrictions or time limits ■ Built-in debugger ■ In-circuit emulation ■ Built-in support for communication interfaces: 2 ❐ Hardware and software I C slaves and masters ❐ Full-speed USB 2.0 ❐ Up to four full-duplex universal asynchronous receiver/transmitters (UARTs), SPI master and slave, and wireless PSoC Designer supports the entire library of PSoC 1 devices and runs on Windows XP, Windows Vista, and Windows 7. PSoC Designer Software Subsystems Design Entry In the chip-level view, choose a base device to work with. Then select different onboard analog and digital components that use the PSoC blocks, which are called user modules. Examples of user modules are ADCs, DACs, amplifiers, and filters. Configure the user modules for your chosen application and connect them to each other and to the proper pins. Then generate your project. This prepopulates your project with APIs and libraries that you can use to program your application. The tool also supports easy development of multiple configurations and dynamic reconfiguration. Dynamic reconfiguration makes it possible to change configurations at run time. In essence, this allows you to use more than 100 percent of PSoC's resources for an application. Document Number: 001-12550 Rev. *J Code Generation Tools The code generation tools work seamlessly within the PSoC Designer interface and have been tested with a full range of debugging tools. You can develop your design in C, assembly, or a combination of the two. Assemblers. The assemblers allow you to merge assembly code seamlessly with C code. Link libraries automatically use absolute addressing or are compiled in relative mode, and are linked with other software modules to get absolute addressing. C Language Compilers. C language compilers are available that support the PSoC family of devices. The products allow you to create complete C programs for the PSoC family devices. The optimizing C compilers provide all of the features of C, tailored to the PSoC architecture. They come complete with embedded libraries providing port and bus operations, standard keypad and display support, and extended math functionality. Debugger PSoC Designer has a debug environment that provides hardware in-circuit emulation, allowing you to test the program in a physical system while providing an internal view of the PSoC device. Debugger commands allow you to read and program and read and write data memory, and read and write I/O registers. You can read and write CPU registers, set and clear breakpoints, and provide program run, halt, and step control. The debugger also allows you to create a trace buffer of registers and memory locations of interest. Online Help System The online help system displays online, context-sensitive help. Designed for procedural and quick reference, each functional subsystem has its own context-sensitive help. This system also provides tutorials and links to FAQs and an online support Forum to aid the designer. In-Circuit Emulator A low-cost, high-functionality in-circuit emulator (ICE) is available for development support. This hardware can program single devices. The emulator consists of a base unit that connects to the PC using a USB port. The base unit is universal and operates with all PSoC devices. Emulation pods for each device family are available separately. The emulation pod takes the place of the PSoC device in the target board and performs full-speed (24 MHz) operation. Page 6 of 39 CY8C21334, CY8C21534 Designing with PSoC Designer The development process for the PSoC device differs from that of a traditional fixed function microprocessor. The configurable analog and digital hardware blocks give the PSoC architecture a unique flexibility that pays dividends in managing specification change during development and by lowering inventory costs. These configurable resources, called PSoC Blocks, have the ability to implement a wide variety of user-selectable functions. Organize and Connect The PSoC development process can be summarized in the following four steps: 1. Select User Modules 2. Configure User Modules 3. Organize and Connect 4. Generate, Verify, and Debug When you are ready to test the hardware configuration or move on to developing code for the project, you perform the "Generate Configuration Files" step. This causes PSoC Designer to generate source code that automatically configures the device to your specification and provides the software for the system. The generated code provides application programming interfaces (APIs) with high-level functions to control and respond to hardware events at run time and interrupt service routines that you can adapt as needed. Select Components PSoC Designer provides a library of pre-built, pre-tested hardware peripheral components called "user modules." User modules make selecting and implementing peripheral devices, both analog and digital, simple. Configure Components Each of the User Modules you select establishes the basic register settings that implement the selected function. They also provide parameters and properties that allow you to tailor their precise configuration to your particular application. For example, a PWM User Module configures one or more digital PSoC blocks, one for each 8 bits of resolution. The user module parameters permit you to establish the pulse width and duty cycle. Configure the parameters and properties to correspond to your chosen application. Enter values directly or by selecting values from drop-down menus. All the user modules are documented in datasheets that may be viewed directly in PSoC Designer or on the Cypress website. These user module datasheets explain the internal operation of the User Module and provide performance specifications. Each datasheet describes the use of each user module parameter, and other information you may need to successfully implement your design. Document Number: 001-12550 Rev. *J You build signal chains at the chip level by interconnecting user modules to each other and the I/O pins. You perform the selection, configuration, and routing so that you have complete control over all on-chip resources. Generate, Verify, and Debug A complete code development environment allows you to develop and customize your applications in C, assembly language, or both. The last step in the development process takes place inside PSoC Designer's Debugger (access by clicking the Connect icon). PSoC Designer downloads the HEX image to the ICE where it runs at full speed. PSoC Designer debugging capabilities rival those of systems costing many times more. In addition to traditional single-step, run-to-breakpoint and watch-variable features, the debug interface provides a large trace buffer and allows you to define complex breakpoint events that include monitoring address and data bus values, memory locations and external signals. Page 7 of 39 CY8C21334, CY8C21534 Pinouts The CY8C21x34 PSoC device is available in a variety of packages which are listed and illustrated in the following tables. Every port pin (labeled with a “P”) is capable of digital I/O and connection to the common analog bus. However, VSS, VDD, and XRES are not capable of digital I/O. 20-Pin Part Pinout Table 2. 20-Pin Part Pinout (shrink small-outline package (SSOP)) Type Pin Name No. Digital Analog Description 1 I/O I, M P0 Analog column mux input 2 I/O I, M P0 Analog column mux input 3 I/O I, M P0 Analog column mux input, CMOD capacitor pin 4 I/O I, M P0 Analog column mux input, CMOD capacitor pin VSS Ground connection 5 Power 6 I/O M P1 I2C serial clock (SCL) 7 I/O M P1 I2C serial data (SDA) 8 I/O M P1 9 I/O M P1 I2C SCL, ISSP-SCLK VSS Ground connection I2C SDA, ISSP-SDATA 10 Power 11 I/O M P1 12 I/O M P1 13 I/O M P1 14 I/O M P1 15 Input XRES Active high external reset with internal pull-down I/O I, M P0 Analog column mux input 17 I/O I, M P0 Analog column mux input 18 I/O I, M P0 Analog column mux input 19 I/O I, M P0 Analog column mux input VDD Supply voltage Power AI, M, P0 1 AI, M, P0 2 AI, M, P0 3 AI, M, P0 4 VSS 5 I2C SCL, M, P1 6 I2C SDA, M, P1 7 M, P1 8 I2C SCL, M, P1 9 VSS 10 SSOP 20 19 18 17 16 15 14 13 12 11 VDD P0, M, AI P0, M, AI P0, M, AI P0, M, AI XRES P1, M P1, M, EXTCLK P1, M P1, M, I2C SDA Optional external clock input (EXTCLK) 16 20 Figure 3. CY8C21334 20-Pin PSoC Device LEGEND A = Analog, I = Input, O = Output, and M = Analog Mux Input. Note 4. These are the ISSP pins, which are not high Z when coming out of POR. See the PSoC Technical Reference Manual for details. Document Number: 001-12550 Rev. *J Page 8 of 39 CY8C21334, CY8C21534 28-Pin Part Pinout Table 3. 28-Pin Part Pinout (SSOP) Type Pin No. Digital Analog 1 I/O I, M P0 Analog column mux input 2 I/O I, M P0 Analog column mux input 3 I/O I, M P0 Analog column mux input, CMOD capacitor pin 4 I/O I, M P0 Analog column mux input, CMOD capacitor pin 5 I/O M P2 6 I/O M P2 7 I/O M P2 8 I/O M P2 Name Description VSS Ground connection 10 I/O M P1 I2C SCL 11 I/O M P1 I2C SDA 12 I/O M P1 13 I/O M P1 I2C SCL, ISSP-SCLK VSS Ground connection I2C SDA, ISSP-SDATA 9 14 Power Power 15 I/O M P1 16 I/O M P1 17 I/O M P1 18 I/O M P1 19 Input AI, M, P0 AI, M, P0 AI, M, P0 AI, M, P0 M, P2 M, P2 M, P2 M, P2 VSS I2C SCL, M, P1 I2C SDA, M, P1 M, P1 I2C SCL, M, P1 VSS 1 2 3 4 5 6 7 8 9 10 11 12 13 14 SSOP 28 27 26 25 24 23 22 21 20 19 18 17 16 15 VDD P0, M, AI P0, M, AI P0, M, AI P0, M, AI P2, M P2, M P2, M P2, M XRES P1, M P1, M, EXTCLK P1, M P1, M, I2C SDA Optional EXTCLK XRES Active high external reset with internal pull-down 20 I/O M P2 21 I/O M P2 22 I/O M P2 23 I/O M P2 24 I/O I, M P0 Analog column mux input 25 I/O I, M P0 Analog column mux input 26 I/O I, M P0 Analog column mux input 27 I/O I, M P0 Analog column mux input VDD Supply voltage 28 Figure 4. CY8C21534 28-Pin PSoC Device Power LEGEND A = Analog, I = Input, O = Output, and M = Analog Mux Input. Note 5. These are the ISSP pins, which are not high Z when coming out of POR. See the PSoC Technical Reference Manual for details. Document Number: 001-12550 Rev. *J Page 9 of 39 CY8C21334, CY8C21534 Registers Register Conventions Register Mapping Tables This section lists the registers of the CY8C21x34 PSoC device. For detailed register information, refer to the PSoC Technical Reference Manual. The PSoC device has a total register address space of 512 bytes. The register space is referred to as I/O space and is divided into two banks, bank 0 and bank 1. The XIO bit in the Flag register (CPU_F) determines which bank the user is currently in. When the XIO bit is set to ‘1’, the user is in bank 1. The register conventions specific to this section are listed in the following table. Convention Description R Read register or bit(s) W Write register or bit(s) L Logical register or bit(s) C Clearable register or bit(s) # Access is bit specific Document Number: 001-12550 Rev. *J Note In the following register mapping tables, blank fields are Reserved and must not be accessed. Page 10 of 39 CY8C21334, CY8C21534 Table 4. Register Map 0 Table: User Space Addr Access Name (0,Hex) PRT0DR 00 RW PRT0IE 01 RW PRT0GS 02 RW PRT0DM2 03 RW PRT1DR 04 RW PRT1IE 05 RW PRT1GS 06 RW PRT1DM2 07 RW PRT2DR 08 RW PRT2IE 09 RW PRT2GS 0A RW PRT2DM2 0B RW 0C 0D 0E 0F 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F DBB00DR0 20 # AMX_IN DBB00DR1 21 W AMUX_CFG DBB00DR2 22 RW PWM_CR DBB00CR0 23 # DBB01DR0 24 # CMP_CR0 DBB01DR1 25 W DBB01DR2 26 RW CMP_CR1 DBB01CR0 27 # DCB02DR0 28 # ADC0_CR DCB02DR1 29 W ADC1_CR DCB02DR2 2A RW DCB02CR0 2B # DCB03DR0 2C # TMP_DR0 DCB03DR1 2D W TMP_DR1 DCB03DR2 2E RW TMP_DR2 DCB03CR0 2F # TMP_DR3 30 31 32 ACE00CR1 33 ACE00CR2 34 35 36 ACE01CR1 37 ACE01CR2 38 39 3A 3B 3C 3D 3E 3F Blank fields are Reserved and must not be accessed. Name Document Number: 001-12550 Rev. *J Addr (0,Hex) 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4E 4F 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5D 5E 5F 60 61 62 63 64 65 66 67 68 69 6A 6B 6C 6D 6E 6F 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7D 7E 7F Access RW RW RW # RW # # RW RW RW RW RW RW RW RW Addr (0,Hex) ASE10CR0 80 81 82 83 ASE11CR0 84 85 86 87 88 89 8A 8B 8C 8D 8E 8F 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9E 9F A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF RDI0RI B0 RDI0SYN B1 RDI0IS B2 RDI0LT0 B3 RDI0LT1 B4 RDI0RO0 B5 RDI0RO1 B6 B7 B8 B9 BA BB BC BD BE BF # Access is bit specific. Name Access Name RW RW CUR_PP STK_PP IDX_PP MVR_PP MVW_PP I2C_CFG I2C_SCR I2C_DR I2C_MSCR INT_CLR0 INT_CLR1 INT_CLR3 INT_MSK3 INT_MSK0 INT_MSK1 INT_VC RES_WDT DEC_CR0 DEC_CR1 RW RW RW RW RW RW RW CPU_F DAC_D CPU_SCR1 CPU_SCR0 Addr (0,Hex) C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF Access RW RW RW RW RW RW # RW # RW RW RW RW RW RW RC W RW RW RL RW # # Page 11 of 39 CY8C21334, CY8C21534 Table 5. Register Map 1 Table: Configuration Space Addr Access Name (1,Hex) PRT0DM0 00 RW PRT0DM1 01 RW PRT0IC0 02 RW PRT0IC1 03 RW PRT1DM0 04 RW PRT1DM1 05 RW PRT1IC0 06 RW PRT1IC1 07 RW PRT2DM0 08 RW PRT2DM1 09 RW PRT2IC0 0A RW PRT2IC1 0B RW 0C 0D 0E 0F 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F DBB00FN 20 RW CLK_CR0 DBB00IN 21 RW CLK_CR1 DBB00OU 22 RW ABF_CR0 23 AMD_CR0 DBB01FN 24 RW CMP_GO_EN DBB01IN 25 RW DBB01OU 26 RW AMD_CR1 27 ALT_CR0 DCB02FN 28 RW DCB02IN 29 RW DCB02OU 2A RW 2B CLK_CR3 DCB03FN 2C RW TMP_DR0 DCB03IN 2D RW TMP_DR1 DCB03OU 2E RW TMP_DR2 2F TMP_DR3 30 31 32 ACE00CR1 33 ACE00CR2 34 35 36 ACE01CR1 37 ACE01CR2 38 39 3A 3B 3C 3D 3E 3F Blank fields are Reserved and must not be accessed. Name Document Number: 001-12550 Rev. *J Addr (1,Hex) 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4E 4F 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5D 5E 5F 60 61 62 63 64 65 66 67 68 69 6A 6B 6C 6D 6E 6F 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7D 7E 7F Access RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW Addr (1,Hex) ASE10CR0 80 81 82 83 ASE11CR0 84 85 86 87 88 89 8A 8B 8C 8D 8E 8F 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9E 9F A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF RDI0RI B0 RDI0SYN B1 RDI0IS B2 RDI0LT0 B3 RDI0LT1 B4 RDI0RO0 B5 RDI0RO1 B6 B7 B8 B9 BA BB BC BD BE BF # Access is bit specific. Name Access Name RW RW GDI_O_IN GDI_E_IN GDI_O_OU GDI_E_OU MUX_CR0 MUX_CR1 MUX_CR2 MUX_CR3 OSC_GO_EN OSC_CR4 OSC_CR3 OSC_CR0 OSC_CR1 OSC_CR2 VLT_CR VLT_CMP ADC0_TR ADC1_TR IMO_TR ILO_TR BDG_TR ECO_TR RW RW RW RW RW RW RW CPU_F DAC_CR CPU_SCR1 CPU_SCR0 Addr (1,Hex) C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF Access RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW R RW RW W W RW W RL RW # # Page 12 of 39 CY8C21334, CY8C21534 Electrical Specifications This section presents the DC and AC electrical specifications of the CY8C21x34 PSoC device. For the most up-to-date electrical specifications, visit the Cypress website at http://www.cypress.com. Specifications are valid for –40 C TA 85 C and TJ 100 C as specified, except where noted. Refer to Table 12 on page 18 for the electrical specifications for the IMO using slow IMO (SLIMO) mode. Figure 5. Voltage versus CPU Frequency 5.25 lid ing Va rat ion pe g O Re 3.6 5.25 lid ing Va rat ion pe g O Re 3.0 SLIMO Mode = 1 SLIMO Mode = 0 SLIMO Mode = 1 SLIMO Mode = 0 4.75 VDD Voltage (V) 4.75 VDD Voltage (V) Figure 6. IMO Frequency Trim Options 3.6 3.0 0 0 93 kHz 12 MHz CPU Frequency (nominal setting) Document Number: 001-12550 Rev. *J 24 MHz 6 MHz 12 MHz 24 MHz IMO Frequency Page 13 of 39 CY8C21334, CY8C21534 Absolute Maximum Ratings Exceeding maximum ratings may shorten the useful life of the device. User guidelines are not tested Symbol TSTG Description Storage temperature TBAKETEMP Bake temperature tBAKETIME Bake time TA Ambient temperature with power applied Supply voltage on VDD relative to VSS DC input voltage DC voltage applied to tri-state Maximum current into any port pin Electrostatic discharge voltage Latch up current VDD VIO VIOZ IMIO ESD LU Min –55 Typ 25 Max +100 Units Notes C Higher storage temperatures reduce data retention time. Recommended storage temperature is +25 C ± 25 C. Time spent in storage at a temperature greater than 65 °C counts toward the FlashDR electrical specification in Table 11 on page 17. C – 125 See package label –40 – See package label 72 Hours – +85 C –0.5 VSS – 0.5 VSS – 0.5 –25 2000 – – – – – – – +6.0 VDD + 0.5 VDD + 0.5 +50 – 200 V V V mA V mA Min –40 –40 Typ – – Max +85 +100 Human Body Model ESD Operating Temperature Symbol TA TJ Description Ambient temperature Junction temperature Document Number: 001-12550 Rev. *J Units Notes C C The temperature rise from ambient to junction is package specific. See Thermal Impedances on page 25. The user must limit the power consumption to comply with this requirement. Page 14 of 39 CY8C21334, CY8C21534 DC Electrical Characteristics DC Chip Level Specifications The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V and –40 C TA 85 C or 3.0 V to 3.6 V and –40 C TA 85 C, respectively. Typical parameters apply to 5 V or 3.3 V at 25 C and are for design guidance only. Table 6. DC Chip Level Specifications Symbol VDD Description Supply voltage Min 3.0 Typ – Max 5.25 IDD Supply current, IMO = 24 MHz – 4 6 IDD3 Supply current, IMO = 6 MHz using SLIMO mode – 2 4 ISB1 Sleep (mode) current with POR, LVD, sleep timer, WDT, and ILO active Sleep (mode) current with POR, LVD, sleep timer, WDT, and ILO active Reference voltage (Bandgap) – 2.8 7 – 5 15 A VDD = 5.25 V, –40 C TA 85 C 1.28 1.30 1.32 V Trimmed for appropriate VDD range ISB2 VREF Units Notes V See table titled DC POR and LVD Specifications on page 16 mA Conditions are VDD = 5.25 V, CPU = 3 MHz, 48 MHz disabled. VC1 = 1.5 MHz, VC2 = 93.75 kHz, VC3 = 0.366 kHz mA Conditions are VDD = 3.3 V, CPU = 3 MHz, 48 MHz disabled. VC1 = 375 kHz, VC2 = 23.4 kHz, VC3 = 0.091 kHz A VDD = 3.3 V, –40 C TA 85 C DC GPIO Specifications The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V and –40 C TA 85 C or 3.0 V to 3.6 V and –40 C TA 85 C, respectively. Typical parameters apply to 5 V or 3.3 V at 25 C and are for design guidance only. Table 7. DC GPIO Specifications Symbol RPU RPD Description Pull-up resistor Pull-down resistor Min 4 4 Typ 5.6 5.6 Max 8 8 VOH High output level VDD – 1.0 – – VOL Low output level – – 0.75 IOH High level source current 10 – – IOL Low level sink current 25 – – VIL Input low level – – 0.8 VIH VH IIL CIN Input high level Input hysteresis Input leakage (absolute value) Capacitive load on pins as input 2.1 – – – – 60 1 3.5 – – 10 V mV nA pF COUT Capacitive load on pins as output – 3.5 10 pF Document Number: 001-12550 Rev. *J Units Notes k k Also applies to the internal pull-down resistor on the XRES pin V IOH = 10 mA, VDD = 4.75 to 5.25 V (8 total loads, 4 on even port pins (for example, P0, P1), 4 on odd port pins (for example, P0, P1)) V IOL = 25 mA, VDD = 4.75 to 5.25 V (8 total loads, 4 on even port pins (for example, P0, P1), 4 on odd port pins (for example, P0, P1)) mA VOH VDD – 1.0 V, see the limitations of the total current in the note for VOH mA VOL 0.75 V, see the limitations of the total current in the note for VOL V Gross tested to 1 A. Package and pin dependent Temp = 25 C Package and pin dependent Temp = 25 C Page 15 of 39 CY8C21334, CY8C21534 DC Operational Amplifier Specifications The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V and –40 C TA 85 C or 3.0 V to 3.6 V and –40 C TA 85 C, respectively. Typical parameters apply to 5 V or 3.3 V at 25 C and are for design guidance only. Table 8. DC Operational Amplifier Specifications Symbol VOSOA TCVOSOA IEBOA CINOA VCMOA GOLOA ISOA Description Input offset voltage (absolute value) Average input offset voltage drift Input leakage current (Port 0 analog pins) Input capacitance (Port 0 analog pins) Min – – – – Typ 2.5 10 200 4.5 Common mode voltage range Open loop gain Supply current 3.0 V VDD 3.6 V 4.75 V VDD 5.25 V 0.0 – – 80 – – 30 35 Max 15 – – 9.5 Units Notes mV V/C pA Gross tested to 1 A pF Package and pin dependent Temp = 25 C VDD – 1 V – dB – – A A DC Analog Mux Bus Specifications The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V and –40 C TA 85 C or 3.0 V to 3.6 V and –40 C TA 85 C, respectively. Typical parameters apply to 5 V or 3.3 V at 25 C and are for design guidance only. Table 9. DC Analog Mux Bus Specifications Symbol RSW RVDD Description Switch resistance to common analog bus Resistance of initialization switch to VDD Min – – Typ – – Max 400 800 Units Notes DC POR and LVD Specifications The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V and –40 C TA 85 C or 3.0 V to 3.6 V and –40 C TA 85 C, respectively. Typical parameters apply to 5 V or 3.3 V at 25 C and are for design guidance only. Table 10. DC POR and LVD Specifications Symbol Description VPPOR0 VPPOR1 VPPOR2 VDD value for precision POR (PPOR) trip PORLEV[1:0] = 00b PORLEV[1:0] = 01b PORLEV[1:0] = 10b VLVD1 VLVD2 VLVD3 VLVD4 VLVD5 VLVD6 VLVD7 VDD value for LVD trip VM[2:0] = 001b VM[2:0] = 010b VM[2:0] = 011b VM[2:0] = 100b VM[2:0] = 101b VM[2:0] = 110b VM[2:0] = 111b Min Typ Max Units Notes VDD must be greater than or equal to 2.5 V during startup, reset from the XRES pin, or reset from watchdog. – – – 2.36 2.82 4.55 2.40 2.95 4.70 V V V 2.85 2.95 3.06 4.37 4.50 4.62 4.71 2.92 3.02 3.13 4.48 4.64 4.73 4.81 2.99 3.09 3.20 4.55 4.75 4.83 4.95 V V V V V V V Notes 6. Atypical behavior: IEBOA of Port 0 Pin 0 is below 1 nA at 25 C; 50 nA over temperature. Use Port 0 Pins 1-7 for the lowest leakage of 200 pA. 7. Always greater than 50 mV above VPPOR1 (PORLEV[1:0] = 01b) for falling supply. Document Number: 001-12550 Rev. *J Page 16 of 39 CY8C21334, CY8C21534 DC Programming Specifications The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V and –40 C TA 85 C or 3.0 V to 3.6 V and –40 C TA 85 C, respectively. Typical parameters apply to 5 V or 3.3 V at 25 C and are for design guidance only. Table 11. DC Programming Specifications Symbol VDDP Description VDD for programming and erase Min 4.5 Typ 5 Max 5.5 Units V VDDLV Low VDD for verify 3.0 3.1 3.2 V VDDHV High VDD for verify 5.1 5.2 5.3 V 3.0 – 5.25 V 5 – – – 25 0.8 – 0.2 mA V V mA – 1.5 mA – 0.75 V – VDD V – – – – – – – – Years VDDIWRITE Supply voltage for flash write operation IDDP VILP VIHP IILP Supply current during programming or verify – Input low voltage during programming or verify – Input high voltage during programming or verify 2.2 Input current when applying VILP to P1 or – P1 during programming or verify IIHP Input current when applying VIHP to P1 or – P1 during programming or verify VOLV Output low voltage during programming or – verify VOHV Output high voltage during programming or VDD – 1.0 verify FlashENPB Flash endurance (per block)[8, 9] 1,000 FlashENT Flash endurance (total)[9, 10] 128,000 FlashDR Flash data retention 15 Notes This specification applies to the functional requirements of external programmer tools This specification applies to the functional requirements of external programmer tools This specification applies to the functional requirements of external programmer tools This specification applies to this device when it is executing internal flash writes Driving internal pull-down resistor Driving internal pull-down resistor Erase/write cycles per block Erase/write cycles Notes 8. The erase/write cycle limit per block (FlashENPB) is only guaranteed if the device operates within one voltage range. Voltage ranges are 3.0 V to 3.6 V and 4.75 V to 5.25 V. 9. For the full temperature range, the user must employ a temperature sensor user module (FlashTemp) or other temperature sensor, and feed the result to the temperature argument before writing. Refer to the Flash APIs Application Note AN2015 for more information. 10. The maximum total number of allowed erase/write cycles is the minimum FlashENPB value multiplied by the number of flash blocks in the device. Document Number: 001-12550 Rev. *J Page 17 of 39 CY8C21334, CY8C21534 AC Electrical Characteristics AC Chip Level Specifications The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V and –40 C TA 85 C or 3.0 V to 3.6 V and –40 C TA 85 C, respectively. Typical parameters apply to 5 V or 3.3 V at 25 C and are for design guidance only. Table 12. AC Chip Level Specifications Symbol FIMO24 Description IMO frequency for 24 MHz Min 22.8 Typ 24 Max 25.2 Units MHz Notes Trimmed for 5 V or 3.3 V operation using factory trim values. See Figure 6 on page 13. SLIMO mode = 0. FIMO6 IMO frequency for 6 MHz 5.5 6 6.5 MHz Trimmed for 5 V or 3.3 V operation using factory trim values. See Figure 6 on page 13. SLIMO mode = 1. FCPU1 FCPU2 FBLK5 CPU frequency (5 V VDD nominal) CPU frequency (3.3 V VDD nominal) Digital PSoC block frequency0(5 V VDD nominal) Digital PSoC block frequency (3.3 V VDD nominal) 0.089 0.089 0 24 12 48 25.2 12.6 50.4[11,12] MHz MHz MHz 24 MHz only for SLIMO mode = 0 0 24 25.2[11, 12] MHz FBLK33. Refer to the AC Digital Block Specifications below Refer to the AC Digital Block Specifications below F32K1 ILO frequency 15 32 64 kHz This specification applies when the ILO has been trimmed F32KU ILO untrimmed frequency 5 – 100 kHz After a reset and before the M8C processor starts to execute, the ILO is not trimmed. External reset pulse width 24 MHz duty cycle ILO duty cycle 24 MHz trim step size 48 MHz output frequency Maximum frequency of signal on row input or row output SRPOWERUP Power supply slew rate tPOWERUP Time between end of POR state and CPU code execution  tJIT_IMO 24 MHz IMO cycle-to-cycle jitter (RMS) 24 MHz IMO long term N cycle-to-cycle jitter (RMS) 24 MHz IMO period jitter (RMS) 10 40 20 – 45.6 – – 50 50 50 48.0 – – 60 80 – 50.4 12.6 s % % kHz MHz MHz – – – 16 250 100 V/ms ms – – 200 300 700 900 ps ps – 100 400 ps tXRST DC24M DCILO Step24M Fout48M FMAX VDD slew rate during power-up Power-up from 0 V. N = 32 Notes 11. Accuracy derived from IMO with appropriate trim for VDD range. 12. See the individual user module datasheets for information on maximum frequencies for user modules. 13. Refer to Cypress Jitter Specifications application note, Understanding Datasheet Jitter Specifications for Cypress Timing Products – AN5054 for more information. Document Number: 001-12550 Rev. *J Page 18 of 39 CY8C21334, CY8C21534 AC GPIO Specifications The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V and –40 C TA 85 C or 3.0 V to 3.6 V and –40 C TA 85 C, respectively. Typical parameters apply to 5 V or 3.3 V at 25 C and are for design guidance only. Table 13. AC GPIO Specifications Symbol FGPIO TRiseF TFallF TRiseS TFallS Description GPIO operating frequency Rise time, normal strong mode, Cload = 50 pF Fall time, normal strong mode, Cload = 50 pF Rise time, slow strong mode, Cload = 50 pF Fall time, slow strong mode, Cload = 50 pF Min 0 2 2 7 7 Typ – 6 6 27 22 Max 12.6 18 18 – – Units MHz ns ns ns ns Notes Normal Strong Mode VDD = 4.75 to 5.25 V, 10% to 90% VDD = 4.75 to 5.25 V, 10% to 90% VDD = 3 to 5.25 V, 10% to 90% VDD = 3 to 5.25 V, 10% to 90% Figure 7. GPIO Timing Diagram 90% GPIO Pin Output Voltage 10% TRiseF TRiseS Document Number: 001-12550 Rev. *J TFallF TFallS Page 19 of 39 CY8C21334, CY8C21534 AC Operational Amplifier Specifications The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V and –40 C TA 85 C or 3.0 V to 3.6 V and –40 C TA 85 C, respectively. Typical parameters apply to 5 V or 3.3 V at 25 C and are for design guidance only. Table 14. AC Operational Amplifier Specifications Symbol tCOMP Description Comparator mode response time, 50 mV overdrive Min – Typ 75 Max 100 Units ns Notes AC Digital Block Specifications The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V and –40 C TA 85 C or 3.0 V to 3.6 V and –40 C TA 85 C, respectively. Typical parameters apply to 5 V or 3.3 V at 25 C and are for design guidance only. Table 15. AC Digital Block Specifications Function All functions Timer Counter Dead Band CRCPRS (PRS Mode) Description Block input clock frequency VDD 4.75 V VDD < 4.75 V Input clock frequency No capture, VDD 4.75 V No capture, VDD < 4.75 V With capture Capture pulse width Input clock frequency No enable input, VDD 4.75 V No enable input, VDD < 4.75 V With enable input Enable input pulse width Kill pulse width Asynchronous restart mode Synchronous restart mode Disable mode Input clock frequency VDD 4.75 V VDD < 4.75 V Input clock frequency VDD 4.75 V VDD < 4.75 V Input clock frequency CRCPRS (CRC Mode) SPIM Input clock frequency SPIS Input clock (SCLK) frequency Width of SS_Negated between transmissions Document Number: 001-12550 Rev. *J Min Typ Max Units Notes – – – – 50.4 25.2 MHz MHz – – – 50 – – – – 50.4 25.2 25.2 – MHz MHz MHz ns – – – 50 – – – – 50.4 25.2 25.2 – MHz MHz MHz ns 20 50 50 – – – – – – ns ns ns – – – – 50.4 25.2 MHz MHz – – – – – – 50.4 25.2 25.2 MHz MHz MHz – – 8.4 – – 4.2 50 – – MHz The SPI serial clock (SCLK) frequency is equal to the input clock frequency divided by 2. MHz The input clock is the SPI SCLK in SPIS mode. ns Page 20 of 39 CY8C21334, CY8C21534 Table 15. AC Digital Block Specifications (continued) Function Transmitter Receiver Description Input clock frequency VDD 4.75 V, 2 stop bits VDD 4.75 V, 1 stop bit VDD < 4.75 V Input clock frequency VDD 4.75 V, 2 stop bits VDD 4.75 V, 1 stop bit VDD < 4.75 V Min Typ Max Units – – – – – – 50.4 25.2 25.2 – – – – – – 50.4 25.2 25.2 Notes The baud rate is equal to the input MHz clock frequency divided by 8. MHz MHz The baud rate is equal to the input MHz clock frequency divided by 8. MHz MHz AC External Clock Specifications The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V and –40 C TA 85 C or 3.0 V to 3.6 V and –40 C TA 85 C, respectively. Typical parameters apply to 5 V or 3.3 V at 25 C and are for design guidance only. Table 16. 5-V AC External Clock Specifications Symbol FOSCEXT Min Typ Max Units Frequency Description 0.093 – 24.6 MHz Notes – High period 20.6 – 5300 ns – Low period 20.6 – – ns – Power-up IMO to switch 150 – – s Min Typ Max Units Notes Table 17. 3.3-V AC External Clock Specifications Symbol Description FOSCEXT Frequency with CPU clock divide by 1 0.093 – 12.3 MHz Maximum CPU frequency is 12 MHz at 3.3 V. With the CPU clock divider set to 1, the external clock must adhere to the maximum frequency and duty cycle requirements. FOSCEXT Frequency with CPU clock divide by 2 or greater 0.186 – 24.6 MHz If the frequency of the external clock is greater than 12 MHz, the CPU clock divider must be set to 2 or greater. In this case, the CPU clock divider ensures that the fifty percent duty cycle requirement is met. – High period with CPU clock divide by 1 41.7 – 5300 ns – Low period with CPU clock divide by 1 41.7 – – ns – Power-up IMO to switch 150 – – s Notes 14. 50 ns minimum input pulse width is based on the input synchronizers running at 24 MHz (42 ns nominal period). 15. Accuracy derived from IMO with appropriate trim for VDD range. Document Number: 001-12550 Rev. *J Page 21 of 39 CY8C21334, CY8C21534 AC Programming Specifications The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V and –40 C TA 85 C or 3.0 V to 3.6 V and –40 C TA 85 C, respectively. Typical parameters apply to 5 V or 3.3 V at 25 C and are for design guidance only. Table 18. AC Programming Specifications Symbol tRSCLK tFSCLK tSSCLK tHSCLK tSCLK tERASEB tWRITE tDSCLK tDSCLK3 tPRGH tPRGC Description Rise time of SCLK Fall time of SCLK Data setup time to falling edge of SCLK Data hold time from falling edge of SCLK Frequency of SCLK Flash block erase time Flash block write time Data out delay from falling edge of SCLK Data out delay from falling edge of SCLK Total flash block program time (tERASEB + tWRITE), hot Total flash block program time (tERASEB + tWRITE), cold Min 1 1 40 40 0 – – – – – Typ – – – – – 10 40 38 44 – Max 20 20 – – 8 40 160 45 50 100 Units ns ns ns ns MHz ms ms ns ns ms – – 200 ms Notes 3.6 VDD 3.0 VDD 3.6 TJ 0 C TJ 0 C Note 16. For the full temperature range, the user must employ a temperature sensor user module (FlashTemp) or other temperature sensor, and feed the result to the temperature argument before writing. Refer to the Flash APIs Application Note AN2015 for more information. Document Number: 001-12550 Rev. *J Page 22 of 39 CY8C21334, CY8C21534 AC I2C Specifications The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V and –40 C TA 85 C or 3.0 V to 3.6 V and –40 C TA 85 C, respectively. Typical parameters apply to 5 V or 3.3 V at 25 C and are for design guidance only. Table 19. AC Characteristics of the I2C SDA and SCL Pins Symbol Standard Mode Description Fast Mode Units Min Max Min Max 0 100 0 400 kHz FSCLI2C SCL clock frequency tHDSTAI2C Hold time (repeated) START condition. After this period, the first clock pulse is generated. 4.0 – 0.6 – s tLOWI2C LOW period of the SCL clock 4.7 – 1.3 – s tHIGHI2C HIGH period of the SCL clock 4.0 – 0.6 – s tSUSTAI2C Setup time for a repeated START condition 4.7 – 0.6 – s tHDDATI2C Data hold time 0 – 0 – s 250 – 100 – ns tSUDATI2C Data setup time tSUSTOI2C Setup time for STOP condition 4.0 – 0.6 – s tBUFI2C Bus free time between a STOP and START condition 4.7 – 1.3 – s tSPI2C Pulse width of spikes are suppressed by the input filter. – – 0 50 ns Notes Figure 8. Definition for Timing for Fast/Standard Mode on the I2C Bus I2C_SDA TSUDATI2C THDSTAI2C TSPI2C THDDATI2CTSUSTAI2C TBUFI2C I2C_SCL THIGHI2C TLOWI2C S START Condition TSUSTOI2C Sr Repeated START Condition P S STOP Condition Notes 17. FSCLI2C is derived from SysClk of the PSoC. This specification assumes that SysClk is operating at 24 MHz, nominal. If SysClk is at a lower frequency, then the FSCLI2C specification adjusts accordingly 18. A Fast-Mode I2C-bus device can be used in a Standard-Mode I2C-bus system, but the requirement tSUDATI2C 250 ns must then be met. This is automatically the case if the device does not stretch the LOW period of the SCL signal. If such device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line trmax +tSUDATI2C = 1000 + 250 = 1250 ns (according to the Standard-Mode I2C-bus specification) before the SCL line is released. Document Number: 001-12550 Rev. *J Page 23 of 39 CY8C21334, CY8C21534 Packaging Information This section illustrates the packaging specifications for the CY8C21x34 PSoC device, along with the thermal impedances for each package. Important Note Emulation tools may require a larger area on the target PCB than the chip's footprint. For a detailed description of the emulation tools' dimensions, refer to the emulator pod drawings at http://www.cypress.com. Packaging Dimensions Figure 9. 20-pin SSOP (210 Mils) O20.21 Package Outline, 51-85077 51-85077 *E Document Number: 001-12550 Rev. *J Page 24 of 39 CY8C21334, CY8C21534 Figure 10. 28-pin SSOP (210 Mils) O28.21 Package Outline, 51-85079 51-85079 *E Thermal Impedances Solder Reflow Specifications Table 20. Thermal Impedances per Package Package 20-Pin SSOP 28-Pin SSOP Typical JA 117 C/W 96 C/W  Typical JC 41 C/W 39 C/W Table 21 shows the solder reflow temperature limits that must not be exceeded. Table 21. Solder Reflow Specifications Package Maximum Peak Temperature (TC) Maximum Time above TC – 5 °C 20-Pin SSOP 260 C 30 seconds 28-Pin SSOP 260 C 30 seconds Note 19. TJ = TA + Power x JA Document Number: 001-12550 Rev. *J Page 25 of 39 CY8C21334, CY8C21534 Tape and Reel Information Figure 11. 20-pin SSOP (209 Mils) Advantek Carrier Tape Drawing, 51-51101 51-51101 *C Document Number: 001-12550 Rev. *J Page 26 of 39 CY8C21334, CY8C21534 Figure 12. 28-pin SSOP (209 Mils) C-PAK Carrier Tape Drawing, 51-51100 51-51100 *C Table 22. Tape and Reel Specifications Package Cover Tape Width (mm) Hub Size (inches) Minimum Leading Empty Pockets 20-Pin SSOP 28-Pin SSOP 13.3 13.3 4 7 42 42 Document Number: 001-12550 Rev. *J Minimum Trailing Empty Pockets 25 25 Standard Full Reel Quantity 2000 1000 Page 27 of 39 CY8C21334, CY8C21534 Development Tool Selection This section presents the development tools available for the CY8C21x34 family. Software PSoC Designer At the core of the PSoC development software suite is PSoC Designer. Utilized by thousands of PSoC developers, this robust software has been facilitating PSoC designs for years. PSoC Designer is available free of charge at http://www.cypress.com. PSoC Designer comes with a free C compiler. PSoC Programmer Flexible enough to be used on the bench in development, yet suitable for factory programming, PSoC Programmer works either as a standalone programming application or it can operate directly from PSoC Designer. PSoC Programmer software is compatible with both PSoC ICE-Cube in-circuit emulator and PSoC MiniProg. PSoC programmer is available free of charge at http://www.cypress.com. Development Kits pre-defined control circuitry and plug-in hardware. The kit comes with a control boards for CY8C20x34 and CY8C21x34 devices as well as a breadboard module and a button(5)/slider module. Evaluation Tools All evaluation tools can be purchased from the Cypress Online Store. CY3210-PSoCEval1 The CY3210-PSoCEval1 kit features an evaluation board and the MiniProg1 programming unit. The evaluation board includes an LCD module, potentiometer, LEDs, an RS-232 port, and plenty of breadboarding space to meet all of your evaluation needs. The kit includes: ■ Evaluation board with LCD module ■ MiniProg programming unit ■ Two 28-Pin CY8C29466-24PXI PDIP PSoC device samples ■ PSoC Designer software CD All development kits can be purchased from the Cypress Online Store. The online store also has the most up-to-date information on kit contents, descriptions, and availability. ■ Getting Started guide ■ USB 2.0 cable CY3215-DK Basic Development Kit CY3235-ProxDet The CY3215-DK is for prototyping and development with PSoC Designer. This kit supports in-circuit emulation, and the software interface allows you to run, halt, and single step the processor, and view the contents of specific memory locations. Advanced emulation features are also supported through PSoC Designer. The kit includes: The CY3235 CapSense Proximity Detection Demonstration Kit allows quick and easy demonstration of a PSoC CapSense-enabled device (CY8C21x34) to accurately sense the proximity of a hand or finger along the length of a wire antenna. The kit includes: ■ ICE-Cube unit ■ 28-Pin PDIP emulation pod for CY8C29466-24PXI ■ Two 28-Pin CY8C29466-24PXI PDIP PSoC device samples ■ PSoC designer software CD ■ ISSP cable ■ MiniEval socket programming and evaluation board ■ Backward compatibility cable (for connecting to legacy pods) ■ Universal 110/220 power supply (12 V) ■ European plug adapter ■ USB 2.0 cable ■ Getting Started guide ■ Development kit registration form CY3280-BK1 The CY3280-BK1 Universal CapSense Control Kit is designed for easy prototyping and debug of CapSense designs with Document Number: 001-12550 Rev. *J ■ Proximity detection demo board w/antenna ■ I2C to USB debugging/communication bridge ■ USB cable (6 feet) ■ Supporting software CD ■ CY3235-ProxDet Quick Start guide ■ One CY8C24894 PSoC device on I2C-USB bridge ■ One CY8C21434 PSoC device on proximity detection demo board CY3210-21X34 Evaluation Pod (EvalPod) The CY3210-21X34 PSoC EvalPods are pods that connect to the ICE in-circuit emulator (CY3215-DK kit) to allow debugging capability. They can also function as a standalone device without debugging capability. The EvalPod has a 28-pin DIP footprint on the bottom for easy connection to development kits or other hardware. The top of the EvalPod has prototyping headers for easy connection to the device's pins. CY3210-21X34 provides evaluation of the CY8C21x34 PSoC device family. Page 28 of 39 CY8C21334, CY8C21534 Device Programmers All device programmers can be purchased from the Cypress Online Store. small, compact prototyping programmer that connects to the PC via a provided USB 2.0 cable. The kit includes: ■ MiniProg1 programmer CY3217-MiniProg1 ■ USB A to Mini B cable The CY3217-MiniProg1 kit allows a user to program PSoC devices via the MiniProg1 programming unit. The MiniProg is a ■ CY3217-MiniProg1 kit CD which has Kit documents, PSoC Designer/Programmer installation files ■ Getting Started guide Accessories (Emulation and Programming) Table 23. Emulation and Programming Accessories Part Number Pin Package Pod Kit Foot Kit CY8C21334-24PVXA 20-Pin SSOP CY3250-21X34 CY3250-20SSOP-FK CY8C21534-24PVXA 28-Pin SSOP CY3250-21X34 CY3250-28SSOP-FK Adapter Adapters are available at http://www.emulation.com. Notes 20. Pod kit contains an emulation pod, a flex-cable (connects the pod to the ICE), two feet, and device samples. 21. Foot kit includes surface mount feet that can be soldered to the target PCB. 22. Programming adapter converts non-DIP package to DIP footprint. Specific details and ordering information for each of the adapters are available at http://www.emulation.com. Document Number: 001-12550 Rev. *J Page 29 of 39 CY8C21334, CY8C21534 Ordering Information The following table lists the CY8C21x34 PSoC device’s key package features and ordering codes. SRAM (Bytes) Temperature Range Digital Blocks Analog Blocks Digital I/O Pins Analog Inputs Analog Outputs XRES Pin 8K 512 –40 C to +85 C 4 4 16 16 0 Yes 20-Pin (210-Mil) SSOP CY8C21334-24PVXAT (Tape and Reel) 8K 512 –40 C to +85 C 4 4 16 16 0 Yes 28-Pin (210-Mil) SSOP CY8C21534-24PVXA 8K 512 –40 C to +85 C 4 4 24 24 0 Yes 28-Pin (210-Mil) SSOP CY8C21534-24PVXAT (Tape and Reel) 8K 512 –40 C to +85 C 4 4 24 24 0 Yes Ordering Code 20-Pin (210-Mil) SSOP CY8C21334-24PVXA Package Flash (Bytes) Table 24. PSoC Device Key Features and Ordering Information Ordering Code Definitions CY 8 C 21 xxx-24xx Package Type: PX = PDIP Pb-free SX = SOIC Pb-free PVX = SSOP Pb-free LFX = QFN Pb-free AX = TQFP Pb-free Thermal Rating: A = Automotive –40 C to +85 C C = Commercial I = Industrial E = Automotive Extended –40 C to +125 C CPU Speed: 24 MHz Part Number Family Code Technology Code: C = CMOS Marketing Code: 8 = PSoC Company ID: CY = Cypress Document Number: 001-12550 Rev. *J Page 30 of 39 CY8C21334, CY8C21534 Acronyms Table 25 lists the acronyms that are used in this document. Table 25. Acronyms Used in this Datasheet Acronym AC Description Acronym alternating current Description MIPS million instructions per second AEC Automotive Electronics Council PCB printed circuit board ADC analog-to-digital converter PDIP plastic dual in-line package API application programming interface PLL phase-locked loop CPU central processing unit POR power-on reset CRC cyclic redundancy check CSD capsense sigma delta CT DAC DC PRS PSoC® continuous time digital-to-analog converter PWM direct current or duty cycle EEPROM electrically erasable programmable read-only memory EXTCLK external clock GPIO PPOR SC precision power-on reset pseudo-random sequence Programmable System-on-Chip pulse width modulator switched capacitor SCL / SCLK serial clock SDA serial data general-purpose I/O SLIMO slow internal main oscillator I2C Inter-Integrated Circuit SMP switch mode pump ICE in-circuit emulator SOIC small-outline integrated circuit IDE integrated development environment SPI serial peripheral interface ILO internal low-speed oscillator SRAM static random access memory IMO internal main oscillator SROM supervisory read-only memory I/O input/output SSOP shrink small-outline package IrDA Infrared Data Association TQFP thin quad flat pack ISSP in-system serial programming UART universal asynchronous reciever / transmitter LCD liquid crystal display USB universal serial bus LED light-emitting diode WDT watchdog timer LVD low voltage detect XRES external reset MCU microcontroller unit Reference Documents CY8CPLC20, CY8CLED16P01, CY8C29x66, CY8C27x43, CY8C24x94, CY8C24x23, CY8C24x23A, CY8C22x13, CY8C21x34, CY8C21x23, CY7C64215, CY7C603xx, CY8CNP1xx, and CYWUSB6953 PSoC® Programmable System-on-Chip Technical Reference Manual (TRM) (001-14463) Design Aids – Reading and Writing PSoC® Flash – AN2015 (001-40459) Understanding Data Sheet Jitter Specifications for Cypress Timing Products – AN5054 (001-14503) Document Number: 001-12550 Rev. *J Page 31 of 39 CY8C21334, CY8C21534 Document Conventions Units of Measure The following table lists the units of measure that are used in this document. Table 26. Units of Measure Symbol C dB KB Kbit kHz k Mbaud Mbps MHz A s Unit of Measure degree Celsius decibels 1024 bytes 1024 bits kilohertz kilohm megabaud megabits per second megahertz microampere microsecond Symbol V mA ms mV nA ns pA pF ps V Unit of Measure microvolts milliampere millisecond millivolts nanoampere nanosecond ohm picoampere picofarad picosecond volts Numeric Conventions Hexadecimal numbers are represented with all letters in uppercase with an appended lowercase ‘h’ (for example, ‘14h’ or ‘3Ah’). Hexadecimal numbers may also be represented by a ‘0x’ prefix, the C coding convention. Binary numbers have an appended lowercase ‘b’ (for example, ‘01010100b’ or ‘01000011b’). Numbers not indicated by an ‘h’, ‘b’, or ‘0x’ are in decimal format. Glossary active high 1. A logic signal having its asserted state as the logic 1 state. 2. A logic signal having the logic 1 state as the higher voltage of the two states. analog blocks The basic programmable opamp circuits. These are SC (switched capacitor) and CT (continuous time) blocks. These blocks can be interconnected to provide ADCs, DACs, multi-pole filters, gain stages, and much more. analog-to-digital converter (ADC) A device that changes an analog signal to a digital signal of corresponding magnitude. Typically, an ADC converts a voltage to a digital number. The digital-to-analog converter (DAC) performs the reverse operation. Application programming interface (API) A series of software routines that comprise an interface between a computer application and lower level services and functions (for example, user modules and libraries). APIs serve as building blocks for programmers that create software applications. asynchronous A signal whose data is acknowledged or acted upon immediately, irrespective of any clock signal. bandgap reference A stable voltage reference design that matches the positive temperature coefficient of VT with the negative temperature coefficient of VBE, to produce a zero temperature coefficient (ideally) reference. bandwidth 1. The frequency range of a message or information processing system measured in hertz. 2. The width of the spectral region over which an amplifier (or absorber) has substantial gain (or loss); it is sometimes represented more specifically as, for example, full width at half maximum. Document Number: 001-12550 Rev. *J Page 32 of 39 CY8C21334, CY8C21534 Glossary (continued) bias 1. A systematic deviation of a value from a reference value. 2. The amount by which the average of a set of values departs from a reference value. 3. The electrical, mechanical, magnetic, or other force (field) applied to a device to establish a reference level to operate the device. block 1. A functional unit that performs a single function, such as an oscillator. 2. A functional unit that may be configured to perform one of several functions, such as a digital PSoC block or an analog PSoC block. buffer 1. A storage area for data that is used to compensate for a speed difference, when transferring data from one device to another. Usually refers to an area reserved for I/O operations, into which data is read, or from which data is written. 2. A portion of memory set aside to store data, often before it is sent to an external device or as it is received from an external device. 3. An amplifier used to lower the output impedance of a system. bus 1. A named connection of nets. Bundling nets together in a bus makes it easier to route nets with similar routing patterns. 2. A set of signals performing a common function and carrying similar data. Typically represented using vector notation; for example, address[7:0]. 3. One or more conductors that serve as a common connection for a group of related devices. clock The device that generates a periodic signal with a fixed frequency and duty cycle. A clock is sometimes used to synchronize different logic blocks. comparator An electronic circuit that produces an output voltage or current whenever two input levels simultaneously satisfy predetermined amplitude requirements. compiler A program that translates a high level language, such as C, into machine language. configuration space In PSoC devices, the register space accessed when the XIO bit, in the CPU_F register, is set to ‘1’. crystal oscillator An oscillator in which the frequency is controlled by a piezoelectric crystal. Typically a piezoelectric crystal is less sensitive to ambient temperature than other circuit components. cyclic redundancy A calculation used to detect errors in data communications, typically performed using a linear feedback shift check (CRC) register. Similar calculations may be used for a variety of other purposes such as data compression. data bus A bi-directional set of signals used by a computer to convey information from a memory location to the central processing unit and vice versa. More generally, a set of signals used to convey data between digital functions. debugger A hardware and software system that allows you to analyze the operation of the system under development. A debugger usually allows the developer to step through the firmware one step at a time, set break points, and analyze memory. dead band A period of time when neither of two or more signals are in their active state or in transition. digital blocks The 8-bit logic blocks that can act as a counter, timer, serial receiver, serial transmitter, CRC generator, pseudo-random number generator, or SPI. digital-to-analog converter (DAC) A device that changes a digital signal to an analog signal of corresponding magnitude. The analog-to-digital converter (ADC) performs the reverse operation. Document Number: 001-12550 Rev. *J Page 33 of 39 CY8C21334, CY8C21534 Glossary (continued) duty cycle The relationship of a clock period high time to its low time, expressed as a percent. emulator Duplicates (provides an emulation of) the functions of one system with a different system, so that the second system appears to behave like the first system. external reset (XRES) An active high signal that is driven into the PSoC device. It causes all operation of the CPU and blocks to stop and return to a pre-defined state. flash An electrically programmable and erasable, non-volatile technology that provides you the programmability and data storage of EPROMs, plus in-system erasability. Non-volatile means that the data is retained when power is off. flash block The smallest amount of flash ROM space that may be programmed at one time and the smallest amount of flash space that may be protected. frequency The number of cycles or events per unit of time, for a periodic function. gain The ratio of output current, voltage, or power to input current, voltage, or power, respectively. Gain is usually expressed in dB. I2C A two-wire serial computer bus by Philips Semiconductors (now NXP Semiconductors). It is used to connect low-speed peripherals in an embedded system. The original system was created in the early 1980s as a battery control interface, but it was later used as a simple internal bus system for building control electronics. I2C uses only two bi-directional pins, clock and data, both running at the VDD suppy voltage and pulled high with resistors. The bus operates up to100 kbits/second in standard mode and 400 kbits/second in fast mode. ICE The in-circuit emulator that allows you to test the project in a hardware environment, while viewing the debugging device activity in a software environment (PSoC Designer). input/output (I/O) A device that introduces data into or extracts data from a system. interrupt A suspension of a process, such as the execution of a computer program, caused by an event external to that process, and performed in such a way that the process can be resumed. interrupt service routine (ISR) A block of code that normal code execution is diverted to when the CPU receives a hardware interrupt. Many interrupt sources may each exist with its own priority and individual ISR code block. Each ISR code block ends with the RETI instruction, returning the device to the point in the program where it left normal program execution. jitter 1. A misplacement of the timing of a transition from its ideal position. A typical form of corruption that occurs on serial data streams. 2. The abrupt and unwanted variations of one or more signal characteristics, such as the interval between successive pulses, the amplitude of successive cycles, or the frequency or phase of successive cycles. low voltage detect A circuit that senses VDD and provides an interrupt to the system when VDD falls below a selected threshold. (LVD) M8C An 8-bit Harvard-architecture microprocessor. The microprocessor coordinates all activity inside a PSoC by interfacing to the flash, SRAM, and register space. master device A device that controls the timing for data exchanges between two devices. Or when devices are cascaded in width, the master device is the one that controls the timing for data exchanges between the cascaded devices and an external interface. The controlled device is called the slave device. Document Number: 001-12550 Rev. *J Page 34 of 39 CY8C21334, CY8C21534 Glossary (continued) microcontroller An integrated circuit chip that is designed primarily for control systems and products. In addition to a CPU, a microcontroller typically includes memory, timing circuits, and I/O circuitry. The reason for this is to permit the realization of a controller with a minimal quantity of chips, thus achieving maximal possible miniaturization. This in turn, reduces the volume and the cost of the controller. The microcontroller is normally not used for general-purpose computation as is a microprocessor. mixed-signal The reference to a circuit containing both analog and digital techniques and components. modulator A device that imposes a signal on a carrier. noise 1. A disturbance that affects a signal and that may distort the information carried by the signal. 2. The random variations of one or more characteristics of any entity such as voltage, current, or data. oscillator A circuit that may be crystal controlled and is used to generate a clock frequency. parity A technique for testing transmitted data. Typically, a binary digit is added to the data to make the sum of all the digits of the binary data either always even (even parity) or always odd (odd parity). phase-locked loop (PLL) An electronic circuit that controls an oscillator so that it maintains a constant phase angle relative to a reference signal. pinouts The pin number assignment: the relation between the logical inputs and outputs of the PSoC device and their physical counterparts in the printed circuit board (PCB) package. Pinouts involve pin numbers as a link between schematic and PCB design (both being computer generated files) and may also involve pin names. port A group of pins, usually eight. power-on reset (POR) A circuit that forces the PSoC device to reset when the voltage is below a pre-set level. This is one type of hardware reset. PSoC® Cypress Semiconductor’s PSoC® is a registered trademark and Programmable System-on-Chip™ is a trademark of Cypress. PSoC Designer™ The software for Cypress’ Programmable System-on-Chip technology. pulse width An output in the form of duty cycle which varies as a function of the applied value. modulator (PWM) RAM An acronym for random access memory. A data-storage device from which data can be read out and new data can be written in. register A storage device with a specific capacity, such as a bit or byte. reset A means of bringing a system back to a known state. See hardware reset and software reset. ROM An acronym for read only memory. A data-storage device from which data can be read out, but new data cannot be written in. serial 1. Pertaining to a process in which all events occur one after the other. 2. Pertaining to the sequential or consecutive occurrence of two or more related activities in a single device or channel. settling time The time it takes for an output signal or value to stabilize after the input has changed from one value to another. Document Number: 001-12550 Rev. *J Page 35 of 39 CY8C21334, CY8C21534 Glossary (continued) shift register A memory storage device that sequentially shifts a word either left or right to output a stream of serial data. slave device A device that allows another device to control the timing for data exchanges between two devices. Or when devices are cascaded in width, the slave device is the one that allows another device to control the timing of data exchanges between the cascaded devices and an external interface. The controlling device is called the master device. SRAM An acronym for static random access memory. A memory device where you can store and retrieve data at a high rate of speed. The term static is used because, after a value is loaded into an SRAM cell, it remains unchanged until it is explicitly altered or until power is removed from the device. SROM An acronym for supervisory read only memory. The SROM holds code that is used to boot the device, calibrate circuitry, and perform flash operations. The functions of the SROM may be accessed in normal user code, operating from flash. stop bit A signal following a character or block that prepares the receiving device to receive the next character or block. synchronous 1. A signal whose data is not acknowledged or acted upon until the next active edge of a clock signal. 2. A system whose operation is synchronized by a clock signal. tri-state A function whose output can adopt three states: 0, 1, and Z (high-impedance). The function does not drive any value in the Z state and, in many respects, may be considered to be disconnected from the rest of the circuit, allowing another output to drive the same net. UART A UART or universal asynchronous receiver-transmitter translates between parallel bits of data and serial bits. user modules Pre-built, pre-tested hardware/firmware peripheral functions that take care of managing and configuring the lower level analog and digital PSoC blocks. User modules also provide high level API (Application Programming Interface) for the peripheral function. user space The bank 0 space of the register map. The registers in this bank are more likely to be modified during normal program execution and not just during initialization. Registers in bank 1 are most likely to be modified only during the initialization phase of the program. VDD A name for a power net meaning “voltage drain.” The most positive power supply signal. Usually 5 V or 3.3 V. VSS A name for a power net meaning “voltage source.” The most negative power supply signal. watchdog timer A timer that must be serviced periodically. If it is not serviced, the CPU resets after a specified period of time. Document Number: 001-12550 Rev. *J Page 36 of 39 CY8C21334, CY8C21534 Document History Page Document Title: CY8C21334, CY8C21534 Automotive PSoC® Programmable System-on-Chip™ Document Number: 001-12550 Rev. ECN No. Orig. of Change Submission Date ** 646436 HMT See ECN New silicon and document (Revision **) *A 2526170 PYRS 07/03/08 Corrected ordering information, Converted from Preliminary to Final. *B 2618175 OGNE / PYRS 12/09/08 Added Note in Ordering Information section. Changed Title from PSoC® Mixed-Signal Array to PSoC® Programmable System-on-Chip™ Updated ‘Development Tools’ and ‘Designing with PSoC Designer’ sections on pages 5 and 6 *C 2714723 BTK / AESA 06/04/09 Updated Getting Started section. Replaced Designing with User Modules section with Designing with PSoC Designer section. Updated Features list and PSoC Functional Overview section. Updated some AC Specification values to conform to a ±5% accurate IMO (no order of magnitude changes). Added a note to I2C specifications section to clarify the I2C SysClk dependency. Added the Development Tool Selection section. Deleted some inapplicable or redundant information. Changed the title. Updated the PDF Bookmarks. Fixed FIMO6, TRSCLK, and TFSCLK specifications to be correct. *D 2822792 BTK / AESA 12/07/2009 Added TPRGH, TPRGC, IOL, IOH, F32KU, DCILO, and TPOWERUP electrical specifications. Updated the footnotes for Table 11, “DC Programming Specifications,” on page 17. Added maximum values and updated typical values for TERASEB and TWRITE electrical specifications. Replaced TRAMP electrical specification with SRPOWERUP electrical specification. Added “Sales, Solutions, and Legal Information” on page 39. This revision fixes CDT 63984. *E 2888007 NJF 03/30/2010 Updated Cypress website links. Updated Designing with PSoC Designer. Added TBAKETEMP and TBAKETIME parameters in Absolute Maximum Ratings. Removed the following sections: DC Low Power Comparator Specifications, AC Analog Mux Bus Specifications, AC Low Power Comparator Specifications, Third Party Tools, and Build a PSoC Emulator into your Board. Updated links in Sales, Solutions, and Legal Information. *F 3023789 BTK / AESA 09/06/2010 Conversion to new datasheet editing system. Merged the 5 V and 3.3 V operational amplifier electrical specifications into the Table 8 (with no changes to data). Updated datasheet as per Cypress Style guide and new datasheet template. Description of Change *G 3094401 BTK 11/23/2010 Added tape and reel packaging information. Refer to CDT 88767. *H 3157921 BTK / NJF 01/31/2011 Updated I2C timing diagram to improve clarity (CDT 92817). Updated wording, formatting, and notes of the AC Digital Block Specifications table to improve clarify (CDT 92819). Added VDDP, VDDLV, and VDDHV electrical specifications to give more information for programming the device (CDT 92822). Updated solder reflow temperature specifications to give more clarity (CDT 92828). Updated the jitter specifications (CDT 92831). Updated PSoC Device Characteristics table (CDT 92832). Updated the F32KU electrical specification (CDT 92994). Updated DC POR and LVD Specifications to add specs for all POR levels (CDT 86716). Updated note for RPD electrical specification (CDT 90944). Updated Reference Information Section. Package diagram spec 51-51100 revised from *A to *B. *I 3157903 BTK 04/05/2011 Updated solder reflow specifications (CDT 92828). Document Number: 001-12550 Rev. *J Page 37 of 39 CY8C21334, CY8C21534 Document History Page (continued) Document Title: CY8C21334, CY8C21534 Automotive PSoC® Programmable System-on-Chip™ Document Number: 001-12550 Rev. ECN No. Orig. of Change Submission Date *J 4200952 JICG 11/29/2013 Description of Change Updated Electrical Specifications: Updated Figure 5. Updated Packaging Information: Updated Packaging Dimensions: spec 51-85077 – Changed revision from *D to *E. spec 51-85079 – Changed revision from *D to *E. Updated Tape and Reel Information: spec 51-51101 – Changed revision from *A to *C. spec 51-51100 – Changed revision from *B to *C. Updated Development Tool Selection: Updated Device Programmers: Renamed the heading “CY3210-MiniProg1” as CY3217-MiniProg1 and updated the same section. Removed the section “CY3207ISSP In-System Serial Programmer (ISSP)”. Updated in new template. Completing Sunset Review. Document Number: 001-12550 Rev. *J Page 38 of 39 CY8C21334, CY8C21534 Sales, Solutions, and Legal Information Worldwide Sales and Design Support Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office closest to you, visit us at Cypress Locations. PSoC® Solutions Products Automotive Clocks & Buffers Interface Lighting & Power Control cypress.com/go/automotive cypress.com/go/clocks cypress.com/go/interface cypress.com/go/powerpsoc psoc.cypress.com/solutions PSoC 1 | PSoC 3 | PSoC 4 | PSoC 5LP Cypress Developer Community Community | Forums | Blogs | Video | Training cypress.com/go/plc Memory cypress.com/go/memory PSoC Touch Sensing cypress.com/go/psoc cypress.com/go/support cypress.com/go/touch USB Controllers Wireless/RF Technical Support cypress.com/go/USB cypress.com/go/wireless © Cypress Semiconductor Corporation, 2007-2013. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. 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Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Use may be limited by and subject to the applicable Cypress software license agreement. Document Number: 001-12550 Rev. *J Revised November 29, 2013 Page 39 of 39 PSoC Designer™ and Programmable System-on-Chip™ are trademarks and PSoC® and CapSense® are registered trademarks of Cypress Semiconductor Corporation. Purchase of I2C components from Cypress or one of its sublicensed Associated Companies conveys a license under the Philips I2C Patent Rights to use these components in an I2C system, provided that the system conforms to the I2C Standard Specification as defined by Philips. As from October 1st, 2006 Philips Semiconductors has a new trade name - NXP Semiconductors. All products and company names mentioned in this document may be the trademarks of their respective holders.